EP1AGX50DF1152I5N - Arria GX FPGA 50K LE | Altera | 1152-BBGA
Référence : EP1AGX50DF1152I5N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265.5 | $2 655,00 |
| 100 | $232.4 | $23 240,00 |
| 500 | $199.5 | $99 750,00 |
| 1 000 | $178 | $178 000,00 |
EP1AGX50DF1152I5N Présentation
A field programmable gate array (FPGA) is a programmable logic device that allows designers to configure arbitrary digital circuits using a matrix of configurable logic blocks (CLBs), embedded memory, DSP slices, and high-speed I/O. FPGAs sit between ASICs (high NRE, fixed function) and microcontrollers (software-programmed, fixed hardware) in the design hierarchy, offering parallel hardware execution, sub-nanosecond latency, and in-system reprogrammability. The Arria GX family specifically targets mid-range applications requiring integrated multi-gigabit transceivers without the cost of full Stratix-class silicon.
Key features of the EP1AGX50DF1152I5N include 50,160 logic elements organized across 2,508 logic array blocks (LABs), 4,257 Kbit of embedded memory, embedded 3.125 Gbps transceivers for serial connectivity, 514 user I/O pins, and high-speed DSP blocks for digital signal processing. The part operates on a 1.2 V core supply with separate PLL and transceiver power domains, and supports configuration via JTAG, passive serial, or fast passive parallel modes. The 1152-ball flip-chip BGA delivers the I/O density required by mid-range communications and video processing designs.
Architecturally, the device uses a CMOS SRAM-based configuration cell, providing unlimited reconfigurability via external configuration memory. The transceiver blocks support PCIe, Gigabit Ethernet, Serial RapidIO, and other serial protocols at data rates up to 3.125 Gbps. Internal clock networks with up to 12 PLLs enable fine-grained timing control across the fabric.
Typical applications include high-speed serial interface bridging, industrial video processing, telecom line cards, military/aerospace signal processing, and FPGA-based protocol offload engines. The integrated transceivers make the Arria GX particularly attractive where separate PHY chips would otherwise be required.
When designing with this part, plan for the 1152-ball BGA footprint early; thermal management requires attention because the device dissipates several watts in transceiver-heavy designs. Use the Altera Quartus II design suite (version supporting Arria GX) for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design guidance not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP1AGX50DF1152I5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1AGX50DF1152I5N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Configuration Method, Transceivers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1AGX50DF1152C6N
✅ Remplacement direct✓ En stock
$270 / unité
Voir la fiche technique →EP1AGX50DF1152I6N
✅ Remplacement direct✓ En stock
$105 / unité
Voir la fiche technique →EP1AGX50DF1152C5N
✅ Remplacement direct✓ En stock
$195 / unité
Voir la fiche technique →EP1AGX50DF1152C4N
✅ Remplacement direct✓ En stock
$156.8 / unité
Voir la fiche technique →EP1AGX50DF1152I4N
✅ Remplacement direct✓ En stock
$185.25 / unité
Voir la fiche technique →EP1AGX50DF1152
✅ Remplacement direct✓ En stock
$195 / unité
Voir la fiche technique →EP1AGX50DF1152I5N Valeurs maximales et caractéristiques électriques
| Family | Arria GX |
| Logic Elements | 50160 |
| Logic Array Blocks (LABs) | 2508 |
| Embedded Memory | 2475072 bits (approximately 2420 Kbit) |
| Total Memory Bits | 2475072 |
| Number of I/O | 514 |
| Transceiver Data Rate | 3.125 Gbps |
| Supply Voltage Core | 1.2 V |
| Boîtier | 1152-BBGA (FineLine BGA, flip-chip) |
| Package Code | F1152 |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Temperature Grade | I (Industrial) |
| Speed Grade | 5 |
| Configuration Method | SRAM, JTAG, Passive Serial, Fast Passive Parallel |
| Statut RoHS | Compliant (lead-free) |
| Type de montage | Surface Mount |
Guide de configuration des broches du EP1AGX50DF1152I5N f1152
Configuration des broches du EP1AGX50DF1152I5N (boîtier f1152). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1AGX50DF1152I5N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1AGX50DF1152I5N convient pour 6 applications: Telecom Line Card Aggregation, Industrial Video Processing, Military/Aerospace Signal Processing, PCIe Gen1 Endpoint Card, FPGA-Based Protocol Offload Engine, Test & Measurement Instrumentation.
Telecom Line Card Aggregation
The EP1AGX50DF1152I5N fits telecom line-card aggregation designs because it integrates 3.125 Gbps transceivers that map directly to backplane SERDES links without external PHY silicon. The 50,160 logic elements and 2,475 Kbit of embedded memory support packet classification, queue management, and traffic shaping for OC-48/STM-16 multi-port aggregation. Compared with a discrete FPGA + PHY architecture, the integrated transceivers reduce BOM cost by 25-40% and shrink the design footprint by approximately 30% on the line card PCB.
Recommandé
Industrial Video Processing
The EP1AGX50DF1152I5N suits industrial video processing designs such as broadcast routers, multi-channel SDI switches, and machine-vision frame grabbers. Its 3.125 Gbps transceivers handle SD-SDI, HD-SDI, and 3G-SDI serial video streams directly, while 514 user I/O pins connect to parallel camera-link interfaces and HDMI/DVI bridges. The industrial temperature grade (-40C to +100C) allows deployment in factory-floor equipment and outdoor broadcast installations where ambient temperatures exceed commercial ranges.
Recommandé
Military/Aerospace Signal Processing
The EP1AGX50DF1152I5N is qualified for military and aerospace signal processing platforms that require industrial-temperature-grade components and deterministic latency. Its 50,160 logic elements support radar pulse compression, electronic-warfare channelization, and Software Defined Radio (SDR) baseband processing where the 3.125 Gbps transceivers interface with RF ADC/DAC digital data links. The Altera Arria GX architecture is well-documented in defense reference designs, and the part is widely available through defense-grade component suppliers.
Recommandé
PCIe Gen1 Endpoint Card
The EP1AGX50DF1152I5N works well as a PCIe Gen1 endpoint FPGA card because its 3.125 Gbps transceivers include a hardened PCIe PHY supporting x1, x4, and x8 lane configurations. Designers implement protocol layers (transaction layer, data link layer) in fabric using the Altera PCIe IP core, while the 50K logic elements and 514 I/O pins support downstream interface logic such as DDR2/3 controller, DMA engines, and proprietary I/O expansion. Industrial temperature grade allows deployment in server rooms with constrained cooling.
Recommandé
FPGA-Based Protocol Offload Engine
The EP1AGX50DF1152I5N serves as a protocol offload engine for industrial networks that need hardware-accelerated parsing and forwarding of Serial RapidIO, Ethernet, or proprietary serial protocols. Its 50K logic elements handle full protocol stacks while the integrated transceivers eliminate external PHY cost. The 2,475 Kbit of embedded memory buffers packets between processing stages, and the 514 user I/O pins connect to host CPUs via parallel buses or high-speed serial links.
Recommandé
Test & Measurement Instrumentation
The EP1AGX50DF1152I5N suits test and measurement instruments such as logic analyzers, protocol analyzers, and high-speed digitizers that need flexible parallel and serial I/O combined with real-time DSP processing. Its 514 user I/O pins capture parallel data buses up to 32 bits wide at hundreds of MHz, while the 3.125 Gbps transceivers acquire serial protocol data with deep on-chip memory for trace buffering. The DSP blocks accelerate FFT, FIR filtering, and modulation analysis in real time.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1AGX50DF1152I5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1AGX50DF1152C6N | EP1AGX50DF1152I6N | EP1AGX50DF1152C5N | EP1AGX50DF1152I4N | EP1AGX50DF1152C4N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-BBGA (F1152) | 1152-BBGA (F1152) - same | 1152-BBGA (F1152) - same | 1152-BBGA (F1152) - same | 1152-BBGA (F1152) - same | 1152-BBGA (F1152) - same |
| Logic Elements | 50160 | 50160 | 50160 | 50160 | 50160 | 50160 |
| Logic Array Blocks | 2508 | 2508 | 2508 | 2508 | 2508 | 2508 |
| Embedded Memory | 2475072 bits | 2475072 bits | 2475072 bits | 2475072 bits | 2475072 bits | 2475072 bits |
| User I/O | 514 | 514 | 514 | 514 | 514 | 514 |
| Transceiver Data Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| Operating Temperature | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
| Speed Grade | 5 | 6 (faster) | 6 (faster) | 5 (same) | 4 (slower) | 4 (slower) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Industrial temperature grade with -40C to +100C support (vs EP1AGX50DF1152C6N)
- Higher Fmax timing margin than speed grade 4 variants (vs EP1AGX50DF1152I4N)
- Large 1152-ball BGA delivers 514 user I/O without multiplexing (vs EP1AGX50CF484I6N (F484 BGA))
- Balanced performance-cost option versus faster speed grades (vs EP1AGX50DF1152I6N)
Notes de conception
The EP1AGX50DF1152I5N dissipates approximately 5-8 W under typical industrial workloads with transceivers active. The F1152 FineLine BGA exposes a large thermal die-attach pad on the bottom side, which must be soldered to a PCB thermal plane with multiple thermal vias to the inner copper layers. Per the Arria GX datasheet thermal management section, the F1152 package without airflow requires at least 4 layer PCB stack-up with a continuous ground/thermal pour; designers targeting continuous 100C ambient should specify industrial heatsink attachment.
The 1152-ball FineLine BGA uses a 1.0 mm pitch, requiring HDI PCB technology with laser-drilled microvias or via-in-pad construction for the inner rows. Per Altera Arria GX hardware design guidelines, escape routing from the inner rows is impossible without microvias on a 6-layer board; 8-10 layer stack-up is recommended. Decoupling capacitors must be placed within 50 mils of every power pin pair, with a bulk 470 uF tantalum or polymer capacitor near the device. Differential transceiver pairs require 100 ohm differential impedance with intra-pair length matching under 5 mil.
A common pitfall when designing with the EP1AGX50DF1152I5N is the configuration mode selection: this part supports JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), and Active Serial (AS) modes via dedicated configuration pins. Per the Arria GX configuration handbook, failing to properly strap the MSEL pins at boot leaves the device in an undefined state and can cause intermittent boot failures. Another frequent issue is leaving unused transceiver channels floating - they must be tied to VCCR_PC or VCCE_PC through the recommended bias network or they will leak and degrade signal integrity on adjacent active channels.
Informations de conformité
RoHS compliant per Altera/Intel environmental statement; F1152 BGA uses lead-free solder balls (SAC305/SAC405 alloy). AEC-Q100 not applicable - this is an FPGA, not an automotive-grade IC. Halogen-free status not explicitly stated in available data.
