EP1AGX50DF1152C4N - Arria GX FPGA, 50K LE, 1152-BGA | Altera
MPN: EP1AGX50DF1152C4N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220.5 | $2,205.00 |
| 100 | $196 | $19,600.00 |
| 500 | $176.4 | $88,200.00 |
| 1,000 | $156.8 | $156,800.00 |
Drop-in alternatives for EP1AGX50DF1152C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1AGX50DF1152C6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$270 / Unit
View Datasheet →EP1AGX50DF1152I4N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$185.25 / Unit
View Datasheet →EP1AGX50DF1152I6N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$105 / Unit
View Datasheet →EP1AGX50CF484C6N
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View Datasheet →EP1AGX35DF780I6N
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$171 / Unit
View Datasheet →5CSXFC6D6F31C8N
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$295 / Unit
View Datasheet →EP1AGX50DF1152C4N Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements | 50,160 |
| Total RAM Bits | 2,475,072 |
| Number of Logic Elements / Cells | 50160 |
| Total RAM Bits | 2475072 |
| Voltage - Supply | 1.2 V core (typical) |
| Operating Temperature | 0C to +85C (commercial, C grade) |
| Package | 1152-BBGA, FC-FBGA |
| Mounting Type | Surface Mount |
| Speed Grade | C4 (commercial, -4) |
| RoHS Status | Compliant (lead-free) |
| Transceivers | Up to 8 channels, up to 3.125 Gbps |
EP1AGX50DF1152C4N 1152-bbga, fc-fbga Pin Configuration Guide
Complete pinout information for EP1AGX50DF1152C4N (1152-bbga, fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX50DF1152C4N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX50DF1152C4N is suitable for 6 applications: PCIe Gen1 Endpoint Cards, Gigabit Ethernet Aggregation / Switching, HD-SDI Video Bridging and Processing, Telecom Backplane Aggregation (Serial RapidIO / Custom Interconnect), DSP Co-Processing for Wireless Baseband, Industrial Machine Vision and Imaging Pipelines.
PCIe Gen1 Endpoint Cards
The EP1AGX50DF1152C4N's integrated PCIe hard IP block and up to 3.125 Gbps transceivers make it a natural fit for PCIe x1 and x4 endpoint implementations. With 50,160 logic elements available, designers can implement the PCIe TLP layer, DMA engines, and application logic on a single device. The 1152-BGA package provides the differential transceiver pairs needed for x4 lane operation without requiring external PHY silicon, reducing both BOM cost and PCB area compared to FPGA-plus-external-PHY solutions.
Recommended
Gigabit Ethernet Aggregation / Switching
Implementing multi-port Gigabit Ethernet MACs and switch fabrics is a classic use case for Arria GX devices. The EP1AGX50DF1152C4N can support up to 8 SGMII/1000BASE-X links simultaneously, with logic elements reserved for L2/L3 forwarding, ACL tables, and queue management. The 2.4 Mbits of embedded RAM blocks accommodate packet buffering and routing tables, while the 514 embedded 18x18 multipliers enable wire-speed hash-based lookups.
Recommended
HD-SDI Video Bridging and Processing
Broadcast video applications including HD-SDI (1.485 Gbps and 2.97 Gbps) serializer/deserializer, frame synchronizers, and format converters map cleanly onto Arria GX transceivers. The EP1AGX50DF1152C4N's 3.125 Gbps transceiver headroom comfortably exceeds SMPTE 292M and 424M data rates, while the LE fabric handles ANC processing, audio embedding, and genlock logic. The commercial temperature grade is suitable for controlled broadcast studio environments.
Recommended
Telecom Backplane Aggregation (Serial RapidIO / Custom Interconnect)
Telecommunications backplanes aggregating serial links at 1.25-3.125 Gbps benefit from Arria GX's deterministic transceiver latency and protocol flexibility. The EP1AGX50DF1152C4N implements Serial RapidIO physical layers with logic elements reserved for switch fabric and congestion management. With eight transceiver channels, designers can build 8-port aggregation line cards eliminating discrete SERDES components.
Recommended
DSP Co-Processing for Wireless Baseband
The 514 embedded 18x18 multipliers deliver up to ~38 GMACs of DSP throughput, enabling channelization, FFT/iFFT, and FEC decoding for wireless baseband signal chains. The EP1AGX50DF1152C4N is well-matched to WCDMA, LTE PHY, and proprietary radio waveforms where the transceiver front end feeds digital processing in the FPGA. Embedded RAM blocks (2.4 Mbits) store sample buffers and constellation tables.
Recommended
Industrial Machine Vision and Imaging Pipelines
Machine vision systems using Camera Link, CoaXPress, or GigE Vision interfaces leverage the EP1AGX50DF1152C4N's transceiver channels for high-speed image acquisition. The LE fabric implements Bayer demosaicing, color space conversion, and feature extraction in real time, while 2.4 Mbits of block RAM accommodates line buffers and lookup tables. Industrial temperature variants extend deployment to factory automation environments.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX50DF1152C4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX50DF1152C6N | EP1AGX50DF1152I4N | EP1AGX50CF484C6N | 5CSXFC6D6F31C8N |
|---|---|---|---|---|---|
| Package | 1152-BBGA, FC-FBGA | 1152-BBGA, FC-FBGA | 1152-BBGA, FC-FBGA | 484-FBGA | 896-BGA / 1152-BGA (family) |
| Brand | Altera | Altera | Altera | Altera | Altera / Intel |
| Family | Arria GX | Arria GX | Arria GX | Arria GX | Cyclone V SX |
| Logic Elements | 50,160 | 50,160 | 50,160 | 50,160 | 110,000 |
| Speed Grade | C4 (commercial, -4) | C6 (-6) | I4 (industrial, -4) | C6 (-6) | C8 (-8) |
| Embedded RAM | 2,475,072 bits | 2,475,072 bits | 2,475,072 bits | 2,475,072 bits | 5,662,720 bits |
| Transceivers | Up to 8 ch / 3.125 Gbps | Up to 8 ch / 3.125 Gbps | Up to 8 ch / 3.125 Gbps | Reduced count (484-BGA) | Up to 6 ch / 3.125 Gbps |
| Lifecycle Status | NRND | NRND | NRND | NRND | Active |
Key Differentiators
- Higher speed grade available in same package (vs EP1AGX50DF1152C6N)
- Industrial temperature variant for harsh environments (vs EP1AGX50DF1152I4N)
- Newer process and active lifecycle alternative (vs 5CSXFC6D6F31C8N)
Design Notes
The 1152-BGA package (FC-FBGA) demands a high-density PCB stack-up with laser-drilled microvias and fine-pitch escape routing. Use at minimum a 4-1-4 build-up with 1 oz copper outer layers. Maintain 50 ohm single-ended and 100 ohm differential impedance control on transceiver channels, with length matching within +/-5 mils for PCIe lanes. Decoupling requires approximately 200 capacitors per device (0.1uF, 0.01uF, and bulk 22uF) distributed beneath the BGA shadow.
Arria GX is NRND as of 2026. New programs should NOT select this family for long-term production; instead, evaluate Cyclone V GX (5CGXFC7C7F23C8N) or Cyclone V SX (5CSXFC6D6F31C8N) which offer more LEs, lower power, and active lifecycle. Existing EP1AGX50 designs should plan a last-time-buy or migrate to Cyclone V while IP cores (especially PCIe, DDR controllers) can be ported with Quartus II-to-Quartus Prime tooling.
Estimated power consumption at 50% logic utilization, 4 active transceivers, and 100 MHz core clock is approximately 5-7W. The 1152-BGA requires a thermal management strategy: either an exposed pad heatsink with thermal interface material or substantial PCB copper pours connected to the BGA's center balls. Junction temperature must stay below 100C commercial or 125C industrial; design margin of 15-20C is recommended.
Place the FPGA on the PCB such that transceiver channel balls route directly to edge connectors or high-speed serial headers without stubs. Reference clock inputs (REFCLK) require guarded differential routing with impedance-controlled traces and AC-coupling capacitors as close to the BGA as possible. Avoid routing LVDS or general-purpose I/O underneath the BGA shadow to prevent crosstalk into sensitive analog transceiver regions.
Compliance Information
RoHS compliant per N suffix in MPN. Halogen-free status not explicitly stated in verified web data. NRND lifecycle per Intel/Altera product lifecycle policy.
