DSPIC33EV64GM102-E/SO - 16-bit 60 MIPS 5V DSC | Microchip
Référence : DSPIC33EV64GM102-E/SO ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.1 | $4,10 |
| 10 | $3.74 | $37,40 |
| 100 | $3.45 | $345,00 |
| 500 | $3.15 | $1 575,00 |
| 1 000 | $2.9 | $2 900,00 |
DSPIC33EV64GM102-E/SO Présentation
A digital signal controller combines the computational architecture of a digital signal processor - hardware multiply-accumulate, barrel shifter, DSP instruction set - with the peripheral integration and deterministic control flow of a microcontroller. Within the power-management hierarchy, the dsPIC33EV family sits in the 16-bit MCU/DSC segment of the broader microcontroller and semiconductor taxonomy, targeting real-time embedded control rather than general-purpose computing.
Key features include a 16-bit dsPIC33E core with DSP engine, 64KB of ECC-protected Flash for functional-safety (FuSa) oriented designs, on-chip CAN 2.0B for automotive and industrial networks, six motor-control PWM channels for three-phase inverter drive, three integrated operational amplifiers that offload external analog front-end stages, a Charge Time Measurement Unit (CTMU) for capacitive touch and time-of-flight measurement, and a SENT peripheral for automotive sensor interfaces. The 5V supply rating eliminates level shifting in noisy 12V/24V industrial and automotive environments.
The enhanced architecture provides multiple internal buses for simultaneous instruction fetch and data access, supporting single-cycle MAC operations critical for digital filtering, sensor fusion, and field-oriented motor control. Deep sleep and low-power modes support battery-backed nodes.
Typical applications include brushless DC and PMSM motor drives, automotive body and powertrain adjunct modules using CAN and SENT, and harsh-environment appliance control where 5V noise immunity and extended temperature range are required.
When designing, remember the 64KB Flash limit versus 128KB/256KB family members, and confirm op-amp configuration registers are initialized before enabling analog peripherals.
This page synthesizes verified distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EV64GM102-E/SO — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EV64GM102-E/SO (même facteur de forme et même empreinte) — différant par Package, RAM, Core Architecture, Operating Temperature, Flash Program Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EV64GM002-E/SO
✅ Remplacement direct✓ En stock
$3.2 / unité
Voir la fiche technique →DSPIC33EV256GM002-E/SO
✅ Remplacement direct✓ En stock
$7.18 / unité
Voir la fiche technique →DSPIC33EV32GM102-I/SO
✅ Remplacement direct✓ En stock
$2.35 / unité
Voir la fiche technique →DSPIC33EV64GM102T-E/SO
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EV64GM102-E/SO Valeurs maximales et caractéristiques électriques
| Core | dsPIC33E 16-bit |
| Performance | 60 MIPS (DigiKey listing) |
| Core Class | 5V 70 MIPS dsPIC DSC core (Microchip family description) |
| Program Memory | 64 KB (22K x 24) ECC Flash |
| RAM | 8 KB |
| Tension d'alimentation | 5 V |
| Boîtier | 28-SOIC (0.295 in, 7.50 mm width) |
| Température de fonctionnement | -40C to +125C (E suffix) |
| CAN | CAN 2.0B controller |
| PWM | 6-channel Motor Control PWM |
| Op Amps | 3 on-chip operational amplifiers |
| CTMU | Charge Time Measurement Unit |
| SENT | SENT peripheral (automotive sensor interface) |
| Type de montage | Surface Mount |
| Functional Safety | FuSa-supported (DigiKey listing) |
| Program Memory Width | 24-bit instruction word (22K x 24 Flash) |
Guide de configuration des broches du DSPIC33EV64GM102-E/SO 28-soic (0.295 in, 7.50 mm width)
Configuration des broches du DSPIC33EV64GM102-E/SO (boîtier 28-soic (0.295 in, 7.50 mm width)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EV64GM102-E/SO.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EV64GM102-E/SO convient pour 6 applications: BLDC / PMSM Motor Control, Automotive Body and Sensor Modules, Industrial Appliance Control, Capacitive Touch and CTMU Sensing, Digital Power Conversion, Sensor Fusion and Data Acquisition Nodes.
BLDC / PMSM Motor Control
The DSPIC33EV64GM102-E/SO fits three-phase BLDC and PMSM drives through its six motor-control PWM channels and DSP core capable of 60 MIPS, enabling field-oriented control loops at multi-kHz rates. The three integrated op amps amplify current-shunt signals directly, removing external amplifier stages and their offset/matching errors. Combined with the 12-bit ADC in a FOC implementation, the DSC closes current and speed loops with deterministic latency. Place shunt amplifiers using the on-chip op amps with gain set via register configuration, and use the complementary PWM outputs for gate drive of a 3-phase inverter; the 5V I/O rails interface cleanly with typical gate-driver thresholds in industrial 24V systems.
Recommandé
Automotive Body and Sensor Modules
The DSPIC33EV64GM102-E/SO targets automotive modules through its CAN 2.0B controller, SENT interface, and -40C to +125C extended temperature rating, matching under-hood-adjacent and interior module requirements. The SENT peripheral decodes SAE J2716-style sensor streams, while CAN 2.0B handles network communication with standard and extended identifiers. The ECC Flash protects program memory integrity in electrically noisy vehicle environments, supporting functional-safety-oriented designs. Typical implementations include LIN/CAN gateway adjuncts, wiper and pump controllers, and rotary-switch sensing using the CTMU. The 5V-tolerant I/O eliminates level-shifting against legacy 5V automotive sensors, reducing component count and failure points in harsh vibration and thermal cycling conditions.
Recommandé
Industrial Appliance Control
The DSPIC33EV64GM102-E/SO is explicitly positioned by Microchip for harsh-environment appliances such as dishwashers, cooktops, and HVAC blowers, where 5V logic noise immunity outperforms 3.3V MCUs near relay and triac switching. The six PWM channels drive induction-cooktop power stages or universal-motor triacs with synchronized ADC sampling, and the three on-chip op amps condition NTC thermistor and current-feedback signals without external amplifiers. The -40C to +125C rating tolerates enclosure hot spots near motor windings. ECC Flash maintains firmware integrity across mains-borne transient events typical of appliance line connections, and CTMU-based capacitive touch enables sealed-panel user interfaces without mechanical switches.
Recommandé
Capacitive Touch and CTMU Sensing
The Charge Time Measurement Unit on the DSPIC33EV64GM102-E/SO measures capacitance changes with sub-picofarad resolution, enabling capacitive touch buttons, sliders, and liquid-level sensing on sealed product panels. The CTMU works with the on-chip comparator and op amp resources to build charge-based measurement channels without a dedicated touch controller. Appliance and automotive panels benefit from the extended -40C to +125C range and ECC Flash for persisting calibration data. In a typical design, sense pads connect to CTMU-capable port pins with guard traces, and software oversampling plus temperature compensation maintains sensitivity across humidity conditions; the 5V core provides higher signal swing than 3.3V touch MCUs, improving SNR on long traces.
Recommandé
Digital Power Conversion
The DSPIC33EV64GM102-E/SO serves digitally controlled AC-DC and DC-DC converters where its 60 MIPS core, high-resolution PWM, and synchronized 12-bit ADC close voltage and current loops in software. Typical topologies include LLC half-bridge, phase-shifted full bridge, and PFC stages, with the six PWM channels providing complementary outputs, dead-time insertion, and fault shutdown. The DSP MAC instructions implement compensator difference equations cycle-by-cycle with deterministic execution, unlike software-timed 32-bit MCU solutions. ECC Flash guards control firmware against corruption during high-dV/dt switching events, and the 5V I/O interfaces directly with gate-driver logic thresholds. The -40C to +125C grade supports fanless telecom rectifier and industrial power-supply enclosures.
Recommandé
Sensor Fusion and Data Acquisition Nodes
The DSPIC33EV64GM102-E/SO fits distributed industrial DAQ nodes that filter and pre-process analog data before CAN transmission. The DSP engine executes FIR/IIR filtering at 60 MIPS with single-cycle MAC operations, while three on-chip op amps amplify sensor outputs (strain gauges, pressure bridges, current shunts) ahead of the 12-bit ADC. The CTMU adds precision timing measurement for ultrasonic or resistance-based sensors. ECC Flash and the FuSa orientation support functional-safety-relevant measurement chains. The 5V rail simplifies integration with legacy industrial sensor outputs that swing near rail-to-rail, and the -40C to +125C rating allows mounting directly on machinery rather than in climate-controlled cabinets, shortening analog front-end runs and improving noise performance.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EV64GM102-E/SO — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EV64GM002-E/SO | DSPIC33EV256GM002-E/SO | DSPIC33EV32GM102-I/SO |
|---|---|---|---|---|
| Package | 28-SOIC (7.50mm) | 28-SOIC (7.50mm) - same | 28-SOIC (7.50mm) - same | 28-SOIC (7.50mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 64 KB ECC | 32 KB ECC | 256 KB ECC | 32 KB ECC |
| RAM | 8 KB | 4 KB | 16 KB | 8 KB |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +85C |
| Peripherals (CAN / PWM / Op Amps) | CAN, 6 MC PWM, 3 op amps, CTMU, SENT | CAN, 6 MC PWM, 3 op amps, CTMU, SENT | CAN, 6 MC PWM, 3 op amps, CTMU, SENT | CAN, 6 MC PWM, 3 op amps, CTMU, SENT |
Principaux différenciateurs
- Double the Flash and RAM versus the cost-optimized variant (vs DSPIC33EV64GM002-E/SO)
- Extended -40C to +125C temperature grade (vs DSPIC33EV32GM102-I/SO)
- Memory-efficient cost point versus the 256KB flagship (vs DSPIC33EV256GM002-E/SO)
Notes de conception
The GM102 64KB Flash is the second-smallest memory point in the 28-pin dsPIC33EV family. C code with full CAN stacks, SENT drivers, and FOC compensators can approach 40-48KB quickly; if OTA updates or parameter logging are planned, select DSPIC33EV256GM002-E/SO from the start - it is pin-to-pin compatible, so the PCB never changes.
The dsPIC33EV core runs from a 5V supply with internal regulators; place a 0.1uF ceramic on every VDD pin pair plus 4.7-10uF bulk per the family data sheet power section. The three on-chip op amps share analog supply domains - keep AVDD filtered with an RC (e.g., ferrite + 1uF) from digital VDD to preserve op amp offset and ADC accuracy in motor-drive environments.
Route motor-control PWM pairs away from the analog op-amp inputs and CTMU sense lines; synchronize ADC sampling to the PWM period boundary using the ADC trigger from the PWM module rather than free-running sampling, which eliminates torque-ripple-inducing jitter in FOC loops. MCLR must be pulled up (4.7k-10k) for ICSP programming access even in production boards.
Informations de conformité
Compliance data was not present in the retrieved web data. The E-temperature dsPIC33EV family is positioned by Microchip for automotive and harsh industrial applications; verify RoHS/REACH status on the Microchip product page before specification.
