EP1AGX20CF780I6 - Arria GX FPGA, 20K LE, 341 I/O | Intel
Référence : EP1AGX20CF780I6 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2 650,00 |
| 100 | $240 | $24 000,00 |
| 500 | $215 | $107 500,00 |
| 1 000 | $195 | $195 000,00 |
EP1AGX20CF780I6 Présentation
A field-programmable gate array (FPGA) is a programmable semiconductor device that allows designers to configure its digital logic blocks, interconnect, and I/O cells after manufacture. FPGAs occupy the high-flexibility tier between discrete logic ICs and fixed-function ASICs in the digital design hierarchy: chip -> programmable logic -> FPGA -> CPLD. Arria GX specifically targets mid-range applications requiring embedded transceivers and moderate logic density, fitting between the lower-cost Cyclone family and the higher-end Stratix family.
The EP1AGX20CF780I6 features up to 4 embedded transceivers capable of data rates from 600 Mbps to 3.125 Gbps, supporting serial protocols such as PCI Express (x1/x4), Gigabit Ethernet, Serial RapidIO, and SerialLite II. The device also integrates dedicated DSP blocks for high-throughput signal processing, hardware multipliers, and phase-locked loops (PLLs) for clock management. Configuration is supported through passive serial (PS), fast passive parallel (FPP), and JTAG modes, with built-in decompression and decryption for bitstream security.
Architecturally, the EP1AGX20CF780I6 combines logic element granularity with high-speed serial interfaces, eliminating the need for external PHY chips in many protocol applications. The 90 nm process node delivers a balance between static power consumption and switching performance, and the industrial temperature range supports deployment in harsh-environment embedded systems. The flip-chip BGA package enables high I/O density with controlled impedance signal paths suitable for multi-gigabit serial links.
Typical applications include telecommunications line cards, industrial video processing, medical imaging systems, military and aerospace signal processing, and PCI Express endpoint cards. The combination of integrated transceivers and 20K logic elements makes this device suitable for protocol bridging, custom high-speed data acquisition, and DSP-accelerated image and signal pipelines.
When designing with this device, plan power distribution carefully - the 1.2 V core rail requires bulk decoupling close to the package, and the transceiver PLLs need isolated analog supply domains with ferrite-bead filtering. PCB layout must preserve 90 ohm differential impedance on all serial channels and meet length-matching constraints for source-synchronous buses. Configuration storage via EPCS or EPCQ serial flash should be sized for the compressed bitstream with overhead.
This page synthesizes distributor availability, parametric positioning within the Arria GX family, and practical design guidance that is not consolidated in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP1AGX20CF780I6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1AGX20CF780I6 (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Mounting Type, Logic Elements (LE), Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1AGX20CF780I6N
✅ Remplacement direct✓ En stock
$295 / unité
Voir la fiche technique →EP1AGX20CF780C6N
✅ Remplacement direct✓ En stock
$38.95 / unité
Voir la fiche technique →EP1AGX20CF780C6
✅ Remplacement direct✓ En stock
$175.4 / unité
Voir la fiche technique →EP1AGX20CF780C5N
✅ Remplacement direct✓ En stock
$305 / unité
Voir la fiche technique →EP1AGX20CF780I6 Valeurs maximales et caractéristiques électriques
| Family | Arria GX |
| Logic Elements (LE) | 21,580 |
| Number of LABs/CLBs | 1,079 |
| Total Embedded Memory | 1,229,184 bits |
| User I/O Pins | 341 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS |
| Package Type | 780-pin FC-FBGA (Fine-pitch Flip-chip BGA) |
| Température de fonctionnement | -40 C to +100 C (Industrial) |
| Speed Grade | I6 |
| Number of Transceivers | Up to 4 |
| Transceiver Data Rate | 600 Mbps to 3.125 Gbps |
| Configuration Modes | PS, FPP, JTAG |
| Type de montage | Surface Mount |
Guide de configuration des broches du EP1AGX20CF780I6 780-pin fc-fbga (fine-pitch flip-chip bga)
Configuration des broches du EP1AGX20CF780I6 (boîtier 780-pin fc-fbga (fine-pitch flip-chip bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1AGX20CF780I6.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1AGX20CF780I6 convient pour 6 applications: Telecommunications Line Cards, PCI Express Endpoint Cards, Industrial Video Processing, Medical Imaging Systems, Military and Aerospace Signal Processing, Protocol Bridging and Custom High-Speed I/O.
Telecommunications Line Cards
The EP1AGX20CF780I6 is well suited to telecommunications line cards that require mid-range logic density combined with multi-gigabit serial links. The four embedded transceivers support data rates from 600 Mbps to 3.125 Gbps, enabling protocols such as Gigabit Ethernet, Serial RapidIO, and SerialLite II directly on-chip, which removes the need for external PHY devices. With 21,580 logic elements and 1,229,184 bits of embedded RAM, designers can implement framing, packet processing, and traffic management alongside physical-layer functions. The 780-pin FC-FBGA package exposes 341 user I/O pins, providing ample parallel connectivity for backplane interfaces, control plane processors, and clock distribution. Industrial temperature grade allows deployment in unconditioned outdoor telecom cabinets.
Recommandé
PCI Express Endpoint Cards
The EP1AGX20CF780I6 supports PCI Express Gen1 operation at 2.5 Gbps per lane through its integrated transceivers, with up to four channels enabling x4 link widths. The hard IP for PCI Express PIPE interface simplifies PHY integration, while the embedded transceivers provide the required serializer/deserializer and clock-data recovery functions. With 21,580 logic elements, designers can implement endpoint controllers, DMA engines, and application logic on a single device. The 780-pin FC-FBGA footprint delivers 341 user I/O pins for memory expansion, board management controllers, and high-speed parallel peripherals. Industrial temperature grade supports deployment in server rooms and edge compute appliances.
Recommandé
Industrial Video Processing
Industrial video processing systems benefit from the EP1AGX20CF780I6 combination of DSP blocks, embedded memory, and high-speed serial transceivers. The 21,580 logic elements support multiple video pipelines running in parallel, while the dedicated multiplier blocks accelerate operations such as scaling, color-space conversion, and motion estimation. The 1,229,184 bits of embedded RAM provide line buffers and frame storage for high-definition streams. Transceivers operating up to 3.125 Gbps can carry uncompressed SDI or serialized Camera Link payloads, eliminating external serializer chips. The 780-pin FC-FBGA package supports 341 user I/O for DDR memory interfaces, video DACs, and control plane connectivity. Industrial temperature grade enables factory floor and outdoor surveillance deployments.
Recommandé
Medical Imaging Systems
Medical imaging equipment such as ultrasound scanners, endoscopy processors, and patient monitoring displays leverages the EP1AGX20CF780I6 for real-time image processing pipelines. The DSP blocks and hardware multipliers accelerate beamforming, FFTs, and image-filtering operations that are central to ultrasound signal paths. Embedded memory holds scanline data and intermediate frame buffers, reducing external memory pressure and lowering latency. The integrated transceivers at up to 3.125 Gbps transport digitized probe data and serialized display streams reliably across shielded cables. With 341 user I/O available on the 780-pin FC-FBGA package, the device interfaces to analog front ends, DDR memories, and embedded processors. Industrial temperature range suits operating-room equipment and ambulatory carts.
Recommandé
Military and Aerospace Signal Processing
Defense signal processing applications including radar front ends, electronic warfare subsystems, and avionics data concentrators take advantage of the EP1AGX20CF780I6 industrial temperature grade and high-density logic. The four transceivers enable multi-channel digital receiver and exciter interfaces, while the DSP and multiplier blocks deliver real-time FFT, pulse compression, and digital beamforming at high sample rates. Embedded memory supports fast access to coefficient tables and intermediate sample storage in pipelined architectures. The 780-pin FC-FBGA package provides 341 user I/O pins to interface with high-speed ADCs, DACs, and DDR memories used in radar capture chains. Industrial temperature grade enables deployment in airborne and shipboard environments where commercial-grade parts are unsuitable.
Recommandé
Protocol Bridging and Custom High-Speed I/O
Custom protocol bridge designs such as Serial RapidIO to Gigabit Ethernet converters, custom backplane concentrators, and proprietary high-speed links benefit from the EP1AGX20CF780I6 transceiver flexibility. Each of the four transceivers operates independently between 600 Mbps and 3.125 Gbps, allowing mixed protocol fan-out and clock-domain isolation within one device. The 21,580 logic elements and DSP blocks implement transport-layer processing, error correction, and rate adaptation. Embedded memory buffers data between asynchronous clock domains, simplifying protocol stack implementation. With 341 user I/O exposed on the 780-pin FC-FBGA package, designers can add LVDS and HSTL parallel side-channels for legacy interfaces without extra bridge chips. Industrial temperature grade supports outdoor and industrial cabinet installation.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1AGX20CF780I6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1AGX20CF780I6N | EP1AGX20CF780C6N | EP1AGX20CF780C6 | EP1AGX20CF780C5N |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-pin FC-FBGA | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same | 780-pin FC-FBGA - same |
| Logic Elements | 21,580 | 21,580 | 21,580 | 21,580 | 21,580 |
| Embedded Memory | 1,229,184 bits | 1,229,184 bits | 1,229,184 bits | 1,229,184 bits | 1,229,184 bits |
| User I/O | 341 | 341 | 341 | 341 | 341 |
| Temperature Grade | Industrial (-40 C to +100 C) | Industrial (-40 C to +100 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) |
| Speed Grade | I6 | I6 | C6 | C6 | C5 (one bin slower) |
| Pb-free Reflow (N suffix) | No | Yes | Yes | No | Yes |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industrial temperature grade at the same Arria GX silicon (vs EP1AGX20CF780C6N)
- One-bin faster speed grade over the C5N alternative (vs EP1AGX20CF780C5N)
- Pb-free reflow designation in the I6N sibling (vs EP1AGX20CF780I6N)
Notes de conception
The Arria GX core runs from a 1.2 V supply that must deliver the inrush current required during configuration plus steady-state operating current. Estimated: at 100% logic utilization with all four transceivers active, the 1.2 V rail can demand 2.5-3.5 A on the EP1AGX20CF780I6. Use a buck regulator with at least 5 A peak capability and place four 22 uF ceramic + two 470 uF bulk capacitors within 25 mm of the package. Provide separate analog supply domains for each transceiver PLL, isolated with ferrite beads and filtered with 10 uF + 0.1 uF caps, because PLL supply noise directly degrades jitter performance.
The 780-pin FC-FBGA package demands an 8- or 10-layer stack-up with a continuous ground plane beneath the BGA footprint. Transceiver channels require 90 ohm differential controlled impedance (100 ohm for PCIe), and intra-pair skew must be held below 1 ps per cm of mismatch. Via-in-pad with epoxy-filled and planarized plating is recommended for BGA breakouts to maintain the return path. Match differential pair lengths to within 0.127 mm (5 mil) on the same layer, and route over an unbroken reference plane with no signal layer transitions crossing splits.
Do not reuse a 780-pin FC-FBGA footprint for the 484-pin variant without verifying the land pattern - the two packages have different ball pitches and total pad counts, and forcing the smaller part into the larger footprint creates unrecoverable solder defects. Estimated: reflow profile should follow JEDEC J-STD-020 MSL-3 handling for FC-BGA with peak temperature below 245 C for Pb-free variants. Always program the configuration bitstream with a unique AES-128 key before deployment to prevent cloning, and validate the bitstream against the Quartus II 7.2 / 9.0 device support files that target this silicon revision.
Informations de conformité
RoHS / REACH compliance data was not present in the Verified Web Data for EP1AGX20CF780I6 - the Pb-free N-suffix variants (EP1AGX20CF780I6N) are more likely to be RoHS compliant than the non-N suffix parts, but this should be verified against the manufacturer declaration before use in RoHS-restricted regions. AEC-Q100 does not apply to FPGAs of this class.
