DSPIC33EP16GS502T-I/MM - 16-bit 70MIPS Digital Power DSC | Microchip
Référence : DSPIC33EP16GS502T-I/MM ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.9 | $3,90 |
| 10 | $3.55 | $35,50 |
| 100 | $3.25 | $325,00 |
| 500 | $2.95 | $1 475,00 |
| 1 000 | $2.75 | $2 750,00 |
DSPIC33EP16GS502T-I/MM Présentation
A digital signal controller combines the computational throughput of a DSP core with the peripheral integration and deterministic control of a microcontroller. Within the power-management hierarchy, the DSC sits above a generic MCU for closed-loop conversion tasks: it executes control-loop mathematics (PID, 3p3z compensation) at switching frequencies reaching hundreds of kilohertz, while dedicated analog and timing peripherals offload the CPU. The dsPIC33EP family is Microchip's 16-bit DSC generation designed specifically for digital power and conversion applications.
Key features of the GS502 variant include interconnected high-speed PWM modules with individual duty-cycle, phase and dead-time resolution down to sub-nanosecond steps for LLC and phase-shifted topologies; a high-speed 10-bit ADC with multiple sample-and-hold modules able to trigger synchronously from the PWM; on-chip programmable gain amplifiers (PGA) and high-speed comparators that close current-mode loops in hardware; and DSP engine instructions (MAC, DSP multiply) for fast loop execution.
Architecturally, the device runs a modified Harvard 16-bit core at up to 70 MIPS from an internal PLL, with interrupt latency low enough for per-cycle current sampling. The GS50x subfamily adds peripheral interconnection (PWM-to-ADC-to-comparator crossbars) that reduces software intervention in the control path.
Typical applications include interleaved power factor correction (Microchip's 350 W interleaved PFC reference design uses this family), zero-voltage-switching full-bridge AC-DC converters such as Microchip's 750 W reference design, and digital lighting or telecom power supplies.
Design consideration: the 'T' suffix denotes tape-and-reel supply and the 'I' grade specifies -40C to +85C operation; verify the QFN exposed pad is well grounded for thermal and EMC performance.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP16GS502T-I/MM — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP16GS502T-I/MM (même facteur de forme et même empreinte) — différant par Package, Packaging, Mounting Type, Operating Temperature, Analog Peripherals.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP16GS502T-E/MM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP32GS502T-I/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.85 / unité
Voir la fiche technique →DSPIC33EP64GS502T-I/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP128MC202T-E/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.41 / unité
Voir la fiche technique →DSPIC33EP16GS502T-I/MM Valeurs maximales et caractéristiques électriques
| Core | 16-bit dsPIC33EP DSC |
| Maximum CPU Speed | 70 MIPS |
| Flash Memory | 16 KB (16K x 8) |
| RAM | 2 KB |
| Tension d'alimentation | 3.0 V to 3.6 V (3.3 V nominal) |
| Température de fonctionnement | -40C to +85C (I grade) |
| Boîtier | 28-QFN-S (6x6 mm) with exposed pad |
| Type de montage | Surface Mount |
| PWM | High-speed PWM for digital power |
| ADC | High-speed 10-bit ADC with multiple S/H |
| Analog Peripherals | PGA and high-speed comparators |
| Application Focus | Digital power (SMPS, PFC, LLC) |
| Packaging | Tape and Reel (T suffix) |
| Family | dsPIC33EP16GS502 (GS50x digital power subfamily) |
| Functional Safety | FuSa-classified variant family (per DigiKey) |
Configuration des broches de DSPIC33EP16GS502T-I/MM
| Broche 1 | MCLR — Master clear reset / programming voltage input |
| Broche 2 | AN0/CN0/RB0 — Analog input 0 / change notification / port B bit 0 |
| Broche 3 | AN1/CN1/RB1 — Analog input 1 / change notification / port B bit 1 |
| Broche 4 | AN2/CN2/RB2 — Analog input 2 / change notification / port B bit 2 |
| Broche 5 | AN3/CN3/RB3 — Analog input 3 / change notification / port B bit 3 |
| Broche 6 | VSS — Ground reference |
| Broche 7 | VDD — Positive supply (3.0 V to 3.6 V) |
| Broche 8 | OSC1/CLKI/RA2 — Oscillator input / external clock input |
| Broche 9 | OSC2/CLKO/RA3 — Oscillator output / clock output |
| Broche 10 | AN4/CN4/RB4 — Analog input 4 / change notification / port B bit 4 |
| Broche 11 | AN5/CN5/RB5 — Analog input 5 / change notification / port B bit 5 |
| Broche 12 | PGD/EMUD1/RB6 — In-circuit serial programming data / emulator data |
| Broche 13 | PGC/EMUC1/RB7 — In-circuit serial programming clock / emulator clock |
| Broche 14 | VSS — Ground reference |
| Broche 15 | AN6/CN6/RB8 — Analog input 6 / change notification / port B bit 8 |
| Broche 16 | AN7/CN7/RB9 — Analog input 7 / change notification / port B bit 9 |
| Broche 17 | AN8/RB10 — Analog input 8 / port B bit 10 |
| Broche 18 | AN9/RB11 — Analog input 9 / port B bit 11 |
| Broche 19 | AN10/RB12 — Analog input 10 / port B bit 12 |
| Broche 20 | AN11/RB13 — Analog input 11 / port B bit 13 |
| Broche 21 | AN12/RB14 — Analog input 12 / port B bit 14 |
| Broche 22 | AN13/RB15 — Analog input 13 / port B bit 15 |
| Broche 23 | VDD — Positive supply (3.0 V to 3.6 V) |
| Broche 24 | AVSS — Analog ground reference |
| Broche 25 | AVDD — Analog supply (3.0 V to 3.6 V) |
| Broche 26 | RA0/PGD3 — Port A bit 0 / alternate programming data |
| Broche 27 | RA1/PGC3 — Port A bit 1 / alternate programming clock |
| Broche 28 | VCAP/VDDCORE — CPU core voltage regulator capacitor connection |
Applications typiques
DSPIC33EP16GS502T-I/MM convient pour 6 applications: Interleaved Power Factor Correction, ZVS Full-Bridge AC-DC Converters, Digital Lighting Power Supplies, Telecom and Server DC-DC Power, Solar Micro-Inverters and Power Optimizers, Digital Control of Uninterruptible Power Supplies.
Interleaved Power Factor Correction
The Microchip 350 W interleaved PFC reference design is built on the dsPIC33EP16GS50x family, demonstrating universal AC input producing a high-voltage DC output. The DSPIC33EP16GS502T-I/MM's interconnected high-speed PWM generates two interleaved phases with precise phase offset, while the high-speed 10-bit ADC samples inductor currents synchronously with PWM switching events. The on-chip comparators provide hardware cycle-by-cycle overcurrent protection with no CPU latency, and the 70 MIPS DSP core executes the average-current-mode compensation loop. Running the control loop in firmware at these speeds eliminates analog control ICs and allows adaptive gain across the universal input range.
Recommandé
ZVS Full-Bridge AC-DC Converters
Microchip's 750 W AC-DC reference design uses a semi-bridgeless PFC followed by a peak-current-controlled zero-voltage-switching full-bridge with digital slope compensation, implemented on the dsPIC33EP16GS50x family. The DSPIC33EP16GS502T-I/MM generates four PWM outputs with sub-nanosecond dead-time resolution to prevent bridge shoot-through, and its PGA plus comparators close the peak current loop in hardware for fast fault response. Digital slope compensation is applied in firmware, enabling very high conversion efficiency without analog slope circuitry. The 16 KB Flash is sufficient for the full PFC plus phase-shift control firmware in this topology.
Recommandé
Digital Lighting Power Supplies
LED drivers and HID electronic ballasts require constant-current regulation with fast transient response and dimming interfaces, which the DSPIC33EP16GS502T-I/MM addresses with its high-speed PWM and on-chip comparators. The PWM modules support multi-channel output for multi-string LED drivers with independent dimming resolution, while the ADC triggered synchronously from the PWM measures output current ripples at optimal instants, minimizing measurement noise. Firmware-based control allows DALI or 0-10 V dimming protocols to run on the same 70 MIPS core. The -40C to +85C I-grade suits outdoor luminaire environments.
Recommandé
Telecom and Server DC-DC Power
Intermediate bus converters and point-of-load digital power in telecom rectifiers benefit from the DSPIC33EP16GS502T-I/MM's ability to run voltage-mode or current-mode control loops at hundreds of kilohertz switching frequency. The 3.0 V to 3.6 V supply matches standard 3.3 V bias rails, and the exposed-pad 28-QFN 6x6 mm package provides low-inductance grounding essential for gate-drive signal integrity. PMBus-style telemetry and fault logging run in firmware, replacing supervisory ICs. Designers needing larger firmware (more topology options) can drop in the pin-compatible 32 KB or 64 KB GS502 variants without PCB change.
Recommandé
Solar Micro-Inverters and Power Optimizers
Panel-level power electronics combine MPPT algorithms with grid-tied inverter control, a workload the DSPIC33EP16GS502T-I/MM handles with its DSP multiply-accumulate instructions for fast MPPT iteration and its high-speed PWM for the inverter stage. Synchronous ADC sampling captures panel voltage/current at PWM-locked instants, avoiding switching-noise corruption in the MPPT measurement. The 28-pin QFN keeps board area minimal for enclosure-constrained optimizer housings, and the industrial temperature grade covers rooftop environments. The FuSa (functional safety) classification of this device family additionally supports safety-relevant power conversion architectures.
Recommandé
Digital Control of Uninterruptible Power Supplies
UPS systems require coordinated PFC, inverter and battery-charger control with rapid mode transitions between mains and battery operation. The DSPIC33EP16GS502T-I/MM manages one such conversion stage per DSC, using hardware comparators for instantaneous overcurrent shutdown during transfer events and the 70 MIPS core for inverter voltage-loop regulation. Firmware-implemented control enables adaptive transfer strategies impossible with fixed analog control, improving output THD. Extended-temperature variants (DSPIC33EP16GS502T-E/MM) are drop-in upgrades for high-temperature UPS cabinets, and the common footprint supports a single PCB platform across product power tiers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP16GS502T-I/MM — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP16GS502T-E/MM | DSPIC33EP32GS502T-I/MM | DSPIC33EP64GS502T-I/MM | DSPIC33EP128MC202T-E/MM |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 16 KB | 16 KB | 32 KB | 64 KB | 128 KB |
| Subfamily / Peripheral Set | GS (digital power): HS PWM, PGA, comparators | GS - identical | GS - identical | GS - identical | MC (motor control) PWM set |
| Temperature Range | -40C to +85C (I) | Extended (E grade) | -40C to +85C (I) | -40C to +85C (I) | Extended (E grade) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
Principaux différenciateurs
- Purpose-built digital power peripherals (vs DSPIC33EP128MC202T-E/MM)
- Extended temperature drop-in option (vs DSPIC33EP16GS502T-E/MM)
- Lowest-memory (lowest-cost) GS50x entry point (vs DSPIC33EP64GS502T-I/MM)
Notes de conception
The exposed pad of the 28-QFN-S (6x6 mm) package is the primary ground return for the digital power peripherals and must be soldered to a solid ground pour with an array of thermal vias. In SMPS layouts, keep the VDD/AVDD decoupling network (100 nF plus 4.7-10 uF per Microchip layout guidelines) within 2 mm of the pins, and separate the analog ground region under AVSS from the power-stage ground to keep PWM switching noise out of the ADC front end.
Power the core regulator output pin (VCAP/VDDCORE) with the datasheet-specified low-ESR capacitor; omitting or underrating it causes brown-out resets under 70 MIPS load transients. Split the digital and analog supplies with a ferrite bead or RC filter between VDD and AVDD, since the high-speed ADC PGA resolution depends on a quiet AVDD rail. Estimated: at 70 MIPS the device core draws tens of milliamps - budget headroom in the 3.3 V rail accordingly.
Verify the temperature grade before layout sign-off: the 'I' part is -40C to +85C, and power-supply enclosures frequently exceed this. If extended ambient is possible, substitute DSPIC33EP16GS502T-E/MM on the same footprint. Also confirm the 'T' tape-and-reel suffix matches your assembly line feeders - cut-tape quantities ship differently. Finally, ICSP programming requires clean access to MCLR, PGD and PGC; do not load these pins heavily in the power stage circuitry.
Route the high-speed PWM outputs to gate drivers on short, matched traces and keep them away from the ADC analog inputs (ANx pins) to minimize capacitive coupling of switching edges into sampled currents. Use synchronous sampling triggered from the PWM module rather than free-running ADC conversion - this is the whole point of the GS subfamily interconnect and dramatically reduces switching-noise error in current measurements.
Informations de conformité
Microchip standard dsPIC33EP parts in QFN packaging are RoHS-compliant/lead-free per manufacturer policy and DigiKey catalog classification; formal REACH and conflict-minerals declarations were not present in retrieved data - request Microchip material declarations for certification evidence.
