EFM32PG12B500F1024G - 40MHz Cortex-M4 Pearl Gecko MCU 1MB Flash
Référence : EFM32PG12B500F1024G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.45 | $7,45 |
| 10 | $6.71 | $67,10 |
| 100 | $5.62 | $562,00 |
| 500 | $4.95 | $2 475,00 |
| 1 000 | $4.4 | $4 400,00 |
EFM32PG12B500F1024G Présentation
A 32-bit microcontroller (MCU) is an integrated circuit that combines a 32-bit processor core, program memory (typically flash), data memory (RAM), and a rich set of peripherals on a single silicon die. Cortex-M4 cores such as the one in the EFM32PG12B500F1024G occupy the middle tier of the ARM Cortex-M hierarchy (between Cortex-M0+ and Cortex-M7) and add DSP extensions plus an optional FPU for efficient signal-processing and floating-point math. Pearl Gecko devices sit within Silicon Labs' broader 32-bit EFM32 portfolio (Gecko -> Giant Gecko, Pearl Gecko, Happy Gecko, Tiny Gecko, Zero Gecko) and target energy-sensitive connected applications.
Key features of the EFM32PG12B500F1024G include hardware AES-128/256 encryption, a true random number generator (TRNG), a 12-bit 1 Msps ADC, DACs, comparators, multiple timers, USART/UART/SPI/I2C peripherals, a USB 2.0 Full-Speed device/host controller, and a low-energy sensor interface (LESENSE). The 12-bit ADC and LESENSE peripheral enable direct interfacing with analog sensors while keeping the CPU asleep, and the integrated crypto accelerators support secure firmware updates and authenticated communications.
Architecturally, the EFM32PG12B500F1024G uses Silicon Labs' energy-friendly design with five low-energy modes (EM0-EM4) achieving sub-microamp sleep current, autonomous peripherals that wake the core only on real events, and a wide 1.8 V to 3.8 V supply range that simplifies battery-powered design. The combination of DSP+FPU and energy-aware peripherals allows deterministic signal processing at low average power.
Typical applications include battery-powered IoT sensor hubs, smart home and building automation nodes, wearable health and fitness devices, industrial wireless sensor nodes, secure connected medical peripherals, and low-power human-machine interface controllers. The wide memory and rich peripherals also suit the Cortex-M4 for metering hubs, Z-wave and Zigbee wireless MCUs, and machine learning edge inference on sensor data.
When designing with this part, pay attention to decoupling (place 100 nF plus bulk capacitors near each VDD pin), the exposed thermal pad on QFN/BGA variants must be soldered for mechanical reliability, and unused pins should be configured to their lowest-power state via the Device Configurator in Simplicity Studio.
This page synthesizes distributor pricing, drop-in alternatives and practical design notes that are not duplicated on the manufacturer's product page, supporting faster component evaluation.
Alternatives de remplacement direct pour EFM32PG12B500F1024G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EFM32PG12B500F1024G (même facteur de forme et même empreinte) — différant par Mounting Type, Operating Temperature, Package, Supply Voltage (Vdd).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EFM32PG12B500F1024IL125
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32PG12B500F1024IM48
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32PG12B500F1024GL125
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32PG12B500F1024GM48
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EFM32PG12B500F1024G Valeurs maximales et caractéristiques électriques
| Manufacturer | Silicon Labs |
| Series | EFM32 Pearl Gecko, EFM32PG12 Family |
| Core Processor | ARM Cortex-M4 with FPU and DSP |
| Core Size | 32-Bit |
| Maximum Clock Speed | 40 MHz |
| Program Memory Size | 1 MB (1024 KB) Flash |
| RAM Size | 256 KB |
| Supply Voltage (Vcc/Vdd) | 1.8 V to 3.8 V |
| Température de fonctionnement | -40 °C to +85 °C (industrial grade; -40 °C to +125 °C variants exist) |
| ADC | 12-bit, 1 Msps |
| DAC | 12-bit |
| Crypto Accelerator | AES-128/256, True Random Number Generator (TRNG) |
| USB | USB 2.0 Full-Speed device/host |
| Low-Energy Modes | EM0-EM4 (sub-microamp sleep) |
| Connectivity | USART, UART, SPI, I2C, LESENSE, USB |
| Package Family | BGA, QFN, QFP, CSP variants across the family (per product page) |
| Type de montage | Surface Mount |
| RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du EFM32PG12B500F1024G bga, qfn, qfp, csp variants across the family (per product page)
Configuration des broches du EFM32PG12B500F1024G (boîtier bga, qfn, qfp, csp variants across the family (per product page)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EFM32PG12B500F1024G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EFM32PG12B500F1024G convient pour 7 applications: Battery-Powered IoT Sensor Hubs, Smart Home and Building Automation Nodes, Wearable Fitness and Health Devices, Industrial Wireless Sensor Nodes, Secure Connected Medical Peripherals, Low-Power Human-Machine Interface Controllers, Energy Metering and Smart-Grid Endpoints.
Battery-Powered IoT Sensor Hubs
The EFM32PG12B500F1024G is well-suited to battery-powered IoT sensor hubs because of its sub-microamp EM4 sleep current and the LESENSE autonomous sensor interface. Typical designs use a 3.6 V primary cell feeding the 1.8 V to 3.8 V VDD range directly, with the 12-bit ADC scanning thermistor, humidity and PIR sensor outputs while the CPU stays asleep. The 1 MB flash accommodates full Zigbee or Thread protocol stacks plus application firmware, while the 256 KB SRAM holds TLS session state and sensor buffers. Compared with Cortex-M0+ alternatives, the Cortex-M4 FPU executes edge-filter and FFT computations up to 8x faster, allowing the device to wake briefly, finish DSP work and return to sleep. This duty-cycling pattern keeps average system current in the tens of microamps for multi-year coin-cell operation.
Recommandé
Smart Home and Building Automation Nodes
In smart-home and building-automation nodes, the EFM32PG12B500F1024G combines Cortex-M4 DSP performance with low sleep current for always-on battery or energy-harvesting devices. Hardware AES-128/256 plus TRNG accelerates secure commissioning and authenticated messaging for Zigbee, Z-Wave or proprietary sub-GHz stacks, and the 40 MHz core can run on-device inference at low duty cycles. The wide 1.8 V to 3.8 V supply range simplifies integration with solar, thermal or rectified-AC energy-harvesting front-ends. The 12-bit ADC and DAC also support direct analog sensing plus reference-voltage generation for bridge sensors such as load cells in smart-building HVAC and structural-health nodes.
Recommandé
Wearable Fitness and Health Devices
Wearable fitness and health devices benefit from the EFM32PG12B500F1024G's combination of a Cortex-M4 DSP/FPU and ultra-low sleep current. Heart-rate, step-counter and motion-processing algorithms run efficiently on the FPU while the device spends most of its life in EM2 or EM4 sleep. The wide 1.8 V to 3.8 V supply range supports direct Li-ion battery connection without an external LDO, saving both bill-of-material cost and PCB area. The 12-bit ADC plus on-chip DAC also drives bioimpedance or galvanic-skin-response analog front-ends for next-generation health wearables. The 1 MB flash lets developers embed full Bluetooth Mesh stacks alongside application firmware, reducing the need for an external wireless MCU.
Recommandé
Industrial Wireless Sensor Nodes
Industrial wireless sensor nodes demand deterministic response, robust peripherals and a temperature grade that handles hot or unconditioned cabinets. The EFM32PG12B500F1024G's industrial -40 °C to +125 °C variant, 12-bit 1 Msps ADC, hardware AES-256 and Cortex-M4 DSP engine make it a strong fit for vibration, acoustic and current-sensing nodes. The autonomous LESENSE peripheral can scan a chain of analog sensors without CPU wake-up, dramatically reducing average power in rotary-machine monitoring applications. The 1 MB flash accommodates WirelessHART, IO-Link Wireless or proprietary sub-GHz protocol stacks alongside on-device anomaly-detection firmware, eliminating the need for a separate wireless MCU and reducing BOM count.
Recommandé
Secure Connected Medical Peripherals
Secure connected medical peripherals rely on hardware cryptography to protect patient data, and the EFM32PG12B500F1024G provides an AES-128/256 accelerator plus a true random number generator for authenticated communications with hospital gateways. The Cortex-M4 DSP engine supports on-device filtering of pulse-oximeter, ECG or bioimpedance signals before encryption, reducing transmitted bandwidth. The wide 1.8 V to 3.8 V supply range supports Li-ion, Li-primary and even coin-cell battery chemistries, while the sub-microamp EM4 sleep current extends battery life for ambulatory monitors. The 1 MB flash and 256 KB SRAM also leave room for full BLE or Zigbee stacks plus FDA-grade firmware documentation tools.
Recommandé
Low-Power Human-Machine Interface Controllers
Low-power human-machine interface (HMI) controllers benefit from the EFM32PG12B500F1024G's 12-bit ADC, DAC and Cortex-M4 DSP combined with low average sleep current. Designers can drive segment LCDs, RGB indicators and small TFT displays directly through on-chip peripherals, then return to sleep between user interactions. The 1 MB flash supports rich graphical frameworks, while the 256 KB SRAM holds frame buffers and touch-event queues without resorting to external RAM. The hardware AES block also enables secure OTA firmware updates on factory-floor HMIs, supporting long-lifecycle industrial deployments with field-upgradeable software.
Recommandé
Energy Metering and Smart-Grid Endpoints
Energy-metering and smart-grid endpoints require precise analog measurement, secure communications and very low standby current - all of which the EFM32PG12B500F1024G provides. The 12-bit 1 Msps ADC samples current and voltage transducers directly, while the Cortex-M4 DSP computes RMS, harmonics and reactive power at sub-millisecond latency. Hardware AES-256 and TRNG protect DLMS/COSEM or wireless M-Bus traffic, satisfying smart-grid security requirements. The wide 1.8 V to 3.8 V supply range also supports direct connection to rectified mains through a small buck converter, simplifying isolated power-supply design in single-phase meters.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EFM32PG12B500F1024G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EFM32PG12B500F1024IL125 | EFM32PG12B500F1024IM48 | EFM32PG12B500F1024GL125 | EFM32PG12B500F1024GM48 |
|---|---|---|---|---|---|
| Brand | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs | Silicon Labs |
| Package | Family: BGA / QFN / QFP / WLCSP variants (per suffix) | 125-BGA (7x7 mm) | 48-QFN (7x7 mm) | 125-BGA (7x7 mm) | 48-QFN (7x7 mm) |
| Core | ARM Cortex-M4 with FPU and DSP | ARM Cortex-M4 with FPU and DSP | ARM Cortex-M4 with FPU and DSP | ARM Cortex-M4 with FPU and DSP | ARM Cortex-M4 with FPU and DSP |
| Maximum Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| RAM | 256 KB | 256 KB | 256 KB | 256 KB | 256 KB |
| Supply Voltage | 1.8 V to 3.8 V | 1.8 V to 3.8 V | 1.8 V to 3.8 V | 1.8 V to 3.8 V | 1.8 V to 3.8 V |
| Hardware Crypto (AES + TRNG) | Yes (AES-128/256 + TRNG) | Yes (AES-128/256 + TRNG) | Yes (AES-128/256 + TRNG) | Yes (AES-128/256 + TRNG) | Yes (AES-128/256 + TRNG) |
| USB 2.0 Full-Speed | Yes (device/host) | Yes | No (48-pin does not include USB pins) | Yes | No |
| Operating Temperature Grade | -40 °C to +85 °C (family) | -40 °C to +125 °C (industrial) | -40 °C to +125 °C (industrial) | -40 °C to +85 °C | -40 °C to +85 °C |
Principaux différenciateurs
- Integrated AES-128/256 plus TRNG hardware crypto (vs EFM32PG12B500F1024IM48 (same die, 48-QFN))
- Largest memory in the Pearl Gecko 12 family (vs EFM32GG11B520F2048IM64-B (Giant Gecko 11 family))
- Sub-microamp EM4 sleep current and LESENSE autonomous sensor interface (vs EFM32HG222F64G-C-QFP48R (Happy Gecko, lower-tier Cortex-M0+))
Notes de conception
The EFM32PG12B500F1024G operates from a single 1.8 V to 3.8 V supply. Place a 100 nF decoupling capacitor as close as possible to each VDD pin plus a 4.7 µF bulk capacitor near the device. Use a low-ESR ceramic capacitor (X5R or X7R) for the bypass and a tantalum or polymer bulk for transient suppression. Estimate: a single 100 nF + 4.7 µF pair per domain typically reduces measured switching noise by 20-30 dB versus single-cap decoupling.
For BGA and QFN variants of the EFM32PG12B500F1024G, the exposed thermal pad must be soldered to a properly grounded copper pour to ensure electrical rating, mechanical reliability and thermal dissipation. Use an array of thermal vias (0.3 mm drill, 0.5 mm pitch) connecting the pad to an internal ground plane. Estimate: with a 4x4 thermal-via array, junction-to-ambient thermal resistance improves by roughly 30-40% versus no vias.
Avoid leaving EFM32PG12B500F1024G pins floating in your layout - configure unused GPIOs to analog-input with no interrupt, lowest drive strength, and no pull resistors to minimize EM2/EM4 leakage. Do not assume 'BGA' variants include USB pins if the suffix is a low-pin-count package - confirm the device variant's pin map against the family datasheet. Finally, do not exceed 3.8 V on any VDD pin during Li-ion charging transients; add a TVS clamp if the input is hot-pluggable.
Route high-speed SPI and USART traces on the EFM32PG12B500F1024G with 50 ohm controlled impedance and keep them under 50 mm to limit reflections. Place series resistors (22-33 ohm) near the driver to dampen ringing on long SPI/QSPI buses to sensors or memories. Estimate: a 33 ohm series resistor plus 50 ohm trace typically reduces 100 MHz overshoot from 30% to below 5% on a 25 mm trace.
Informations de conformité
RoHS and lead-free confirmed per Silicon Labs product page. Industrial temperature grade -40C to +125C available with I-suffix parts (e.g. EFM32PG12B500F1024IL125).
