EP1AGX50DF1152C4N - Arria GX FPGA, 50K LE, 1152-BGA | Altera
Référence : EP1AGX50DF1152C4N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $220.5 | $2 205,00 |
| 100 | $196 | $19 600,00 |
| 500 | $176.4 | $88 200,00 |
| 1 000 | $156.8 | $156 800,00 |
EP1AGX50DF1152C4N Présentation
An FPGA (Field-Programmable Gate Array) is a type of programmable logic IC that engineers configure after manufacture to implement arbitrary digital circuits. FPGAs sit in the broader taxonomy of digital logic ICs -> programmable logic -> semiconductor IC. Arria GX specifically targets cost-sensitive applications requiring moderate transceiver counts combined with substantial logic and DSP resources, positioning between the low-power Cyclone family and the high-performance Stratix family in Altera's portfolio.
Key differentiating features of this variant include the C4 speed grade (commercial, -4), the 1152-ball FBGA package, an industrial operating temperature range, and the N suffix indicating lead-free / RoHS-compliant assembly. The device supports LVDS, LVTTL, LVCMOS, HSTL, and SSTL I/O standards with up to 24 transceivers in the family aggregate, though the EP1AGX50 implementation provides the transceiver count appropriate to its logic density tier.
Typical applications include PCIe x1/x4 endpoint implementations, gigabit Ethernet MACs, HD-SDI video bridging, telecom backplane aggregation, and DSP co-processing. The combination of hardware multipliers and dedicated transceiver blocks makes it well-suited for protocols such as Serial RapidIO and Custom Interconnect.
When designing with this device, ensure the PCB accommodates the 1152-ball BGA land pattern with appropriate microvia stack-up, and that the Quartus II design toolchain (13.0 or later with Arria GX device support) is available for synthesis and place-and-route.
This page synthesizes distributor availability, package-level drop-in alternatives from the same Arria GX family, and practical FPGA selection notes that the manufacturer datasheet alone does not provide.
Alternatives de remplacement direct pour EP1AGX50DF1152C4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1AGX50DF1152C4N (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Logic Elements, Operating Temperature, Configuration Method.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1AGX50DF1152C6N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$270 / unité
Voir la fiche technique →EP1AGX50DF1152I4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$185.25 / unité
Voir la fiche technique →EP1AGX50DF1152I6N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$105 / unité
Voir la fiche technique →EP1AGX50CF484C6N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$198 / unité
Voir la fiche technique →EP1AGX35DF780I6N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$171 / unité
Voir la fiche technique →5CSXFC6D6F31C8N
✅ Remplacement direct✓ En stock
$355 / unité
Voir la fiche technique →EP1AGX50DF1152C4N Valeurs maximales et caractéristiques électriques
| Family | Arria GX |
| Logic Elements | 50,160 |
| Total RAM Bits | 2,475,072 |
| Number of Logic Elements / Cells | 50160 |
| Total RAM Bits | 2475072 |
| Voltage - Supply | 1.2 V core (typical) |
| Température de fonctionnement | 0C to +85C (commercial, C grade) |
| Boîtier | 1152-BBGA, FC-FBGA |
| Type de montage | Surface Mount |
| Speed Grade | C4 (commercial, -4) |
| Statut RoHS | Compliant (lead-free) |
| Transceivers | Up to 8 channels, up to 3.125 Gbps |
Guide de configuration des broches du EP1AGX50DF1152C4N 1152-bbga, fc-fbga
Configuration des broches du EP1AGX50DF1152C4N (boîtier 1152-bbga, fc-fbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1AGX50DF1152C4N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1AGX50DF1152C4N convient pour 6 applications: PCIe Gen1 Endpoint Cards, Gigabit Ethernet Aggregation / Switching, HD-SDI Video Bridging and Processing, Telecom Backplane Aggregation (Serial RapidIO / Custom Interconnect), DSP Co-Processing for Wireless Baseband, Industrial Machine Vision and Imaging Pipelines.
PCIe Gen1 Endpoint Cards
The EP1AGX50DF1152C4N's integrated PCIe hard IP block and up to 3.125 Gbps transceivers make it a natural fit for PCIe x1 and x4 endpoint implementations. With 50,160 logic elements available, designers can implement the PCIe TLP layer, DMA engines, and application logic on a single device. The 1152-BGA package provides the differential transceiver pairs needed for x4 lane operation without requiring external PHY silicon, reducing both BOM cost and PCB area compared to FPGA-plus-external-PHY solutions.
Recommandé
Gigabit Ethernet Aggregation / Switching
Implementing multi-port Gigabit Ethernet MACs and switch fabrics is a classic use case for Arria GX devices. The EP1AGX50DF1152C4N can support up to 8 SGMII/1000BASE-X links simultaneously, with logic elements reserved for L2/L3 forwarding, ACL tables, and queue management. The 2.4 Mbits of embedded RAM blocks accommodate packet buffering and routing tables, while the 514 embedded 18x18 multipliers enable wire-speed hash-based lookups.
Recommandé
HD-SDI Video Bridging and Processing
Broadcast video applications including HD-SDI (1.485 Gbps and 2.97 Gbps) serializer/deserializer, frame synchronizers, and format converters map cleanly onto Arria GX transceivers. The EP1AGX50DF1152C4N's 3.125 Gbps transceiver headroom comfortably exceeds SMPTE 292M and 424M data rates, while the LE fabric handles ANC processing, audio embedding, and genlock logic. The commercial temperature grade is suitable for controlled broadcast studio environments.
Recommandé
Telecom Backplane Aggregation (Serial RapidIO / Custom Interconnect)
Telecommunications backplanes aggregating serial links at 1.25-3.125 Gbps benefit from Arria GX's deterministic transceiver latency and protocol flexibility. The EP1AGX50DF1152C4N implements Serial RapidIO physical layers with logic elements reserved for switch fabric and congestion management. With eight transceiver channels, designers can build 8-port aggregation line cards eliminating discrete SERDES components.
Recommandé
DSP Co-Processing for Wireless Baseband
The 514 embedded 18x18 multipliers deliver up to ~38 GMACs of DSP throughput, enabling channelization, FFT/iFFT, and FEC decoding for wireless baseband signal chains. The EP1AGX50DF1152C4N is well-matched to WCDMA, LTE PHY, and proprietary radio waveforms where the transceiver front end feeds digital processing in the FPGA. Embedded RAM blocks (2.4 Mbits) store sample buffers and constellation tables.
Recommandé
Industrial Machine Vision and Imaging Pipelines
Machine vision systems using Camera Link, CoaXPress, or GigE Vision interfaces leverage the EP1AGX50DF1152C4N's transceiver channels for high-speed image acquisition. The LE fabric implements Bayer demosaicing, color space conversion, and feature extraction in real time, while 2.4 Mbits of block RAM accommodates line buffers and lookup tables. Industrial temperature variants extend deployment to factory automation environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1AGX50DF1152C4N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1AGX50DF1152C6N | EP1AGX50DF1152I4N | EP1AGX50CF484C6N | 5CSXFC6D6F31C8N |
|---|---|---|---|---|---|
| Package | 1152-BBGA, FC-FBGA | 1152-BBGA, FC-FBGA | 1152-BBGA, FC-FBGA | 484-FBGA | 896-BGA / 1152-BGA (family) |
| Brand | Altera | Altera | Altera | Altera | Altera / Intel |
| Family | Arria GX | Arria GX | Arria GX | Arria GX | Cyclone V SX |
| Logic Elements | 50,160 | 50,160 | 50,160 | 50,160 | 110,000 |
| Speed Grade | C4 (commercial, -4) | C6 (-6) | I4 (industrial, -4) | C6 (-6) | C8 (-8) |
| Embedded RAM | 2,475,072 bits | 2,475,072 bits | 2,475,072 bits | 2,475,072 bits | 5,662,720 bits |
| Transceivers | Up to 8 ch / 3.125 Gbps | Up to 8 ch / 3.125 Gbps | Up to 8 ch / 3.125 Gbps | Reduced count (484-BGA) | Up to 6 ch / 3.125 Gbps |
| Lifecycle Status | NRND | NRND | NRND | NRND | Active |
Principaux différenciateurs
- Higher speed grade available in same package (vs EP1AGX50DF1152C6N)
- Industrial temperature variant for harsh environments (vs EP1AGX50DF1152I4N)
- Newer process and active lifecycle alternative (vs 5CSXFC6D6F31C8N)
Notes de conception
The 1152-BGA package (FC-FBGA) demands a high-density PCB stack-up with laser-drilled microvias and fine-pitch escape routing. Use at minimum a 4-1-4 build-up with 1 oz copper outer layers. Maintain 50 ohm single-ended and 100 ohm differential impedance control on transceiver channels, with length matching within +/-5 mils for PCIe lanes. Decoupling requires approximately 200 capacitors per device (0.1uF, 0.01uF, and bulk 22uF) distributed beneath the BGA shadow.
Arria GX is NRND as of 2026. New programs should NOT select this family for long-term production; instead, evaluate Cyclone V GX (5CGXFC7C7F23C8N) or Cyclone V SX (5CSXFC6D6F31C8N) which offer more LEs, lower power, and active lifecycle. Existing EP1AGX50 designs should plan a last-time-buy or migrate to Cyclone V while IP cores (especially PCIe, DDR controllers) can be ported with Quartus II-to-Quartus Prime tooling.
Estimated power consumption at 50% logic utilization, 4 active transceivers, and 100 MHz core clock is approximately 5-7W. The 1152-BGA requires a thermal management strategy: either an exposed pad heatsink with thermal interface material or substantial PCB copper pours connected to the BGA's center balls. Junction temperature must stay below 100C commercial or 125C industrial; design margin of 15-20C is recommended.
Place the FPGA on the PCB such that transceiver channel balls route directly to edge connectors or high-speed serial headers without stubs. Reference clock inputs (REFCLK) require guarded differential routing with impedance-controlled traces and AC-coupling capacitors as close to the BGA as possible. Avoid routing LVDS or general-purpose I/O underneath the BGA shadow to prevent crosstalk into sensitive analog transceiver regions.
Informations de conformité
RoHS compliant per N suffix in MPN. Halogen-free status not explicitly stated in verified web data. NRND lifecycle per Intel/Altera product lifecycle policy.
