EP1AGX60CF484C7N - Arria GX FPGA 60K LE | 484-BGA | Altera
MPN: EP1AGX60CF484C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $185 | $185,000.00 |
Drop-in alternatives for EP1AGX60CF484C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1AGX60CF484C7N Maximum Ratings & Electrical Characteristics
| Family | Arria GX |
| Logic Elements | 60,000 |
| Embedded Memory Bits | 2,528,640 |
| Maximum User I/O | 229 |
| Package | 484-BGA (FineLine BGA) |
| Speed Grade | C7 |
| Operating Temperature | Commercial (0C to +85C) |
| Process Node | 90 nm |
| Transceiver Data Rate | up to 3.125 Gbps |
| Mounting Type | Surface Mount (BGA) |
| Development Tool | Quartus II |
EP1AGX60CF484C7N 484-bga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1AGX60CF484C7N (484-bga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1AGX60CF484C7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1AGX60CF484C7N is suitable for 7 applications: Telecom Line Cards and Serial Backplane, PCI Express Endpoint Card, Video Broadcast and Image Processing, Industrial Control and Factory Automation, Software Defined Radio (SDR) Baseband, Medical Imaging and Diagnostics Equipment, Aerospace Avionics and Defense Systems.
Telecom Line Cards and Serial Backplane
The EP1AGX60CF484C7N's integrated 3.125 Gbps serial transceivers make it ideal for telecom line cards aggregating multiple serial backplane channels. With 60K logic elements, the device can implement protocol bridging between SERDES links and a parallel backplane interface, while 2.5 Mbit embedded memory provides buffering for packet processing. Placed between physical-layer SERDES and the framer ASIC, the Arria GX handles protocol conversion and rate adaptation with deterministic latency, making it a workhorse for legacy SONET/SDH and Ethernet over SONET equipment.
Recommended
PCI Express Endpoint Card
The EP1AGX60CF484C7N is well suited for PCI Express endpoint cards implementing Gen1 (2.5 Gbps) interfaces through its built-in transceivers. The hard PCIe IP core eliminates soft SERDES overhead and the 60K LE fabric is sufficient for endpoint controllers plus DMA engines, register interfaces, and application-layer logic. The 484-BGA package accommodates the PCIe x4 lane mapping and provides signal-integrity headroom for the differential transmit/receive pairs, making it a popular choice for industrial and instrumentation PCIe cards.
Recommended
Video Broadcast and Image Processing
With 60K logic elements and rich DSP blocks, the EP1AGX60CF484C7N handles real-time video processing including scaling, deinterlacing, color space conversion, and overlay composition. The 229 user I/O pins support wide parallel video buses (24/30/36-bit RGB/YCbCr) and the embedded memory buffers frame data for pipeline processing. Its transceivers enable SDI (Serial Digital Interface) input/output for professional broadcast equipment, where deterministic processing latency is critical for video synchronization across multiple channels.
Recommended
Industrial Control and Factory Automation
The EP1AGX60CF484C7N suits industrial control systems requiring deterministic parallel processing of multiple sensor and actuator interfaces. The 60K LE fabric can host soft-core processors (Nios II), real-time control loops, and custom logic for motor control, while the SERDES channels enable industrial Ethernet protocols like EtherCAT or Profinet. The 484-BGA package provides mechanical robustness for industrial temperature operation with the industrial grade variant, and the device's longevity in long-life industrial programs is supported by Altera/Intel FPGA's product life cycle policy.
Recommended
Software Defined Radio (SDR) Baseband
The EP1AGX60CF484C7N's combination of DSP blocks, embedded memory, and SERDES channels suits software-defined radio baseband processing where digital samples must be filtered, decimated, and demodulated in real time. The 60K LE fabric handles multiple DDC (digital down-converter) channels at moderate sample frequencies, while the transceivers interface directly to ADC/DAC devices with serialized LVDS outputs. Designers can implement custom modulation schemes and channelization algorithms, taking advantage of the deterministic latency that FPGA fabric provides over general-purpose DSP processors.
Recommended
Medical Imaging and Diagnostics Equipment
Medical imaging systems such as ultrasound front-end processors and MRI data acquisition cards leverage the EP1AGX60CF484C7N's high-speed transceivers and substantial logic capacity for parallel channel processing. The 60K LE fabric supports beamforming algorithms across 32-64 channels simultaneously, while the 2.5 Mbit embedded memory provides per-channel sample buffers. For diagnostic equipment requiring IEC 60601 compliance, designers use the commercial grade with appropriate isolation, while industrial temperature variants support portable diagnostic tools. The deterministic processing latency of FPGA fabric is critical for synchronized multi-channel acquisition.
Recommended
Aerospace Avionics and Defense Systems
Defense and aerospace programs with extended lifecycles value the EP1AGX60CF484C7N for radar signal processing, navigation systems, and secure communications. The Arria GX family's transceivers support legacy MIL-STD-1553 bridges, custom RF interfaces, and encrypted datalinks, while the 60K logic capacity handles protocol stacks and baseband processing. For airborne applications requiring extended temperature operation, the industrial-grade variant (EP1AGX60CF484I7N) is preferred. Designers in this segment value FPGAs over ASICs for late-stage specification changes and ITAR compliance documentation tracking.
Recommended
Recommended Products Summary
Engineering reference data for EP1AGX60CF484C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1AGX60CF484C6N | EP1AGX60CF484I7N | EP1AGX60CF484I6N | EP1AGX60CF484C7 | EP1AGX60EF484C7N | 5CSXFC6C6U23C7N |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) | 484-BGA (FineLine BGA) | 484-BGA (UBGA) |
| Logic Elements | 60,000 | 60,000 | 60,000 | 60,000 | 60,000 | 60,000 | ~110,000 (Cyclone V) |
| Speed Grade | -7 | -6 | -7 | -6 | -7 | -7 | -7 (Cyclone V) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial | Commercial | Commercial |
| Transceiver Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 5 Gbps (Cyclone V GT) |
| Embedded Memory | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | ~5,000 Kbits (Cyclone V) |
| Maximum User I/O | 229 | 229 | 229 | 229 | 229 | 229 | varies by variant |
| Process Node | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 28 nm (Cyclone V) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Active |
Key Differentiators
- Fastest speed grade in 60K LE Arria GX 484-BGA family (vs EP1AGX60CF484C6N)
- Commercial temperature grade for cost-sensitive applications (vs EP1AGX60CF484I7N)
- Larger logic capacity than smaller density Arria GX siblings (vs EP1AGX35CF484C6)
- Mature Arria GX family with extensive IP ecosystem (vs 5CSXFC6C6U23C7N (Cyclone V))
Design Notes
The 484-ball FineLine BGA package requires careful PCB layout with microvia stack-ups and controlled-impedance routing for transceiver channels. Per Altera application notes, place power and ground vias directly beneath the package within the BGA pattern to provide low-inductance decoupling for the core and I/O rails. Use a 4-6 layer stack-up with dedicated ground planes adjacent to signal layers for the SERDES signals; transmit and receive pairs should maintain 100 ohm differential impedance with matched length (within 150 mils) across each pair.
Power dissipation for the EP1AGX60CF484C7N at maximum toggle rates with all transceivers active can reach 5-8W. The 484-BGA package theta_JA is typically in the 15-20 C/W range with adequate PCB copper; designers should provide thermal vias to inner ground planes and consider forced-air cooling for enclosed chassis. Estimated junction temperature rise at 6W with 18 C/W theta_JA is approximately 108C above ambient, which exceeds commercial grade limits without airflow - thermal simulation is recommended for production designs.
Decoupling capacitor placement is critical for BGA FPGAs. Per the Arria GX Device Handbook, place 0.1 uF and 0.01 uF ceramic capacitors on the underside of the PCB directly beneath the BGA, with each decoupling cap serving within a 2-3 ball distance of the power pins it services. Use multiple bulk capacitors (47-220 uF) on each power rail (VCCINT, VCCIO, VCCA) placed at the periphery of the BGA pattern. Maintain short and wide traces from capacitors to power balls; the inductance of vias and traces dominates decoupling effectiveness at high frequencies.
Transceiver channels require matched-length routing and tight impedance control. Per Altera guidelines, route each SERDES TX/RX pair with intra-pair skew less than 150 mils and use continuous ground reference on adjacent layers. Avoid routing SERDES signals across plane splits or near noisy digital signals; if layer transitions are unavoidable, place ground return vias near signal vias to maintain return path continuity. For PCI Express designs, follow the PCIe CEM specification routing guidelines for 2.5/5 Gbps signaling.
Common design mistakes include: (1) failing to set all unused I/O pins to analog or input tri-state per the datasheet, which can cause excessive current draw; (2) using unsupported configuration modes or wrong MSEL[3:0] settings leading to configuration failures; (3) ignoring the JTAG chain order in multi-device configurations, which can lock up the entire chain; and (4) forgetting to enable internal weak pull-ups on configuration pins if external pull resistors are not provided. Always verify the Quartus II pin assignments against the device datasheet pin table before PCB fabrication.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status not directly verified from provided data; mark as unknown. AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive qualified part per the standard. Designers needing automotive-grade FPGAs should consult the Altera/Intel FPGA automotive product line.
