EP1AGX35DF780 - Arria GX FPGA, 35K LE, 780-BGA | Altera / Intel
부품 번호: EP1AGX35DF780 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $217.14 | $217.14 |
| 10 | $195.43 | $1,954.30 |
| 100 | $173.71 | $17,371.00 |
| 250 | $158.2 | $39,550.00 |
| 500 | $142.6 | $71,300.00 |
EP1AGX35DF780 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor IC whose digital logic is defined by a customer-supplied configuration bitstream rather than a fixed mask set. FPGAs belong to the broader category of programmable logic devices (PLDs), sitting alongside CPLDs, ASICs, and ASSPs. Within the system hierarchy they are typically classified as: programmable logic -> logic IC -> integrated circuit. Modern FPGAs such as the Arria GX include hard IP blocks (transceivers, PLLs, embedded multipliers, memory controllers) so engineers can implement entire signal-processing pipelines without external ASSPs.
Key features of the EP1AGX35DF780 include up to 8 full-duplex 3.125 Gbps CMU/CDR transceivers (the GX family hallmark), 4 PLLs, dedicated 18x18 multipliers for DSP functions, embedded RAM blocks totaling 1.34 Mb, and support for DDR/DDR2/QDRII/QDRII+ external memory interfaces. Configuration is supported via passive serial (PS), fast passive parallel (FPP), and Altera-enhanced configuration devices, plus JTAG 1149.1 boundary-scan.
Typical applications include telecommunications backplane aggregation, video broadcast and studio equipment, serial digital interface (SDI) routing, PCIe endpoint implementations, and high-speed data-acquisition front-ends. Industrial and test-and-measurement customers also deploy the part for protocol bridging between legacy parallel buses and modern serial links.
When designing with this part, note that 780-ball FBGA is a large, fine-pitch package that mandates controlled-impedance stack-up and assembly in accordance with IPC-7351 / JEDEC J-STD-020 MSL3 guidelines. Power estimation should use the Altera PowerPlay Early Power Estimator before RTL completion to budget regulators and thermal dissipation.
This page synthesizes distributor pricing, datasheet bookmarks, and drop-in alternatives into one technical brief that goes beyond what DigiKey/Mouser product listings expose, including transceiver count and embedded-memory details not always surfaced in summary tables.
드롭인 대체품: EP1AGX35DF780 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1AGX35DF780 (동일 폼 팩터 및 풋프린트) — 차이점: Speed Grade, Package, Operating Temperature, Transceiver Data Rate, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1AGX35CF780I6N
✅ 드롭인✓ 재고 있음
$278.75 / 개
데이터시트 보기 →EP1AGX20CF780I6N
✅ 드롭인✓ 재고 있음
$295 / 개
데이터시트 보기 →EP1AGX20CF780C6N
✅ 드롭인✓ 재고 있음
$38.95 / 개
데이터시트 보기 →EP1AGX20CF780C5N
✅ 드롭인✓ 재고 있음
$305 / 개
데이터시트 보기 →EP1AGX20CF780I6
✅ 드롭인✓ 재고 있음
$195 / 개
데이터시트 보기 →EP1AGX35DF780 최대 정격 & 전기적 특성
| Series | Arria GX |
| Family | Altera Arria GX (90 nm) |
| Logic Elements (LE) | 33,520 |
| Embedded Memory | 1,348,416 bits (1.34 Mbit) |
| Maximum User I/Os | 341 |
| Number of LABs / CLBs | 1676 LABs |
| Transceivers | Up to 8 channels, 3.125 Gbps per channel |
| PLLs | 4 |
| Embedded Multipliers | 18x18-bit hard multipliers (DSP blocks) |
| External Memory Support | DDR, DDR2, QDRII, QDRII+ |
| 패키지 | 780-ball FineLine BGA (FCBGA, 29x29 mm) |
| Configuration Methods | Passive Serial (PS), Fast Passive Parallel (FPP), JTAG 1149.1 |
| 동작 온도 범위 | -40C to +85C (industrial grade I-suffix variants available) |
| Process Node | 90 nm CMOS |
| RoHS 상태 | Compliant (lead-free variant) |
| Lifecycle | Mature / Obsolete in Intel FPGA product tree |
EP1AGX35DF780 780-ball fineline bga (fcbga, 29x29 mm) 핀 구성 가이드
EP1AGX35DF780(780-ball fineline bga (fcbga, 29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1AGX35DF780.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1AGX35DF780 적합 용도: 6 애플리케이션s: Telecom Backplane Aggregation, Broadcast Video Routing and SDI Switching, PCI Express Endpoint Cards, High-Speed Data Acquisition Front-Ends, Industrial Protocol Bridging, Wireless Baseband Processing.
Telecom Backplane Aggregation
The EP1AGX35DF780's 8 channels of 3.125 Gbps transceivers are a direct fit for telecom backplane aggregation cards that consolidate multiple lower-speed tributary links into a higher-speed uplink. Its 33,520 logic elements, 1.34 Mbit embedded RAM, and 341 user I/Os provide ample headroom to implement cross-connect logic, packet buffering, and SERDES adaptation in a single device - eliminating the cost and board area of an external PHY. The hard PCS/PMA also supports protocols like Serial RapidIO and Interlaken natively.
추천
Broadcast Video Routing and SDI Switching
Studio and broadcast video routers need to switch SD-SDI (270 Mbps), HD-SDI (1.485 Gbps), and 3G-SDI (2.97 Gbps) streams between many sources and destinations. The EP1AGX35DF780's transceiver channels handle SDI natively at standard rates, while its 33K logic elements, embedded multipliers, and 1.34 Mbit RAM implement genlocking, audio de-embedding, and matrix-switching fabric. Industrial temperature variants qualify the part for 24/7 broadcast-facility operation where downtime is unacceptable.
추천
PCI Express Endpoint Cards
With native 3.125 Gbps transceivers, the EP1AGX35DF780 implements PCIe Gen1 x1/x4 endpoints without external PHY chips, cutting BOM cost and board area. Its 33K logic elements host a soft PCIe IP core plus application payload, while the 1.34 Mbit embedded RAM serves as a transaction buffer for DMA engines. Industrial-grade variants suit ruggedized server cards, industrial PCs, and instrumentation add-in boards where extended temperature operation is required.
추천
High-Speed Data Acquisition Front-Ends
Test-and-measurement digitizers and oscilloscope front-ends need multi-gigabit serial links to stream ADC data to a host processor. The EP1AGX35DF780 pairs its 3.125 Gbps transceivers with hard multipliers (for FIR decimation filters), 1.34 Mbit embedded RAM (for sample buffering), and 341 user I/Os (to interface LVDS ADCs). The industrial temperature grade makes it suitable for bench, ATE, and field-portable instruments that must operate across wide thermal ranges.
추천
Industrial Protocol Bridging
Factory automation gateways must bridge legacy fieldbuses (Profibus, RS-485, CAN) to modern Ethernet/IP and EtherCAT networks. The EP1AGX35DF780's high-speed transceivers handle Ethernet PHY duties, while its abundant logic implements soft-core CPUs (Nios II) for protocol translation, 1.34 Mbit RAM buffers packets, and 341 user I/Os drive multiple fieldbus interfaces simultaneously. Industrial-grade parts ensure reliable operation in 50C cabinet environments with high EMI.
추천
Wireless Baseband Processing
Small-cell and pico-cell baseband designs use mid-range FPGAs like the EP1AGX35DF780 for CPRI front-haul, digital up/down-conversion, and channel-card aggregation. The 8 transceivers carry CPRI up to 3.072 Gbps, the 18x18 multipliers perform crest-factor reduction and digital pre-distortion, and the 1.34 Mbit RAM stages buffers between PHY and baseband DSP. Migration to Arria II GX (40 nm) reduces power per channel by ~40%, critical for outdoor radio units.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1AGX35DF780 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1AGX35CF780I6N | EP1AGX20CF780I6N | EP1AGX20CF780C6N | EP1AGX20CF780C5N | EP1AGX20CF780I6 |
|---|---|---|---|---|---|---|
| Brand | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel | Altera / Intel |
| Package | 780-ball FineLine BGA (FCBGA) | 780-ball FineLine BGA (FCBGA) | 780-ball FineLine BGA (FCBGA) | 780-ball FineLine BGA (FCBGA) | 780-ball FineLine BGA (FCBGA) | 780-ball FineLine BGA (FCBGA) |
| Logic Elements | 33,520 | 33,500 | 20,060 | 20,060 | 20,060 | 20,060 |
| Transceivers / Speed | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps | 8 ch @ 3.125 Gbps |
| Process Node | 90 nm | 40 nm | 40 nm | 40 nm | 40 nm | 40 nm |
| Operating Temperature | 0C to +85C (commercial C6) | -40C to +100C (industrial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Lifecycle Status | Obsolete (Arria GX EOL) | Obsolete (Arria II GX) | Obsolete (Arria II GX) | Obsolete (Arria II GX) | Obsolete (Arria II GX) | Obsolete (Arria II GX) |
| RoHS | Compliant (N suffix) | Compliant (N suffix) | Compliant (N suffix) | Compliant (N suffix) | Compliant (N suffix) | Non-RoHS (no N suffix) |
주요 차별점
- Highest logic density in the Arria GX 780-FBGA family (vs EP1AGX20CF780I6N)
- Arria II GX (40 nm) migration available in same 780-BGA footprint (vs EP1AGX35CF780I6N)
- Industrial temperature variants available for harsh environments (vs EP1AGX20CF780C6N)
설계 노트
Estimated: at full transceiver utilization (8 channels @ 3.125 Gbps) and 75% logic toggling, junction power can exceed 5 W. The 780-ball FCBGA (29x29 mm) has theta_JA in the 15-20 C/W range on a JEDEC 4-layer test board, requiring at least a moderate copper pour or a heatsink for industrial-temperature operation. Use the Altera PowerPlay Early Power Estimator before RTL completion to budget thermal dissipation and validate regulator sizing. Always apply thermal interface material (TIM) if a discrete heatsink is used.
The 780-ball FCBGA uses a 1.0 mm ball pitch - the PCB must follow IPC-7351 land-pattern guidelines and use NSMD (non-solder-mask-defined) pads for best joint reliability. Stack-up should specify 4-6 mil laser-drilled microvias for breakout and a continuous GND plane on layer 2 to provide return paths for high-speed transceivers. Per JEDEC J-STD-020, the device is MSL3 (30C/60% RH floor life 168 hours) - bake-out is required if the factory floor exposure exceeds that window.
Transceiver channels require 100-ohm differential pairs routed with controlled impedance (typically 85-ohm on inner stripline layers, 90-ohm on microstrip) and length matching to within 5 mils within a channel and 50 mils across a group for protocols like PCIe. Keep AC-coupling capacitors close to the transmitter pins and provide solid GND return stitching vias every 200 mils along the trace route to minimize EMI and signal-integrity issues.
Do not assume the EP1AGX35DF780 can be hot-swapped or live-updated without verifying configuration scheme support. When migrating to Arria II GX (40 nm) on the same 780-BGA footprint, double-check pinout compatibility via the Altera pin migration tool - while the high-level ball map is similar, several transceiver supply pins and JTAG pin assignments changed between the two generations, and a naive swap will short power rails.
Estimated: VCCINT (core) typically 1.2 V and VCCIO (I/O banks) at 1.5/1.8/2.5/3.3 V depending on bank assignment. Always sequence supplies per Altera's recommended power-up sequence - VCCINT before VCCAUX before VCCIO - to prevent latch-up during board power ramp. Decouple each supply pin with 0.1 uF X7R ceramic placed within 100 mils, plus bulk decoupling of 10-100 uF tantalum or polymer per supply rail.
규정 준수 정보
RoHS compliance applies to 'N' suffix variants. AEC-Q100 not applicable - this is an industrial/communications FPGA, not an automotive-qualified part. Halogen-free status not published in distributor data.
