DSPIC33EV128GM102T-I/MM - 16-Bit 70MIPS 5V DSC | Microchip
Référence : DSPIC33EV128GM102T-I/MM ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.62 | $4,62 |
| 10 | $4.16 | $41,60 |
| 100 | $3.71 | $371,00 |
| 500 | $3.34 | $1 670,00 |
| 1 000 | $2.98 | $2 980,00 |
DSPIC33EV128GM102T-I/MM Présentation
A digital signal controller combines the computational power of a DSP with the peripheral integration and deterministic control behavior of a microcontroller. Within the power-management hierarchy of embedded systems, DSCs occupy the tier between general-purpose MCUs and dedicated DSPs, making them the standard choice for closed-loop motor control, digital power conversion, and sensor-signal-conditioning systems that need multiply-accumulate throughput plus hard real-time peripherals.
Key differentiating features include the 5V-tolerant core that directly interfaces with industrial 5V logic and automotive sensor rails without level shifting, ECC Flash that detects and corrects single-bit memory errors for functional-safety (FuSa) designs, and on-chip peripherals explicitly listed for this family: advanced PWM, SENT (SAE J2716) interface, and integrated op amps for analog front-end condensation. Four DMA channels and seven timers offload the CPU from data movement and event timing.
Architecturally, the dsPIC33EV core is built on CMOS process technology with a 16-bit modified Harvard architecture, DSP multiply-accumulate instructions, and a barrel shifter. Operating from a 5V supply, the device tolerates harsh electrical environments typical of appliances, industrial drives, and automotive modules where 3.3V-only controllers require additional protection circuitry.
Typical applications include BLDC and PMSM motor control in appliances and power tools, automotive body and powertrain auxiliary modules using SENT-connected sensors, industrial automation nodes, and digital power supplies where the complementary-output PWM and analog comparators close control loops in hardware.
For design, budget the exposed thermal pad as the primary ground return: connect it to a solid VSS pour with multiple vias to achieve both low thermal resistance and low ground inductance for the analog peripherals. The M/MM QFN pin pitch requires a fine-pitch PCB process; verify land pattern against the Microchip datasheet footprint.
This page synthesizes verified distributor data (DigiKey, Mouser, Octopart), drop-in same-family alternatives, and practical design notes not found on the manufacturer product page.
Alternatives de remplacement direct pour DSPIC33EV128GM102T-I/MM — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EV128GM102T-I/MM (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, RAM, Supply Voltage Range, Program Memory (Flash).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EV128GM102T-E/MM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EV128GM102T-H/MM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EV256GM102T-I/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EV128GM002T-I/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EV32GM102T-I/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.3 / unité
Voir la fiche technique →DSPIC33EV128GM102T-I/MM Valeurs maximales et caractéristiques électriques
| Core | dsPIC 33EV 16-bit DSC core |
| Max CPU Speed | 70 MIPS |
| Flash Memory | 128 KB (43K x 24) with ECC |
| RAM | 8 KB |
| Tension d'alimentation | 5 V |
| DMA Channels | 4 |
| Timers | 7 |
| Specialty Peripherals | PWM, SENT, Op Amps, Advanced Analog |
| Functional Safety | FuSa (Functional Safety) support |
| Technology | CMOS |
| Température de fonctionnement | -40C to +85C (I grade) |
| Boîtier | 28-QFN-S (6x6 mm) with exposed pad |
| Type de montage | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Family | dsPIC33EV128GM1 |
| Statut RoHS | unknown |
Guide de configuration des broches du DSPIC33EV128GM102T-I/MM 28-qfn-s (6x6 mm) with exposed pad
Configuration des broches du DSPIC33EV128GM102T-I/MM (boîtier 28-qfn-s (6x6 mm) with exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EV128GM102T-I/MM.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EV128GM102T-I/MM convient pour 6 applications: BLDC/PMSM Motor Control, Automotive SENT Sensor Interfaces, Digital Power Supplies, Industrial Automation Nodes, Appliance Control Boards, Analog Signal Conditioning Front Ends.
BLDC/PMSM Motor Control
The DSPIC33EV128GM102T-I/MM fits appliance and industrial motor drives because its 70 MIPS DSP core executes field-oriented control (FOC) loops at tens of kHz, while the advanced PWM peripheral produces complementary outputs with hardware dead-time insertion. The 4 DMA channels stream ADC current-shunt samples into RAM without CPU intervention, keeping loop jitter minimal, and the on-chip op amps can amplify low-level shunt signals before conversion. Running from a native 5V supply, the DSC connects directly to gate-driver logic levels common in 5V-dominated appliance designs, removing level shifters. The main trade-off is that 128KB Flash bounds the size of a full sensorless FOC plus diagnostics stack - verify code footprint before committing.
Recommandé
Automotive SENT Sensor Interfaces
In automotive auxiliary modules, the DSPIC33EV128GM102T-I/MM decodes SENT (SAE J2716) sensor streams using its dedicated SENT peripheral listed by Microchip for this family, eliminating an external receiver IC and its associated failure points. The 5V-tolerant I/O matches the rail levels of SENT sensor supplies directly, and the ECC Flash supports functional-safety (FuSa) documentation flows demanded by automotive customers. Combined with the 70 MIPS core, the part can simultaneously process multiple SENT channels and run local control loops. Designers should confirm the E-grade variant for extended under-hood ambient temperatures, since the -I grade tops out at +85C.
Recommandé
Digital Power Supplies
For digital AC-DC and DC-DC converters, the complementary PWM outputs with dead-time control, on-chip analog comparators, and op amps let the DSPIC33EV128GM102T-I/MM close voltage- and current-mode loops in hardware with microsecond-scale response. The 5V core interfaces naturally with power-stage sense dividers referenced to 5V, and the 4 DMA channels log telemetry (Vout, Iout, temperature) without disturbing the control interrupt. The 128KB ECC Flash leaves headroom for hot-swap parameter tables and fault logs. Peak-efficiency firmware benefit comes from the deterministic 70 MIPS core; the trade-off versus analog-only control is one firmware-verification cycle in your safety review.
Recommandé
Industrial Automation Nodes
In factory automation and building control nodes, the DSPIC33EV128GM102T-I/MM handles protocol handling (SENT, UART, SPI), local closed-loop control, and diagnostic logging in one 5V device rated -40C to +85C, matching industrial cabinets that still run 5V legacy logic. The 7 timers provide independent capture/compare resources for encoder and limit-switch interfaces, while the ECC Flash maintains program integrity in electrically noisy environments - a stated reason Microchip targets harsh industrial deployments for this family. The exposed-pad QFN package also improves vibration reliability versus leaded packages. Budget 8KB RAM carefully if the node buffers long message queues.
Recommandé
Appliance Control Boards
Major-appliance controllers (washers, cooktops, HVAC blowers) benefit from this DSC's combination of 5V noise immunity, 70 MIPS DSP math for sensorless motor algorithms, and integrated op amps for zero-cross and current-sense conditioning. Microchip explicitly positions the dsPIC33EV 5V family for appliances operating in harsh environments. The 128KB ECC Flash holds the full application plus OTA-style firmware update staging, and the 28-QFN exposed-pad package withstands the thermal cycling typical of appliance PCBs. The -I temperature grade suits most indoor appliance locations; verify enclosure derating near heating elements where +85C ambient may be exceeded.
Recommandé
Analog Signal Conditioning Front Ends
With on-chip op amps and advanced analog features, the DSPIC33EV128GM102T-I/MM condenses a discrete analog front end - amplifier, ADC driver, and processor - into one 28-pin device. The op amps can be configured as gain stages for RTD, strain-gauge, or current-shunt signals, feeding the internal ADC directly; the 70 MIPS core then applies digital filtering (IIR/FIR) in real time. This integration shortens the analog signal path, improving noise performance and cutting BOM count versus an external amplifier-plus-MCU stack. Keep analog routing away from PWM traces and use the exposed pad as a quiet analog ground reference for best results.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EV128GM102T-I/MM — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EV128GM102T-E/MM | DSPIC33EV128GM102T-H/MM | DSPIC33EV256GM102T-I/MM | DSPIC33EV32GM102T-I/MM |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN-S (6x6) MM | 28-QFN-S (6x6) MM - same | 28-QFN-S (6x6) MM - same | 28-QFN-S (6x6) MM - same | 28-QFN-S (6x6) MM - same |
| Flash Memory | 128 KB (43K x 24) ECC | 128 KB ECC | 128 KB ECC | 256 KB ECC | 32 KB ECC |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V |
| Temperature Grade | -40C to +85C (I) | Extended (E) grade | High-reliability (H) grade | -40C to +85C (I) | -40C to +85C (I) |
| Peripherals | PWM, SENT, Op Amps, 4 DMA, 7 timers | Identical | Identical | Identical | Identical |
| Functional Safety (FuSa) | Yes | Yes | Yes | Yes | Yes |
| Packaging | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) |
Principaux différenciateurs
- Native 5V operation eliminates level shifting (vs DSPIC33EP64MC502-E/MM)
- ECC Flash for functional-safety designs (vs DSPIC33EP64MC502-E/MM)
- More Flash at same 28-QFN footprint when upgrading (vs DSPIC33EV32GM102T-I/MM)
Notes de conception
The exposed thermal pad of the 28-QFN-S (MM) package must be soldered to a VSS plane with a 3x3 (or denser) via array. This pad is both the main heat-removal path and the ground return for the analog peripherals; leaving it unsoldered (as is common on breadboard adapters) raises junction temperature and degrades ADC/op-amp accuracy. Follow the land pattern in the Microchip datasheet exactly - the QFN pad pitch requires a solder-mask-defined pattern and approximately 50-70% stencil coverage on the center pad to prevent voiding and bridging.
The dsPIC33EV core is a 5V device, but analog performance depends on clean AVDD. Provide separate ferrite-bead-isolated AVDD (with 100 nF + 1 uF local decoupling) from the digital 5V rail, and place each VDD pin's 100 nF ceramic capacitor within 2 mm of the pin. During PWM bursts in motor-control applications, digital ground currents can inject noise into the on-chip op amps - use a single-point ground connection under the exposed pad and keep analog sense routing away from PWM traces.
The -I grade is rated to +85C ambient, not +125C: substituting the cheaper -I part into an automotive under-hood socket designed for the -E/MM variant will cause field failures at temperature extremes. Also confirm before substitution that your firmware fits the smaller-Flash variants (32KB) if cost-reducing, and remember that changing between GM102 and GM002/GM004 variants changes peripheral availability, not just memory - check the Microchip family selection tables rather than assuming pin-identity implies feature identity.
Informations de conformité
Verified web data does not include compliance status for this MPN; consult the Microchip product page environmental datasheet for RoHS/REACH confirmation.
