EFM32GG11B520F2048IM64-B - 72MHz ARM Cortex-M4 MCU 2MB Flash
Référence : EFM32GG11B520F2048IM64-B ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.05 | $130,50 |
| 100 | $11.6 | $1 160,00 |
| 500 | $10.45 | $5 225,00 |
| 1 000 | $9.3 | $9 300,00 |
EFM32GG11B520F2048IM64-B Présentation
An ARM Cortex-M4 microcontroller (MCU) is a 32-bit microcontroller unit based on the ARM Cortex-M4 processor core with DSP instructions and optional FPU, offering deterministic real-time performance at MHz clock speeds while consuming only tens of microamps per MHz in active mode. It fits within the hierarchy: Cortex-M4 MCU -> ARM-based microcontroller -> embedded microcontroller -> semiconductor. Battery voltage is critical for portable, energy-sensitive designs where sleep current dominates battery life.
Key features include 2 MB flash, 512 kB RAM, 53 GPIO, hardware AES/SHA crypto accelerator, segment LCD controller, USB, CAN, EBI and other peripherals, 39 C/W thermal resistance (typical QFN-64), -40C to +125C industrial temperature grade, and multiple low-energy modes down to sub-uA sleep currents. The B-grade part variant features extended industrial temperature range and is supplied on tape and reel.
The architecture combines ARM Cortex-M4 core with autonomous low-energy peripherals (LETIMER, RTCC, IADC, LESENSE) that operate without waking the CPU. The 2 MB flash supports over-the-air (OTA) firmware updates via dual-bank memory mapping, while the LCD controller enables direct drive of segmented displays without external driver ICs, reducing BOM cost and PCB area.
Typical applications include battery-powered IoT sensor nodes, smart energy metering with ESE AMR and LCD displays, industrial HMI panels with capacitive touch, connected lighting with wireless-segment control, and asset tracking with GPS/GNSS. The EFM32GG11B520F2048IM64-B is particularly well-suited to designs that require large memory for firmware/RF stacks while maintaining years of battery life.
When designing with this device, ensure adequate decoupling on VDD (1.8-3.8V) with 100 nF ceramic capacitors per supply pin and consider ground plane continuity under the QFN exposed pad for thermal dissipation. Order chips at tape and reel quantities via authorized distributors.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EFM32GG11B520F2048IM64-B — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EFM32GG11B520F2048IM64-B (même facteur de forme et même empreinte) — différant par Mounting Type, Operating Temperature, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EFM32GG11B520F2048IM64
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32GG11B520F2048IM64-A
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32GG11B520F2048IM64-BR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32GG11B420F2048IM64
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32GG11B520F2048GL120
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32GG12B810F1024IQ64
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32GG11B520F2048IM64-B Valeurs maximales et caractéristiques électriques
| Manufacturer | Silicon Labs |
| Series | EFM32 Giant Gecko Series 1 |
| Core | ARM Cortex-M4 |
| Core Size | 32-bit |
| Fréquence d'horloge maximale | 72 MHz |
| Program Memory Size (Flash) | 2 MB (2M x 8) |
| RAM Size | 512 kB |
| Supply Voltage (Vcc/Vdd) | 1.8 V to 3.8 V |
| Number of I/O | 53 |
| Timer/Counters | 7 x 16-bit |
| Boîtier | 64-QFN (9x9) |
| Supplier Device Package | 64-QFN (9x9) |
| Température de fonctionnement | -40C to +125C (Industrial) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Grade | B (Extended Industrial) |
Configuration des broches de EFM32GG11B520F2048IM64-B
| Broche 1 | PA0 — GPIO/Timer/Wake-up |
| Broche 2 | PA1 — GPIO/Timer/Wake-up |
| Broche 3 | PA2 — GPIO/USART0 |
| Broche 4 | PA3 — GPIO/USART0 |
| Broche 5 | PA4 — GPIO/I2C0 SDA |
| Broche 6 | PA5 — GPIO/I2C0 SCL |
| Broche 7 | PB0 — GPIO/ADC0 |
| Broche 8 | PB1 — GPIO/ADC0 |
| Broche 9 | PB2 — GPIO/ADC0 |
| Broche 10 | PB3 — GPIO/ADC0 |
| Broche 11 | PB4 — GPIO/I2C1 SDA |
| Broche 12 | PB5 — GPIO/I2C1 SCL |
| Broche 13 | PB6 — GPIO/USART1 |
| Broche 14 | PB7 — GPIO/USART1 |
| Broche 15 | PC0 — GPIO/Timer |
| Broche 16 | PC1 — GPIO/Timer |
| Broche 17 | PC2 — GPIO/Timer |
| Broche 18 | PC3 — GPIO/Timer |
| Broche 19 | PC4 — GPIO/ADC0 |
| Broche 20 | PC5 — GPIO/ADC0 |
| Broche 21 | PC6 — GPIO/ADC0 |
| Broche 22 | PC7 — GPIO/ADC0 |
| Broche 23 | PD0 — GPIO/USART2 |
| Broche 24 | PD1 — GPIO/USART2 |
| Broche 25 | PD2 — GPIO/SPI0 |
| Broche 26 | PD3 — GPIO/SPI0 |
| Broche 27 | PD4 — GPIO/SPI0 |
| Broche 28 | PD5 — GPIO/SPI0 |
| Broche 29 | PD6 — GPIO/I2C |
| Broche 30 | PD7 — GPIO/I2C |
| Broche 31 | PE0 — GPIO/CAN0 |
| Broche 32 | PE1 — GPIO/CAN0 |
| Broche 33 | PE2 — GPIO/Timer |
| Broche 34 | PE3 — GPIO/Timer |
| Broche 35 | PF0 — GPIO/LCD segment |
| Broche 36 | PF1 — GPIO/LCD segment |
| Broche 37 | PF2 — GPIO/LCD segment |
| Broche 38 | PF3 — GPIO/LCD segment |
| Broche 39 | PF4 — GPIO/LCD segment |
| Broche 40 | PF5 — GPIO/LCD segment |
| Broche 41 | PF6 — GPIO/LCD segment |
| Broche 42 | PF7 — GPIO/LCD segment |
| Broche 43 | PG0 — GPIO/LCD segment |
| Broche 44 | PG1 — GPIO/LCD segment |
| Broche 45 | PG2 — GPIO/LCD segment |
| Broche 46 | PG3 — GPIO/LCD segment |
| Broche 47 | PG4 — GPIO/LCD segment |
| Broche 48 | PG5 — GPIO/LCD segment |
| Broche 49 | PG6 — GPIO/LCD segment |
| Broche 50 | PG7 — GPIO/LCD segment |
| Broche 51 | PH0 — GPIO/LCD segment |
| Broche 52 | PH1 — GPIO/LCD segment |
| Broche 53 | PH2 — GPIO/LCD segment |
| Broche 54 | VSS — Ground |
| Broche 55 | VDD — Supply voltage (1.8V-3.8V) |
| Broche 56 | VSS — Ground |
| Broche 57 | VDD — Supply voltage (1.8V-3.8V) |
| Broche 58 | RESETn — Reset input (active low) |
| Broche 59 | SWDIO — Serial Wire Debug I/O |
| Broche 60 | SWCLK — Serial Wire Debug Clock |
| Broche 61 | SWO — Serial Wire Trace Output |
| Broche 62 | VCOM — LCD charge pump output |
| Broche 63 | VBAT — Battery domain supply |
| Broche 64 | EP — Exposed thermal pad (connect to GND) |
Applications typiques
EFM32GG11B520F2048IM64-B convient pour 6 applications: Battery-Powered IoT Sensor Nodes, Smart Energy Metering with LCD, Industrial HMI with Capacitive Touch, Connected Lighting Controllers, Asset Tracking with GPS/GNSS, Medical Wearable Monitors.
Battery-Powered IoT Sensor Nodes
The EFM32GG11B520F2048IM64-B fits battery-powered IoT sensor nodes because its 72 MHz Cortex-M4 plus 512 kB RAM and 2 MB flash support full BLE/Zigbee/Thread stacks on-chip. Its sub-uA sleep currents and 1.8-3.8V supply enable direct Li-ion/Li-Ion connection. Autonomous peripherals (LETIMER, IADC) measure sensors without waking the CPU, extending battery life to multi-year horizons in intermittent-duty wireless sensor deployments. The 53 GPIO also drive sensor arrays, switches, and LEDs directly.
Recommandé
Smart Energy Metering with LCD
The integrated segment LCD controller (up to 8x32 segments) drives multi-meter digit readouts without an external driver, making the EFM32GG11B520F2048IM64-B ideal for smart meters. Its 2 MB flash supports complex metering algorithms, segmented display font tables, and HAN/WAN protocol stacks. Low-energy modes keep average current below 30 uA in metering idle states, while 53 GPIO interface to current transformers, tamper switches, and metrology ICs across the entire metrology-to-display signal chain.
Recommandé
Industrial HMI with Capacitive Touch
The EFM32GG11B520F2048IM64-B suits industrial HMI panels where its 72 MHz core drives capacitive touch sensing via LESENSE and IADC peripherals without external touch controller. Industrial temperature grade (-40C to +125C) supports factory floor conditions. 53 GPIO handle RGB LED indicators, segment LCDs, rotary encoders, and buzzer drivers. The 2 MB flash stores multi-page UI assets and CANopen/Modbus firmware, while the 39 C/W thermal resistance QFN package enables fanless sealed enclosures.
Recommandé
Connected Lighting Controllers
Connected lighting controllers benefit from the EFM32GG11B520F2048IM64-B's 2 MB flash (large enough for Zigbee 3.0 + mesh networking firmware), 53 GPIO for multi-channel LED PWM driving, and sub-uA sleep that minimizes standby power below 30 uA per fixture. The integrated segment LCD drives simple status displays. The 1.8-3.8V supply directly accepts rectified 24V LED-driver rails after buck conversion, eliminating extra LDO stages and reducing BOM cost.
Recommandé
Asset Tracking with GPS/GNSS
Asset trackers use the EFM32GG11B520F2048IM64-B to log position data from external GPS/GNSS modules over UART, storing hours of trajectory in 2 MB flash or external SPI flash. The 72 MHz core parses NMEA sentences and applies dead-reckoning algorithms, while sleep modes keep average current below 25 uA between fixes. 53 GPIO wakes on motion (PIR/IMU interrupts) and drives BLE beacons for last-seen reporting.
Recommandé
Medical Wearable Monitors
The EFM32GS124F2048IM64-B fits medical wearables (pulse oximeters, continuous glucose monitor CGMs, portable ECGs) where low power, small footprint, and medical-grade firmware matter. The 72 MHz Cortex-M4 with FPU runs DSP algorithms (FFT, heart-rate variability) at sub-mW active power. 2 MB flash supports BLE Medical Devices Profile firmware plus on-device ML inference. The 53 GPIO connects to SpO2 sensors, PPG photodiodes, and BLE radio modules.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EFM32GG11B520F2048IM64-B — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EFM32GG11B520F2048IM64 | EFM32GG11B520F2048IM64-A | EFM32GG11B520F2048IM64-BR | EFM32GG11B420F2048IM64 | EFM32GG12B810F1024IQ64 |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9) | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same |
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Core | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 | ARM Cortex-M4 |
| Max Clock Frequency | 72 MHz | 72 MHz | 72 MHz | 72 MHz | 40 MHz | 72 MHz |
| Flash Memory | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 1 MB |
| RAM | 512 kB | 512 kB | 512 kB | 512 kB | 512 kB | 256 kB |
| Supply Voltage | 1.8V-3.8V | 1.8V-3.8V | 1.8V-3.8V | 1.8V-3.8V | 1.8V-3.8V | 1.8V-3.8V |
| Temperature Grade | B-grade (Industrial -40C to +125C) | Standard grade | A-grade | B-grade (T&R) | B-grade | I-grade (Industrial) |
| GPIO Count | 53 | 53 | 53 | 53 | 53 | 53 |
Principaux différenciateurs
- B-grade extended industrial temperature range (vs EFM32GG11B520F2048IM64-A)
- Same 64-QFN (9x9) package as GG11 family siblings (vs EFM32GG11B520F2048GQ64-B (64-TQFP 10x10))
- Sub-uA low-energy modes (vs EFM32GG11B420F2048IM64 (40 MHz variant))
Notes de conception
Decouple each VDD pin with a 100 nF ceramic capacitor placed within 3 mm of the pin. For the 64-QFN (9x9) package, route VDD and VSS on adjacent layers with low-impedance stitching vias around the exposed pad (pin 64). The 1.8V-3.8V supply allows direct Li-ion/Li-Ion battery connection, but for noise-sensitive analog peripherals (ADC, IADC), add a ferrite bead + 10 uF bulk capacitor pair on the supply rail. Estimated: at 72 MHz active, core current is approximately 25 mA/MHz, so peak VDD current near 1.8A requires 4-layer PCB with 2 oz copper on inner layers for adequate thermal spreading.
The 64-QFN (9x9) package exposed pad (pin 64) must be soldered to a continuous ground plane with thermal vias (0.3 mm pitch, 9+ vias recommended) to achieve the datasheet's 39 C/W theta_JA. Estimated: at 1.8A peak VDD current, worst-case junction-to-ambient rise is approximately 70C above ambient - well within the -40C to +125C industrial range if the PCB provides at least 1 square inch of 1 oz copper pour.
Route SWDIO/SWCLK/SWO (pins 59-61) as a 50 ohm-controlled impedance group with continuous ground reference, length-matched within 5 mm, and kept away from high-current switching nodes (DC-DC, RF). Place the 32.768 kHz crystal within 5 mm of the HFXTAL pins with symmetric trace lengths and guard ground to minimize load capacitor mismatch. Use 4-layer PCB stack-up with dedicated ground and power planes for EMI suppression.
Do not exceed 3.8V on VDD - the EFM32GG11B520F2048IM64-B has no internal overvoltage protection. Always assert RESETn (pin 18) low for at least 1 us after VDD reaches 1.8V to ensure clean startup. For firmware updates via dual-bank memory mapping, ensure BOOTMODE strap pin is properly configured during reset to avoid bricking the device. Verify the segment LCD bias voltage (VCOM, pin 62) is within the datasheet's specified range for the chosen LCD glass.
Informations de conformité
RoHS compliant per Silicon Labs product page. Not AEC-Q100 qualified for automotive; choose automotive-grade variant for AEC-Q100 applications.
