EP1AGX35DF780 - Arria GX FPGA, 35K LE, 780-BGA | Altera / Intel
Référence : EP1AGX35DF780 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $217.14 | $217,14 |
| 10 | $195.43 | $1 954,30 |
| 100 | $173.71 | $17 371,00 |
| 250 | $158.2 | $39 550,00 |
| 500 | $142.6 | $71 300,00 |
EP1AGX35DF780 Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose digital logic is defined by a customer-supplied configuration bitstream rather than a fixed mask set. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs, ASICs, and ASSPs. Within the system hierarchy they are typically classified as: programmable logic -> logic IC -> integrated circuit. Modern FPGAs such as the Arria GX include hard IP blocks (transceivers, PLLs, embedded multipliers, memory controllers) so engineers can implement entire signal-processing pipelines without external ASSPs.
Key features of the EP1AGX35DF780 include up to 8 full-duplex 3.125 Gbps CMU/CDR transceivers (the GX family hallmark), 4 PLLs, dedicated 18x18 multipliers for DSP functions, embedded RAM blocks totaling 1.34 Mb, and support for DDR/DDR2/QDRII/QDRII+ external memory interfaces. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and Altera-enhanced configuration devices, plus JTAG 1149.1 boundary-scan.
Typical applications include telecommunications backplane aggregation, video broadcast and studio equipment, serial digital interface (SDI) routing, PCIe endpoint implementations, and high-speed data-acquisition front-ends. Industrial and test-and-measurement customers also deploy the part for protocol bridging between legacy parallel buses and modern serial links.
When designing with this part, note that 780-ball FBGA is a large, fine-pitch package that mandates controlled-impedance stack-up and assembly in accordance with IPC-7351 / JEDEC J-STD-020 MSL3 guidelines. Power estimation should use the Altera PowerPlay Early Power Estimator before RTL completion to budget regulators and thermal dissipation.
This page synthesizes distributor pricing, datasheet bookmarks, and drop-in alternatives into one technical brief that goes beyond what DigiKey/Mouser product listings expose, including transceiver count and embedded-memory details not always surfaced in summary tables.
Alternatives de remplacement direct pour EP1AGX35DF780 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1AGX35DF780 (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Operating Temperature, Transceiver Data Rate, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1AGX35CF780I6N
✅ Remplacement direct✓ En stock
$278.75 / unité
Voir la fiche technique →EP1AGX20CF780I6N
✅ Remplacement direct✓ En stock
$295 / unité
Voir la fiche technique →EP1AGX20CF780C6N
✅ Remplacement direct✓ En stock
$38.95 / unité
Voir la fiche technique →EP1AGX20CF780C5N
✅ Remplacement direct✓ En stock
$305 / unité
Voir la fiche technique →EP1AGX20CF780I6
✅ Remplacement direct✓ En stock
$195 / unité
Voir la fiche technique →EP1AGX35DF780 Valeurs maximales et caractéristiques électriques
| Series | Arria GX |
| Family | Altera Arria GX (90 nm) |
| Logic Elements (LE) | 33,520 |
| Embedded Memory | 1,348,416 bits (1.34 Mbit) |
| Maximum User I/Os | 341 |
| Number of LABs / CLBs | 1676 LABs |
| Transceivers | Up to 8 channels, 3.125 Gbps per channel |
| PLLs | 4 |
| Embedded Multipliers | 18x18-bit hard multipliers (DSP blocks) |
| External Memory Support | DDR, DDR2, QDRII, QDRII+ |
| Boîtier | 780-ball FineLine BGA (FCBGA, 29x29 mm) |
| Configuration Methods | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG 1149.1 |
| Plage de température de fonctionnement | -40C to +85C (industrial grade I-suffix variants available) |
| Process Node | 90 nm CMOS |
| Statut RoHS | Compliant (lead-free variant) |
| Lifecycle | Mature / Obsolete in Intel FPGA product tree |
Guide de configuration des broches du EP1AGX35DF780 780-ball fineline bga (fcbga, 29x29 mm)
Configuration des broches du EP1AGX35DF780 (boîtier 780-ball fineline bga (fcbga, 29x29 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1AGX35DF780.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1AGX35DF780 convient pour 6 applications: Telecom Backplane Aggregation, Broadcast Video Routing and SDI Switching, PCI Express Endpoint Cards, High-Speed Data Acquisition Front-Ends, Industrial Protocol Bridging, Wireless Baseband Processing.
Telecom Backplane Aggregation
The EP1AGX35DF780's 8 channels of 3.125 Gbps transceivers are a direct fit for telecom backplane aggregation cards that consolidate multiple lower-speed tributary links into a higher-speed uplink. Its 33,520 logic elements, 1.34 Mbit embedded RAM, and 341 user I/Os provide ample headroom to implement cross-connect logic, packet buffering, and SERDES adaptation in a single device - eliminating the cost and board area of an external PHY. The hard PCS/PMA also supports protocols like Serial RapidIO and Interlaken natively.
Recommandé
Broadcast Video Routing and SDI Switching
Studio and broadcast video routers need to switch SD-SDI (270 Mbps), HD-SDI (1.485 Gbps), and 3G-SDI (2.97 Gbps) streams between many sources and destinations. The EP1AGX35DF780's transceiver channels handle SDI natively at standard rates, while its 33K logic elements, embedded multipliers, and 1.34 Mbit RAM implement genlocking, audio de-embedding, and matrix-switching fabric. Industrial temperature variants qualify the part for 24/7 broadcast-facility operation where downtime is unacceptable.
Recommandé
PCI Express Endpoint Cards
With native 3.125 Gbps transceivers, the EP1AGX35DF780 implements PCIe Gen1 x1/x4 endpoints without external PHY chips, cutting BOM cost and board area. Its 33K logic elements host a soft PCIe IP core plus application payload, while the 1.34 Mbit embedded RAM serves as a transaction buffer for DMA engines. Industrial-grade variants suit ruggedized server cards, industrial PCs, and instrumentation add-in boards where extended temperature operation is required.
Recommandé
High-Speed Data Acquisition Front-Ends
Test-and-measurement digitizers and oscilloscope front-ends need multi-gigabit serial links to stream ADC data to a host processor. The EP1AGX35DF780 pairs its 3.125 Gbps transceivers with hard multipliers (for FIR decimation filters), 1.34 Mbit embedded RAM (for sample buffering), and 341 user I/Os (to interface LVDS ADCs). The industrial temperature grade makes it suitable for bench, ATE, and field-portable instruments that must operate across wide thermal ranges.
Recommandé
Industrial Protocol Bridging
Factory automation gateways must bridge legacy fieldbuses (Profibus, RS-485, CAN) to modern Ethernet/IP and EtherCAT networks. The EP1AGX35DF780's high-speed transceivers handle Ethernet PHY duties, while its abundant logic implements soft-core CPUs (Nios II) for protocol translation, 1.34 Mbit RAM buffers packets, and 341 user I/Os drive multiple fieldbus interfaces simultaneously. Industrial-grade parts ensure reliable operation in 50C cabinet environments with high EMI.
Recommandé
Wireless Baseband Processing
Small-cell and pico-cell baseband designs use mid-range FPGAs like the EP1AGX35DF780 for CPRI front-haul, digital up/down-conversion, and channel-card aggregation. The 8 transceivers carry CPRI up to 3.072 Gbps, the 18x18 multipliers perform crest-factor reduction and digital pre-distortion, and the 1.34 Mbit RAM stages buffers between PHY and baseband DSP. Migration to Arria II GX (40 nm) reduces power per channel by ~40%, critical for outdoor radio units.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1AGX35DF780 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1AGX35CF780I6N | EP1AGX20CF780I6N | EP1AGX20CF780C6N | EP1AGX20CF780C5N | EP1AGX20CF780I6 |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 780-ball FineLine BGA (FCBGA) | 780-ball FineLine BGA (FCBGA) | 780-ball FineLine BGA (FCBGA) | 780-ball FineLine BGA (FCBGA) | 780-ball FineLine BGA (FCBGA) | 780-ball FineLine BGA (FCBGA) |
| Logic Elements | 33,520 | 33,500 | 20,060 | 20,060 | 20,060 | 20,060 |
| Transceivers / Speed | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps |
| Process Node | 90 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| Operating Temperature | 0C to +85C (commercial C6) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Lifecycle Status | Obsolete (Arria GX EOL) | Obsolete (Arria II GX) | Obsolete (Arria II GX) | Obsolete (Arria II GX) | Obsolete (Arria II GX) | Obsolete (Arria II GX) |
| RoHS | Compliant (N suffix) | Compliant (N suffix) | Compliant (N suffix) | Compliant (N suffix) | Compliant (N suffix) | Non-RoHS (no N suffix) |
Principaux différenciateurs
- Highest logic density in the Arria GX 780-FBGA family (vs EP1AGX20CF780I6N)
- Arria II GX (40 nm) migration available in same 780-BGA footprint (vs EP1AGX35CF780I6N)
- Industrial temperature variants available for harsh environments (vs EP1AGX20CF780C6N)
Notes de conception
Estimated: at full transceiver utilization (8 channels @ 3.125 Gbps) and 75% logic toggling, junction power can exceed 5 W. The 780-ball FCBGA (29x29 mm) has theta_JA in the 15-20 C/W range on a JEDEC 4-layer test board, requiring at least a moderate copper pour or a heatsink for industrial-temperature operation. Use the Altera PowerPlay Early Power Estimator before RTL completion to budget thermal dissipation and validate regulator sizing. Always apply thermal interface material (TIM) if a discrete heatsink is used.
The 780-ball FCBGA uses a 1.0 mm ball pitch - the PCB must follow IPC-7351 land-pattern guidelines and use NSMD (non-solder-mask-defined) pads for best joint reliability. Stack-up should specify 4-6 mil laser-drilled microvias for breakout and a continuous GND plane on layer 2 to provide return paths for high-speed transceivers. Per JEDEC J-STD-020, the device is MSL3 (30C/60% RH floor life 168 hours) - bake-out is required if the factory floor exposure exceeds that window.
Transceiver channels require 100-ohm differential pairs routed with controlled impedance (typically 85-ohm on inner stripline layers, 90-ohm on microstrip) and length matching to within 5 mils within a channel and 50 mils across a group for protocols like PCIe. Keep AC-coupling capacitors close to the transmitter pins and provide solid GND return stitching vias every 200 mils along the trace route to minimize EMI and signal-integrity issues.
Do not assume the EP1AGX35DF780 can be hot-swapped or live-updated without verifying configuration scheme support. When migrating to Arria II GX (40 nm) on the same 780-BGA footprint, double-check pinout compatibility via the Altera pin migration tool - while the high-level ball map is similar, several transceiver supply pins and JTAG pin assignments changed between the two generations, and a naive swap will short power rails.
Estimated: VCCINT (core) typically 1.2 V and VCCIO (I/O banks) at 1.5/1.8/2.5/3.3 V depending on bank assignment. Always sequence supplies per Altera's recommended power-up sequence - VCCINT before VCCAUX before VCCIO - to prevent latch-up during board power ramp. Decouple each supply pin with 0.1 uF X7R ceramic placed within 100 mils, plus bulk decoupling of 10-100 uF tantalum or polymer per supply rail.
Informations de conformité
RoHS compliance applies to 'N' suffix variants. AEC-Q100 not applicable - this is an industrial/communications FPGA, not an automotive-qualified part. Halogen-free status not published in distributor data.
