DSPIC33FJ64GP708A-I/PT - 16-bit 40 MIPS DSC 64KB Flash | Microchip
Référence : DSPIC33FJ64GP708A-I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.42 | $6,42 |
| 10 | $5.78 | $57,80 |
| 100 | $5.12 | $512,00 |
| 500 | $4.65 | $2 325,00 |
| 1 000 | $4.18 | $4 180,00 |
DSPIC33FJ64GP708A-I/PT Présentation
A Digital Signal Controller blends the control peripherals of a microcontroller with the math acceleration of a DSP in a single chip. Within the power-management hierarchy of embedded processors, the dsPIC33FJ family sits between basic 16-bit MCUs (PIC24) and dedicated DSPs, offering DSP engine instructions, a hardware MAC, and seamless migration paths to PIC24H MCUs and dsPIC30F DSCs.
Key features include 40 MIPS core performance, 64 KB flash with self-programming capability, 16 KB SRAM, dual 4-wire SPI ports, two I2C ports, two UARTs, up to eight input capture and eight output compare channels, and a 5V-tolerant digital I/O structure. The A revision improves flash endurance and reliability over the original dsPIC33FJ64GP708.
Technically, the modified Harvard architecture executes most instructions in a single cycle, while the DSP engine performs single-cycle MAC with dual data fetch, 40-bit wide accumulators, and barrel shifting. Two 3-wire 16-bit program/ICSP interfaces (PGECx/PGEDx pairs) enable in-circuit debugging and programming via MPLAB ICD 3, REAL ICE, PICkit 3, or MPLAB Snap.
Typical applications include digital power supplies and PFC loops, motor control (BLDC, PMSM, induction), LED lighting drivers, and sensor acquisition systems. The 85-C industrial temperature range (I grade) covers most factory environments.
Design tip: all VDD/VSS pairs must be decoupled with 0.1 uF ceramics, and the VCAP/VDDCORE pin requires a low-ESR 10 uF capacitor plus a 0.1 uF bypass - omitting this is the most common bring-up failure.
This page synthesizes distributor pricing, verified drop-in alternatives, pinout data, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33FJ64GP708A-I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33FJ64GP708A-I/PT (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Core Architecture, Packaging, Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33FJ128GP708A-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$11.8 / unité
Voir la fiche technique →DSPIC33FJ256GP708A-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33FJ32GP708A-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33FJ64GP708A-E/PT
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →DSPIC33FJ64GP708-I/PT
✅ Remplacement direct✓ En stock
$6.35 / unité
Voir la fiche technique →DSPIC33FJ64GP708A-I/PT Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit modified Harvard (DSC) |
| Core Speed | 40 MIPS |
| Program Memory (Flash) | 64 KB (22 Kwords) |
| SRAM | 16 KB |
| Operating Voltage | 3.0 V to 3.6 V |
| Température de fonctionnement | -40C to +85C (I grade) |
| Boîtier | 80-pin TQFP (PT), 12 x 12 mm |
| Type de montage | Surface Mount |
| I/O Pins | Up to 66 digital I/O |
| ADC | 10-bit, 1.1 Msps, multi-channel |
| UART | 2 |
| SPI | 2 (4-wire) |
| I2C | 2 |
| Input Capture / Output Compare | 8 IC / 8 OC |
| Timers | Type A and Type B 16-bit timers |
| Debug/Programming | ICSP via PGECx/PGEDx pairs, 2-wire |
| DSP Engine | Single-cycle MAC, dual 40-bit accumulators |
| Supply Class | 3.3 V |
Configuration des broches de DSPIC33FJ64GP708A-I/PT
| Broche 1 | AN0/VREF+/CN2/RB0 — Analog input 0 / positive voltage reference / change notification / port B |
| Broche 2 | AN1/VREF-/CN3/RB1 — Analog input 1 / negative voltage reference / change notification / port B |
| Broche 3 | AN2/SS1/CN4/RB2 — Analog input 2 / SPI1 slave select / port B |
| Broche 4 | AN3/INDX/CN5/RB3 — Analog input 3 / QEA index input / port B |
| Broche 5 | AN4/QEA/IC7/CN6/RB4 — Analog input 4 / QEA encoder / input capture 7 / port B |
| Broche 6 | AN5/QEB/IC8/CN7/RB5 — Analog input 5 / QEB encoder / input capture 8 / port B |
| Broche 7 | AN6/OCFA/RB6 — Analog input 6 / output compare fault A / port B |
| Broche 7 | AN6/OCFA/RB6 — Analog input 6 / output compare fault A / port B |
| Broche 8 | AN7/PGD/RB7 — Analog input 7 / programming data / port B |
| Broche 9 | AN8/PGC/RB8 — Analog input 8 / programming clock / port B |
| Broche 10 | AN9/RB9 — Analog input 9 / port B |
| Broche 11 | VDD — Power supply 3.3V |
| Broche 12 | VSS — Ground reference |
| Broche 13 | AN10/T2CK/RC0 — Analog input 10 / Timer2 clock / port C |
| Broche 14 | AN11/T3CK/RC1 — Analog input 11 / Timer3 clock / port C |
| Broche 15 | AN12/U1RTS/SDO2/RC2 — Analog input 12 / UART1 RTS / SPI2 data out / port C |
| Broche 16 | AN13/U1CTS/SDI2/RC3 — Analog input 13 / UART1 CTS / SPI2 data in / port C |
| Broche 17 | PGD2/AN14/SCK2/CN9/RC4 — Programming data 2 / analog input 14 / SPI2 clock / port C |
| Broche 18 | PGC2/AN15/CN10/RC5 — Programming clock 2 / analog input 15 / port C |
| Broche 19 | VDD — Power supply 3.3V |
| Broche 20 | VSS — Ground reference |
| Broche 21 | TMS/RC6 — JTAG test mode select / port C |
| Broche 22 | TCK/RC7 — JTAG test clock / port C |
| Broche 23 | TDO/SDO1/RF1 — JTAG test data out / SPI1 data out / port F |
| Broche 24 | TDI/RF2 — JTAG test data in / port F |
| Broche 25 | U1RX/RF2 — UART1 receive / port F |
| Broche 26 | U1TX/RF3 — UART1 transmit / port F |
| Broche 27 | SDA2/RF4 — I2C2 data / port F |
| Broche 28 | SCL2/RF5 — I2C2 clock / port F |
| Broche 29 | VSS — Ground reference |
| Broche 30 | VDD — Power supply 3.3V |
| Broche 31 | SDA1/RF6 — I2C1 data / port F |
| Broche 32 | SCL1/RF7 — I2C1 clock / port F |
| Broche 33 | SCK1/RF8 — SPI1 clock / port F |
| Broche 34 | U2TX/RF10 — UART2 transmit / port F |
| Broche 35 | U2RX/RF11 — UART2 receive / port F |
| Broche 36 | RF12 — General purpose I/O port F |
| Broche 37 | RF13 — General purpose I/O port F |
| Broche 38 | SDI1/RF7 — SPI1 data in / port F (remappable) |
| Broche 39 | SS1/RF6 — SPI1 slave select / port F (remappable) |
| Broche 40 | RG0 — General purpose I/O port G |
| Broche 41 | RG1 — General purpose I/O port G |
| Broche 42 | VSS — Ground reference |
| Broche 43 | VDD — Power supply 3.3V |
| Broche 44 | OC1/RD0 — Output compare 1 / port D |
| Broche 45 | OC2/RD1 — Output compare 2 / port D |
| Broche 46 | OC3/RD2 — Output compare 3 / port D |
| Broche 47 | OC4/RD3 — Output compare 4 / port D |
| Broche 48 | OC5/RD4 — Output compare 5 / port D |
| Broche 49 | OC6/RD5 — Output compare 6 / port D |
| Broche 50 | OC7/RD6 — Output compare 7 / port D |
| Broche 51 | OC8/RD7 — Output compare 8 / port D |
| Broche 52 | VSS — Ground reference |
| Broche 53 | IC1/RD8 — Input capture 1 / port D |
| Broche 54 | IC2/RD9 — Input capture 2 / port D |
| Broche 55 | IC3/RD10 — Input capture 3 / port D |
| Broche 56 | IC4/RD11 — Input capture 4 / port D |
| Broche 57 | IC5/RD12 — Input capture 5 / port D |
| Broche 58 | IC6/RD13 — Input capture 6 / port D |
| Broche 59 | RTCC/RG2 — Real-time clock alarm / port G |
| Broche 60 | RG3 — General purpose I/O port G |
| Broche 61 | PGED3/RG4 — Programming data 3 / port G |
| Broche 62 | PGEC3/RG5 — Programming clock 3 / port G |
| Broche 63 | VDD — Power supply 3.3V |
| Broche 64 | VSS — Ground reference |
| Broche 65 | MCLR — Master clear reset (active low), programming mode entry |
| Broche 66 | RA0 — General purpose I/O port A |
| Broche 67 | RA1 — General purpose I/O port A |
| Broche 68 | PGED1/AN16/CN11/RA2 — Programming data 1 / analog input 16 / port A |
| Broche 69 | PGEC1/AN17/CN12/RA3 — Programming clock 1 / analog input 17 / port A |
| Broche 70 | VCAP/VDDCORE — Core voltage regulator output - requires 10 uF low-ESR capacitor to VSS |
| Broche 71 | OSC1/CLKI/RA2 — Oscillator crystal input / external clock input |
| Broche 72 | OSC2/CLKO/RA3 — Oscillator crystal output / clock output |
| Broche 73 | RA4 — General purpose I/O port A |
| Broche 74 | RA5 — General purpose I/O port A |
| Broche 75 | ENVREG — Voltage regulator enable - tie to VDD for internal regulator or to VSS for external 3.3V core supply |
| Broche 76 | VDD — Power supply 3.3V |
| Broche 77 | VSS — Ground reference |
| Broche 78 | RA9 — General purpose I/O port A |
| Broche 79 | RA10 — General purpose I/O port A |
| Broche 80 | AVDD — Analog power supply (3.3V) for ADC |
Applications typiques
DSPIC33FJ64GP708A-I/PT convient pour 6 applications: Digital Power Supplies, BLDC / PMSM Motor Control, LED Lighting Drivers, Industrial Data Acquisition and Sensor Hubs, Audio and Signal Processing Front Ends, Embedded Control and IoT Nodes.
Digital Power Supplies
The DSPIC33FJ64GP708A-I/PT fits digital SMPS and PFC control because its 40 MIPS core executes single-cycle MAC operations that close fast voltage and current loops with deterministic latency, while the 10-bit 1.1 Msps ADC samples the power stage synchronized to the PWM cycle. In a typical topology, ADC results trigger control-loop ISR execution and output compare/PWM peripherals drive the MOSFET gate stage, giving cycle-by-cycle current limiting in firmware. Because the entire 80-pin device runs from a 3.3V rail with 5V-tolerant inputs, it interfaces directly with common gate drivers and feedback dividers. The 64 KB flash accommodates multi-mode control (CCM, DCM, burst) plus compensation and fault management without external memory.
Recommandé
BLDC / PMSM Motor Control
For motor drives, the DSPIC33FJ64GP708A-I/PT provides eight output compare channels for six-step or sinusoidal commutation and eight input capture channels for hall-sensor or encoder feedback. The DSP engine executes Clarke and Park transforms for field-oriented control with single-cycle MAC throughput at 40 MIPS, allowing current loops running at 20 kHz switching to complete in a fraction of the PWM period. The 3.0V to 3.6V core interfaces to gate drivers through level-shifted logic, and the -40C to +85C industrial rating covers most drive enclosures. With 16 KB SRAM, sensorless algorithms with state observers fit without external RAM.
Recommandé
LED Lighting Drivers
In high-power LED systems, the DSPIC33FJ64GP708A-I/PT implements constant-current control, dimming (PWM and analog), color mixing, and DALI or DMX protocol handling concurrently. The eight output compare channels generate multi-channel dimming PWMs with hardware precision, while the 1.1 Msps ADC monitors output current, LED forward voltage, and temperature for protection. The 40 MIPS core has ample headroom to run communications protocols alongside the control loop on a single chip, replacing discrete MCU-plus-DSP solutions. Its 85C industrial rating suits enclosed luminaire drivers, and the 80-pin TQFP provides enough I/O for large multi-string fixtures.
Recommandé
Industrial Data Acquisition and Sensor Hubs
As a sensor hub, the DSPIC33FJ64GP708A-I/PT combines a multi-channel 10-bit ADC sampling up to 1.1 Msps with dual SPI and dual I2C ports for external precision ADCs, and dual UARTs for RS-485/Modbus field connectivity. The DSP engine performs windowed filtering and FFT-based diagnostics locally at 40 MIPS, reducing data traffic to a supervisory controller. Up to 66 general-purpose I/O pins on the 80-pin TQFP handle relay control, limit switches, and front-panel interfaces in one footprint. The -40C to +85C range and 3.3V operation with 5V-tolerant inputs simplify integration into legacy industrial signal chains.
Recommandé
Audio and Signal Processing Front Ends
The GP-family DSPIC33FJ64GP708A-I/PT serves audio and biomedical front ends where sampled signal processing is required: the dual 40-bit accumulators and single-cycle MAC execute FIR/IIR filters at 40 MIPS, while dual SPI ports stream data to external audio codecs or SD/SD-card storage. The 1.1 Msps ADC covers instrumentation channels, and eight input capture channels timestamp event signals for acoustic analytics. With 64 KB flash and 16 KB SRAM, complete filter banks and protocol stacks reside on chip. The single 3.3V rail and low peripheral count reduce BOM cost compared to a DSP-plus-MCU two-chip solution.
Recommandé
Embedded Control and IoT Nodes
For general embedded control and connected nodes, the DSPIC33FJ64GP708A-I/PT offers a balanced profile: 40 MIPS of headroom for protocol stacks (Modbus, CAN via external transceiver, or software-defined serial), 64 KB flash for bootloader plus application, and rich timers for scheduling and measurement. ICSP debugging through MPLAB Snap or REAL ICE keeps development fast, and seamless migration to PIC24H or higher-density dsPIC33FJ parts protects the PCB investment as requirements grow. The 80-pin TQFP with 66 I/O lines handles HMI buttons, displays, and actuators directly, making it a cost-effective single-chip controller for industrial IoT gateways and equipment controllers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33FJ64GP708A-I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33FJ128GP708A-I/PT | DSPIC33FJ256GP708A-I/PT | DSPIC33FJ32GP708A-I/PT | DSPIC33FJ64GP708A-E/PT | DSPIC33FJ64GP708-I/PT |
|---|---|---|---|---|---|---|
| Package | 80-pin TQFP (PT), 12 x 12 mm | 80-pin TQFP (PT) - same | 80-pin TQFP (PT) - same | 80-pin TQFP (PT) - same | 80-pin TQFP (PT) - same | 80-pin TQFP (PT) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Flash Memory | 64 KB | 128 KB | 256 KB | 32 KB | 64 KB | 64 KB |
| Operating Temperature | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) |
| Silicon Revision | A revision (improved) | A revision | A revision | A revision | A revision | Original (non-A) |
| Communication Ports | 2x UART, 2x SPI, 2x I2C | 2x UART, 2x SPI, 2x I2C | 2x UART, 2x SPI, 2x I2C | 2x UART, 2x SPI, 2x I2C | 2x UART, 2x SPI, 2x I2C | 2x UART, 2x SPI, 2x I2C |
| Lifecycle Status | Active | Active | Active | Active | Active | Active (superseded by A version) |
Principaux différenciateurs
- Best price/performance in the GP708A family for 64 KB designs (vs DSPIC33FJ128GP708A-I/PT)
- A-revision silicon reliability (vs DSPIC33FJ64GP708-I/PT)
- Extended temperature availability in same footprint (vs DSPIC33FJ64GP708A-E/PT)
- DSC capability vs plain MCU alternatives (vs PIC24HJ64GP504-I/PT (functional alternative, different package))
Notes de conception
The dsPIC33FJ64GP708A integrates an on-chip 3.3V-to-1.8V core regulator whose output appears on the VCAP/VDDCORE pin. Fit a low-ESR 10 uF tantalum or ceramic plus a 0.1 uF ceramic capacitor directly at this pin. If ENVREG is tied to VDD the regulator is enabled; tying ENVREG to VSS disables it, requiring an external clean core supply. All VDD/VSS pairs (multiple around the 80-pin ring) each need their own 0.1 uF decoupling capacitor placed within 2-3 mm of the pin.
ICSP programming uses PGECx/PGEDx pin pairs - the device has multiple pairs (PGEC1/PGED1, PGEC2/PGED2, PGEC3/PGED3), and the clock and data must come from the SAME pair; mixing PGEC2 with PGED1 will fail programming. Do not load PGECx/PGEDx pins with heavy capacitive loads or pull-downs that could violate ICSP timing. Also note the original dsPIC33FJ64GP708 (non-A) is documented by third parties as having very low flash endurance (guaranteed only ~100 erase/write cycles), another reason to standardize on the A revision.
For motor control and digital power firmware, route PWM outputs (OC1-OC8 on port D) away from analog inputs AN0-AN16 and keep AVDD (pin 80) filtered with an RC (e.g., 10 ohm + 0.1 uF) from VDD to supply a quiet analog rail. The QEA/QEB/INDX quadrature pins on RB3-RB5 should be treated as fast digital signals with short returns. Use a solid ground plane under the TQFP and stitch VSS vias near each VSS pin for low-inductance return paths.
Estimated: at 40 MIPS with all peripherals active, core current is typically on the order of tens of mA from 3.3V, giving power dissipation well under 0.5 W in the 12 x 12 mm TQFP; theta_JA of a standard 4-layer board keeps junction rise below 25C at 85C ambient, comfortably within the I-grade rating. For high-pin-count I/O switching at full drive, verify with Microchip power estimation tools, but heatsinking is not required for this device class.
Informations de conformité
Standard Microchip catalog device in lead-free TQFP package; RoHS/REACH statements per Microchip product page for this MPN. Not an automotive AEC-Q100 qualified part.