DSPIC33EV128GM002-I/MM - 16-Bit 70 MIPS 5V DSC | Microchip
Référence : DSPIC33EV128GM002-I/MM ✓ Actif| Qté | Prix unitaire | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
DSPIC33EV128GM002-I/MM Présentation
A digital signal controller combines the computational power of a DSP with the peripheral integration and deterministic control of a microcontroller. Within the power management hierarchy, a DSC sits between general-purpose MCUs and dedicated DSPs, making it the preferred choice for closed-loop motor control and power conversion where both fast math execution and rich analog peripherals are required on a single chip.
Key differentiating features include the 5V-tolerant, wide 4.5V to 5.5V supply range that provides superior noise immunity in harsh electrical environments, Error Correcting Code (ECC) Flash for high-reliability operation, Peripheral Pin Select (PPS) for flexible pin mapping, and a SENT peripheral for automotive sensor interfaces. The integrated op amps reduce external component count in current-sense and filter circuits.
Architecturally, the dsPIC33E core pairs a 16-bit MCU pipeline with DSP multiply-accumulate instructions operating at 70 MIPS, supported by dual address generators and a hardware divide. Clock generation via internal PLL allows operation up to the family maximum, and the JLCPCB-listed operating clock is 60 MHz for this device grade.
Typical applications include brushed and brushless DC motor control in appliances, automotive sensor and control units, digital power supplies, and industrial automation nodes operating in noisy environments.
When designing with this device, take advantage of the exposed thermal pad on the QFN-28 package for grounding and heat dissipation, and budget the 8 KB of RAM carefully since DMA buffers for motor control consume it quickly.
This page synthesizes distributor data, same-family drop-in alternatives, and practical design guidance beyond what the standard datasheet summary provides.
Alternatives de remplacement direct pour DSPIC33EV128GM002-I/MM — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EV128GM002-I/MM (même facteur de forme et même empreinte) — différant par Package, Supply Voltage Range, Operating Temperature, Core Architecture, Peripheral Pin Select.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EV256GM002-I/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.1 / unité
Voir la fiche technique →DSPIC33EV64GM002-I/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.4 / unité
Voir la fiche technique →DSPIC33EV128GM002-E/MM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EV128GM002-H/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EV128GM002-I/MM Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit dsPIC33E DSC |
| Performance | 70 MIPS |
| Operating Frequency | 60 MHz |
| Flash Memory | 128 KB (43K x 24) with ECC |
| RAM | 8 KB |
| Supply Voltage Range | 4.5 V to 5.5 V |
| Nominal Supply Voltage | 5.0 V |
| PWM Channels | 6 motor-control PWM |
| Integrated Op Amps | 3 |
| CTMU | Charge Time Measurement Unit, yes |
| SENT Peripheral | Yes (automotive sensor interface) |
| Peripheral Pin Select | Yes (PPS, remappable RPn/RPIn pins) |
| Température de fonctionnement | -40C to +85C (I grade) |
| Boîtier | 28-QFN-S Exposed Pad (6x6x0.9 mm) |
| Type de montage | Surface Mount |
| Packaging | Tube |
| Statut RoHS | Compliant |
| Functional Safety Support | Yes (FuSa variant supported) |
Guide de configuration des broches du DSPIC33EV128GM002-I/MM 28-qfn-s exposed pad (6x6x0.9 mm)
Configuration des broches du DSPIC33EV128GM002-I/MM (boîtier 28-qfn-s exposed pad (6x6x0.9 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EV128GM002-I/MM.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EV128GM002-I/MM convient pour 6 applications: BLDC / PMSM Motor Control, Automotive Sensors and Control Units, Home Appliances, Digital Power Supplies, Industrial Automation Nodes, Capacitive Touch and Measurement Systems.
BLDC / PMSM Motor Control
The DSPIC33EV128GM002-I/MM fits brushless DC and permanent-magnet synchronous motor control because its six motor-control PWM channels with complementary outputs and hardware dead-time generation directly drive three-phase inverters, while its 70 MIPS DSP core executes field-oriented control loops at multi-kHz update rates. The three on-chip op amps condition low-side shunt current measurements without external amplifiers, cutting BOM cost and improving accuracy. Placed as the main controller between a gate-driver front end and the power stage, its 5V logic gives superior noise immunity against switching transients compared to 3.3V MCUs, and the 128 KB ECC Flash safeguards control code against bit-flips in electrically noisy drive environments.
Recommandé
Automotive Sensors and Control Units
The DSPIC33EV128GM002-I/MM suits automotive sensor nodes and body control units because it integrates a dedicated SENT peripheral compliant with automotive sensor interfaces, reducing software overhead versus bit-banged implementations. Its 4.5V to 5.5V supply range tolerates automotive load-dump-regulated rails, and the CTMU enables precise capacitive or time-of-flight measurements. For extended -40C to +125C under-hood installations, the same die is available as DSPIC33EV128GM002-E/MM, allowing a single PCB design to serve both cabin and engine-bay variants. Microchip specifically positions the dsPIC33EV GM family for automotive sensors, touch, and control units operating amid noise and vibration.
Recommandé
Home Appliances
The DSPIC33EV128GM002-I/MM is ideal for appliances such as washing machines, dishwashers, fans, and compressors, where Microchip explicitly targets the dsPIC33EV family. Appliance environments combine motor switching noise, mains transients, and vibration; the device counters these with 5V noise immunity, ECC Flash for code integrity, and integrated op amps for motor current sensing. A typical design uses the six PWM channels to drive a compressor or drum motor inverter, with the CTMU and remappable analog inputs handling user-interface touch sensing. The 28-pin QFN keeps PCB area small for cost-driven appliance control boards while retaining DSP-class closed-loop performance.
Recommandé
Digital Power Supplies
The DSPIC33EV128GM002-I/MM works well as the digital controller in AC-DC and DC-DC converters, LLC resonant supplies, and power-factor-correction stages. Its 70 MIPS core executes voltage and current control loops with DSP multiply-accumulate instructions, while six PWM channels with complementary outputs and dead-time control implement phase-shifted or interleaved topologies. The 5V supply level interfaces directly with gate-driver logic common in power supplies, and ECC Flash protects control firmware in high-transient environments. The Peripheral Pin Select feature lets designers map PWM, ADC trigger, and fault inputs to optimal physical pins, simplifying layout around high-current switching nodes.
Recommandé
Industrial Automation Nodes
In factory automation, the DSPIC33EV128GM002-I/MM serves as an intelligent actuator or sensor node controller, handling closed-loop positioning, valve control, or conveyor monitoring. Its SENT interface and remappable peripherals (UART, SPI, I2C via PPS) allow one PCB design to be reconfigured in firmware for different node types, reducing SKU proliferation. The -40C to +85C industrial temperature grade, 5V robustness, and ECC Flash deliver the reliability that continuous-duty industrial equipment demands. The 8 KB RAM accommodates control loops plus communication buffers, and SEGGER and Microchip tool support shortens development time for OEM industrial platforms.
Recommandé
Capacitive Touch and Measurement Systems
The DSPIC33EV128GM002-I/MM integrates a Charge Time Measurement Unit (CTMU), a precision constant-current source used for capacitive touch sensing, time-of-flight measurement, and ratiometric resistive sensing. Combined with the CTMU, the three op amps can build precision front ends for pressure, level, or proximity sensing with minimal external components. The 128 KB ECC Flash stores calibration tables and touch-decision firmware, while the 60 MHz operating clock provides the resolution needed for high-fidelity measurements. This makes the device attractive for smart-appliance touch panels, industrial level sensors, and battery-powered measurement instrumentation where a single 5V chip must combine sensing, computation, and control outputs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EV128GM002-I/MM — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EV256GM002-I/MM | DSPIC33EV64GM002-I/MM | DSPIC33EV128GM002-E/MM | DSPIC33EV128GM104-I/ML |
|---|---|---|---|---|---|
| Package | 28-QFN-EP (6x6x0.9 mm) | 28-QFN-EP (6x6) - same | 28-QFN-EP (6x6) - same | 28-QFN-EP (6x6) - same | 44-QFN (ML) - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128 KB ECC | 256 KB ECC | 64 KB ECC | 128 KB ECC | 128 KB ECC |
| Core Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V | 4.5 V to 5.5 V |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C | -40C to +85C | -40C to +125C (E grade) | -40C to +85C |
| Key Peripherals | 6 MC PWM, 3 op amps, CTMU, SENT | 6 MC PWM, 3 op amps, CTMU, SENT | 6 MC PWM, 3 op amps, CTMU, SENT | 6 MC PWM, 3 op amps, CTMU, SENT | same peripherals, more I/O (44-pin) |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Twice the program memory for code growth (vs DSPIC33EV64GM002-I/MM)
- Extended temperature capability available on the same die (vs DSPIC33EV128GM002-E/MM)
- Best cost for firmware within 128 KB (vs DSPIC33EV256GM002-I/MM)
Notes de conception
Solder the exposed thermal pad of the 28-QFN-EP (6x6x0.9 mm) package to a via-stitched ground plane. This pad is the primary VSS connection for the die and also carries heat out; an unsoldered or poorly wetted pad is the most common cause of erratic ADC readings and hard-to-diagnose reset behavior on QFN dsPIC designs. Place at least a 3x3 via matrix under the pad and connect VSS pins 2-3 (or per datasheet pin table) to the same local ground island.
The device operates from 4.5V to 5.5V with a nominal 5.0V. Decouple VDD and AVDD independently with 0.1 uF ceramic capacitors placed within 2 mm of each pin, plus one 10 uF bulk capacitor per rail. Never exceed 5.5V - the 5V robustness of the dsPIC33EV is a family feature, not headroom for unregulated supplies. Estimated: at 100 mA typical operating current from a 5.5V rail, device dissipation is about 0.55 W, acceptable on a QFN-28-EP with a solid ground pour.
Use Peripheral Pin Select (PPS) in firmware to route PWM outputs, UART, SPI, and I2C away from the oscillator pins and toward the board edge nearest each peripheral. Keep the ICSP programming pins (MCLR, PGD, PGC - which overlap remappable RPn pins) reserved on a 5-pin header, since PGD/PGC are also used for debugging. Route the three op-amp inputs away from PWM traces; the integrated amplifiers are convenient but their inputs remain sensitive to capacitively coupled switching noise.
Budget the 8 KB RAM before enabling DMA: motor-control ADC scan buffers plus communication stacks can exhaust it quickly, and the linker error appears late in development. Also note that Flash is organized 24-bit wide (43K x 24 instruction words), so comparing 128 KB against byte-addressable MCU flash is misleading - plan code size accordingly. Choose the -E/MM grade up front if any chance exists the product will see above +85C, since the footprint is identical.
Informations de conformité
RoHS compliant per JLCPCB and DigiKey listings. The dsPIC33EV family is marketed by Microchip for automotive applications (FuSa support), but AEC-Q100 qualification status for this specific MPN was not found in the provided data.
