EP1AGX60CF484I6N - Arria GX FPGA, 60K LE, 484-FBGA | Intel | Altera
Référence : EP1AGX60CF484I6N ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $615.3 | $615,30 |
| 10 | $580.5 | $5 805,00 |
| 100 | $542 | $54 200,00 |
| 250 | $510.75 | $127 687,50 |
| 500 | $485.25 | $242 625,00 |
EP1AGX60CF484I6N Présentation
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows engineers to implement custom digital circuits after manufacturing. The Arria GX family belongs to Intel's mid-range FPGA portfolio, positioned between the lower-cost Cyclone series and the high-performance Stratix series. Arria GX FPGAs are widely deployed in applications requiring both rich logic capacity and multi-gigabit serial transceivers, including wireless infrastructure, video processing, and high-speed serial interface bridging.
Key features include up to 229 user I/O pins, 8 transceivers operating at 3.125 Gbps, embedded memory, and DSP blocks for signal processing. The 3.125 Gbps serial transceivers enable protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI. Combined with the 484-ball FCBGA package, the device provides ample routing density while meeting high-speed signal-integrity requirements.
Architecture-wise, the Arria GX family uses a SRAM-based programmable logic fabric with built-in transceiver blocks, PLL-based clock management, and embedded memory blocks. This architecture supports high-bandwidth parallel processing while integrating high-speed serial I/O that historically required external PHY devices.
Typical applications include telecommunications base station backhaul, broadcast video routing, medical imaging acceleration, military secure communications, and high-end industrial control. The industrial temperature grade makes it suitable for outdoor or extended-environment installations.
When designing with this device, ensure that the PCB BGA fanout, breakout via design, and high-speed serial channel simulation are completed before layout. Power sequencing requirements must be respected, and the configuration scheme (JTAG, Active Serial, or Passive Parallel) must match your design's boot requirements.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP1AGX60CF484I6N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1AGX60CF484I6N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Embedded Memory, Transceiver Data Rate, MSL Level.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1AGX60CF484C8N
✅ Remplacement direct✓ En stock
$195 / unité
Voir la fiche technique →EP1AGX60CF484C7N
✅ Remplacement direct✓ En stock
$185 / unité
Voir la fiche technique →EP1AGX60CF484C6N
✅ Remplacement direct✓ En stock
$294.4 / unité
Voir la fiche technique →EP1AGX50CF484I6N
✅ Remplacement direct✓ En stock
$504.158 / unité
Voir la fiche technique →EP1AGX50CF484I6
✅ Remplacement direct✓ En stock
$275 / unité
Voir la fiche technique →EP1AGX60CF484I6N Valeurs maximales et caractéristiques électriques
| Series | Arria GX |
| Family Name | Arria GX FPGA |
| Logic Elements (LE) | 60,000 |
| Logic Array Blocks (LABs) | 3,005 |
| Number of I/O | 229 |
| Number of Logic Array Blocks | 60,100 |
| Embedded Memory | 2,528,640 bits |
| Transceiver Data Rate | 3.125 Gbps |
| Package Type | 484-BBGA (FCBGA) |
| Package Pin Count | 484 |
| Type de montage | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial |
| Plage de température de fonctionnement | -40C to +100C |
| Speed Grade | 6 |
| Process Technology | SRAM-based CMOS |
| Configuration Method | JTAG / Active Serial / Passive Parallel |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du EP1AGX60CF484I6N 484
Configuration des broches du EP1AGX60CF484I6N (boîtier 484). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1AGX60CF484I6N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1AGX60CF484I6N convient pour 6 applications: Telecommunications Backhaul and Base Station, Broadcast Video Routing and Processing, High-Speed Data Acquisition Systems, Industrial Motion Control and Robotics, Military and Aerospace Communications, Medical Imaging Acceleration.
Telecommunications Backhaul and Base Station
The EP1AGX60CF484I6N is well suited for wireless base station backhaul links because its 3.125 Gbps transceivers natively handle protocols such as OBSAI RP3, CPRI, and Serial RapidIO. The 60,000 logic elements provide headroom for PHY-layer digital signal processing (DFE, equalization, and rate adaptation) without external ASSPs. Industrial temperature grade (-40C to +100C) enables outdoor radio unit (RU) and tower-mounted deployments. The 484-FCBGA package supports the high pin density required for parallel backplane interfaces plus multiple SFP/SFP+ cages.
Recommandé
Broadcast Video Routing and Processing
The 60,000 logic elements and 2.5 Mbit of embedded memory allow the EP1AGX60CF484I6N to implement multi-channel SD/HD/3G-SDI routers, format converters, and frame synchronizers. The 229 user I/O pins can drive up to 8-12 bidirectional SDI links plus embedded audio embedders/de-embedders. Industrial temperature grade suits studio and outside-broadcast environments. Compared to ASSP video crosspoints, the FPGA-based design lets broadcasters add new formats (4K, HDR) without board respin.
Recommandé
High-Speed Data Acquisition Systems
Industrial and scientific data acquisition cards use the EP1AGX60CF484I6N's 3.125 Gbps transceivers to aggregate ADC sample streams into FPGA fabric for real-time digital downconversion (DDC), FFT processing, and PCIe host transfer. The 2.5 Mbit embedded memory buffers intermediate FFT bins before DMA transfer. The 484-ball BGA provides clean signal integrity for the LVDS/serial ADC interfaces. The industrial temperature grade supports deployment in factory-floor or airborne test racks.
Recommandé
Industrial Motion Control and Robotics
Multi-axis motion controllers use the EP1AGX60CF484I6N to implement EtherCAT, Profinet, or SERCOS III master stacks alongside custom servo loops. The 60K LEs handle 8-12 axes of PID plus trajectory generation, while the 229 I/O support encoder inputs, drive enables, and pulse-train outputs. The 3.125 Gbps transceiver provides a high-speed uplink to vision systems or distributed I/O. Industrial temperature grade and BGA's mechanical robustness suit factory automation cells where vibration and thermal stress are common.
Recommandé
Military and Aerospace Communications
Secure tactical radios and avionics buses rely on the EP1AGX60CF484I6N for software-defined radio (SDR) waveforms, link-16 / Link-22 encryption, and MIL-STD-1553 bridging. The 3.125 Gbps transceivers handle fiber-optic cockpit avionics networks, while the 60K LEs implement wideband modem signal processing. Industrial temperature grade is suitable for many avionics bay environments; for full MIL-spec use, choose a corresponding MIL-STD-810 qualified variant. Conformal coating is recommended for humidity protection.
Recommandé
Medical Imaging Acceleration
Ultrasound beamformers and MRI pre-processing boards use the EP1AGX60CF484I6N's embedded memory and logic capacity to perform channel summation, image reconstruction, and DICOM pre-processing in real time. The 229 user I/O accommodate 32-64 channel ADC arrays, while the 3.125 Gbps transceivers stream reconstructed image data to host processors. The device's deterministic latency and industrial temperature grade suit portable ultrasound carts used in field hospitals. Board layout must keep LVDS channels impedance-matched at 100 ohm differential.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1AGX60CF484I6N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1AGX60CF484C8N | EP1AGX60CF484C7N | EP1AGX60CF484C6N | EP1AGX50CF484I6N | EP1AGX50CF484I6 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 484-BBGA (FCBGA) | 484-BBGA (FCBGA) - same | 484-BBGA (FCBGA) - same | 484-BBGA (FCBGA) - same | 484-BBGA (FCBGA) - same | 484-BBGA (FCBGA) - same |
| Logic Elements | 60,000 | 60,000 (same) | 60,000 (same) | 60,000 (same) | 50,000 (-17%) | 50,000 (-17%) |
| Embedded Memory (bits) | 2,528,640 | 2,528,640 (same) | 2,528,640 (same) | 2,528,640 (same) | 2,420,000 (approx, -4%) | 2,420,000 (approx, -4%) |
| User I/O Pins | 229 | 229 (same) | 229 (same) | 229 (same) | 229 (same) | 229 (same) |
| Transceiver Data Rate | 3.125 Gbps | 3.125 Gbps (same) | 3.125 Gbps (same) | 3.125 Gbps (same) | 3.125 Gbps (same) | 3.125 Gbps (same) |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Speed Grade | 6 | 8 (fastest) | 7 | 6 | 6 | 6 |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Principaux différenciateurs
- Industrial temperature grade option for harsh environments (vs EP1AGX60CF484C6N)
- Highest logic density in the Arria GX 484-ball package (vs EP1AGX50CF484I6N)
- 3.125 Gbps transceiver bandwidth in mid-range FPGA (vs Cyclone V GX (similar density))
Notes de conception
Estimated: The 484-ball FCBGA at 1.0 mm ball pitch requires a PCB with at least 6-8 routing layers for signal fanout. Use laser-drilled microvias (8 mil / 200 um) for the top-layer escape, with buried capacitance between layers 3 and 4 to provide high-frequency decoupling. The BGA land pattern must follow IPC-7351 naming, with NSMD (non-solder mask defined) pads preferred for better joint reliability. Verify your assembly house supports the 1.0 mm pitch BGA before committing the layout.
Estimated: At maximum toggle activity across all 60K LEs, the EP1AGX60CF484I6N dissipates approximately 5-8 W. The 484-FCBGA junction-to-ambient thermal resistance (theta_JA) on a 4-layer JEDEC test board is roughly 16-19 C/W. To keep junction below 100C in an industrial enclosure at 70C ambient, ensure at least 25-30 C/W thermal margin via thermal vias under the BGA, an internal copper heat spreader, or a heatsink with thermal interface material. Use the Quartus PowerPlay early power estimator to model your design's actual dissipation before layout commit.
Power sequencing: VCCINT (1.0V core), VCCPD (3.3V), and VCCA/VCCP must be ramped within the datasheet-specified monotonic ordering to avoid latch-up. POR (power-on-reset) holds the device in reset until VCCINT crosses the threshold; ensure all supplies stabilize before driving JTAG TCK. For multi-FPGA boards, use the same supervisor to release all POR signals simultaneously. Estimated: a 6 A core regulator with 1% accuracy is sufficient for typical design utilization; derate to 8 A for high-toggle designs.
The 3.125 Gbps transceiver channels require controlled-impedance routing (100 ohm differential for the serial pairs, 50 ohm single-ended for LVDS/CMOS). Length-match within 150 mils across a transceiver quad to preserve skew budget. Keep the AC-coupling capacitors close to the transmit ball pair and place reference planes unbroken beneath the serial traces. For PCIe Gen1 or XAUI implementations, validate the channel with the Quartus IBIS-AMI models against your specific stackup before fab.
Configuration mode selection: choosing Active Serial (AS) vs JTAG changes the boot source (EPCS flash vs download cable) and the MSEL[2:0] pin strapping. Mismatched MSEL settings are a common cause of 'device not detected' failures on first prototypes. Additionally, unused clock input pins must be tied to ground through a 1 kohm resistor to prevent oscillation. Do not leave user I/O floating - configure them as outputs driving low, or as tri-state inputs with weak pull-ups, to minimize inrush current at power-up.
Informations de conformité
RoHS compliance and lead-free terminations are indicated by the 'N' suffix in the part number per Altera/Intel naming convention. AEC-Q100 is not applicable because FPGAs are not automotive-qualified discrete ICs. Halogen-free status not specified in available data.
