EP1C6F256C7NAB - Cyclone FPGA, 6K LEs, 256-BGA | Intel/Altera
Référence : EP1C6F256C7NAB ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $32.75 | $327,50 |
| 100 | $26.9 | $2 690,00 |
| 500 | $22.4 | $11 200,00 |
| 1 000 | $19.8 | $19 800,00 |
EP1C6F256C7NAB Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be electrically reconfigured by the customer after manufacturing. FPGAs sit above microcontrollers and ASICs in the digital logic hierarchy, providing high parallelism, deterministic timing, and hardware-level customization. The Cyclone family specifically targets cost-sensitive, high-volume markets - it integrates embedded multipliers, embedded memory, and a Phase-Locked Loop (PLL) clock network into a single homogeneous logic fabric, eliminating the need for external complex logic or memory components in many designs.
Key features include two PLLs for clock management and frequency synthesis, embedded 18×18 multipliers suitable for DSP blocks, distributed and block RAM, and support for common I/O standards such as LVTTL, LVCMOS, PCI, and LVDS. The 256-pin BGA package provides high I/O density within a compact 17×17 mm footprint, making it suitable for space-constrained designs. Configuration can be performed via JTAG, Active Serial (AS), or Passive Serial (PS) modes, supported by the Quartus II development toolchain.
Architecturally, the Cyclone FPGA uses a four-input Look-Up Table (LUT) based logic element with embedded RAM and full-routing interconnect, optimized for the Quartus II tool flow. The C7 speed grade offers typical toggle rates up to 250 MHz for general logic, with deterministic logic utilization suitable for control-plane and data-plane bridge applications.
Typical applications include industrial control interfaces, video and image processing pipelines, low-cost digital signal processing boards, communications protocol bridges, and high-volume consumer electronics requiring flexible logic. It is also widely used as a glue-logic replacement for multiple discrete CPLDs and standard logic ICs in legacy designs.
When designing with this part, engineers should note that the original Cyclone family uses 1.5V core voltage (VCCINT) with separate VCCIO bank supplies. The 256-FBGA requires PCB design rules with controlled impedance routing and clean power decoupling. Configuration memory must be loaded at every power-up; this part supports both serial and JTAG programming.
This page synthesizes distributor inventory, parametric comparison versus same-family Cyclone variants, and practical design notes not found in a single manufacturer datasheet, helping engineers evaluate EP1C6F256C7NAB for both new designs and legacy board sustainment.
Alternatives de remplacement direct pour EP1C6F256C7NAB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1C6F256C7NAB (même facteur de forme et même empreinte) — différant par Speed Grade, Operating Temperature, Package, RoHS Status, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1C6F256C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$18.2 / unité
Voir la fiche technique →EP1C6F256C7
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$17.95 / unité
Voir la fiche technique →EP1C6F256C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$21.4 / unité
Voir la fiche technique →EP1C6F256C6N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$21.8 / unité
Voir la fiche technique →EP1C6F256C6
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$38.9 / unité
Voir la fiche technique →EP1C6F256C7NAB Valeurs maximales et caractéristiques électriques
| Family | Cyclone |
| Logic Elements | 5,980 |
| Total RAM Bits | 92,160 |
| User I/Os | 185 |
| Number of I/O Banks | 8 |
| Boîtier | 256-BGA (FineLine) |
| Package Pin Count | 256 |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | 1.5V / 1.8V / 2.5V / 3.3V (per bank) |
| Speed Grade | C7 |
| Température de fonctionnement | 0C to +85C (Commercial) |
| Number of PLLs | 2 |
| Embedded Multipliers (18x18) | 20 |
| Process Technology | 0.13 µm SRAM |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) |
| Statut RoHS | Unknown (legacy family, pre-RoHS-era variants exist) |
Guide de configuration des broches du EP1C6F256C7NAB 256
Configuration des broches du EP1C6F256C7NAB (boîtier 256). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1C6F256C7NAB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1C6F256C7NAB convient pour 7 applications: Industrial Control Logic and Glue Logic, Digital Signal Processing (DSP) Front-End, Communications Protocol Bridging, Video and Image Processing Pipelines, Legacy Board Sustainment and Obsolete-Component Replacement, Consumer Electronics Display Controllers, Educational and Prototyping FPGA Boards.
Industrial Control Logic and Glue Logic
The EP1C6F256C7NAB replaces multiple discrete CPLDs and 74-series logic ICs in industrial control boards with a single programmable device. The 5,980 logic elements and 185 user I/Os are sufficient to integrate motor-control glue logic, button debouncing, encoder decoding, and fieldbus protocol bridging (Modbus, CAN, RS-485). With 1.5V core and 3.3V-capable I/O banks, it interfaces directly to industrial sensors and 24V opto-isolated signals via external buffers. The 256-FBGA footprint keeps the design compact while providing enough I/O for multi-axis motion-control PCBs. Designers benefit from hardware re-programmability that supports late-stage firmware changes during production.
Recommandé
Digital Signal Processing (DSP) Front-End
The 20 embedded 18×18 multipliers and M4K block RAM in the EP1C6F256C7NAB implement FIR filters, FFT stages, and digital up/down-converters in DSP front-end boards. The multipliers deliver up to 250 MHz operation, sufficient for audio-bandwidth and baseband signal processing in software-defined radio and instrumentation. Designers can build 16-tap FIR filters in a single LAB and chain stages for higher-order filters. The 92,160 RAM bits act as coefficient and data buffers, eliminating external SRAM in compact DSP boards. The Cyclone I DSP block architecture is supported by Altera LPM_MULT and DSP Builder IP libraries.
Recommandé
Communications Protocol Bridging
The EP1C6F256C7NAB bridges legacy and modern communications protocols (UART, SPI, I2C, PCIe PIPE, SGMII, GMII) on telecom and networking line cards. With 185 I/Os and 8 banks, the device routes multiple LVDS pairs and single-ended buses simultaneously while the two PLLs generate the required reference clocks. The 256-FBGA package supports controlled-impedance routing for 1 Gbps signals. Legacy protocol stacks (HDLC, frame relay, ATM) can be implemented in soft logic, while a microcontroller offloads management-plane tasks. Designers configure the bridge via JTAG during board bring-up and re-program in-system for firmware updates.
Recommandé
Video and Image Processing Pipelines
In video processing, the EP1C6F256C7NAB drives LVDS-based display interfaces, performs color-space conversion, and applies real-time image filters in surveillance and broadcast equipment. The 5,980 LEs handle 720p and 1080i pixel-clock rates comfortably when configured for pipelined processing. The 185 I/Os accommodate 24-bit parallel video buses plus timing-control signals. Embedded multipliers accelerate edge-detection and motion-estimation kernels. Industrial camera and frame-grabber boards benefit from the Cyclone I's deterministic timing and 3.3V-tolerant I/O banks for direct connection to image sensors and HDMI transmitters.
Recommandé
Legacy Board Sustainment and Obsolete-Component Replacement
Many OEM and military customers use the EP1C6F256C7NAB as a sustainment FPGA to extend the lifecycle of legacy boards where original Cyclone I silicon has been discontinued. The C7 commercial speed grade matches the original factory timing, allowing pin-to-pin replacement on existing 256-FBGA PCBs without redesign. Industrial, medical, and aerospace sustainment programs use this part to keep deployed equipment operational. With the part now obsolete, buyers rely on remaining factory inventory and authorized distributors for support; the 256-FBGA footprint remains stable across Cyclone I variants, easing last-time-buy planning.
Recommandé
Consumer Electronics Display Controllers
Consumer electronics such as digital photo frames, in-flight entertainment seat-back displays, and point-of-sale terminals use the EP1C6F256C7NAB as a low-cost display controller. The 185 user I/Os drive TFT LCD panels with RGB interfaces, handle touch-panel scanning, and execute on-screen display (OSD) overlays. The two PLLs generate pixel clocks and backlight-PWM frequencies, while embedded multipliers scale and rotate image data in real time. The 256-FBGA footprint and 1.5V core keep power consumption low enough for fanless consumer enclosures. Designers use Quartus II IP cores for HDMI, DVI, and LVDS transmit interfaces.
Recommandé
Educational and Prototyping FPGA Boards
Universities and FPGA-training labs favor the EP1C6F256C7NAB as a teaching platform because it is supported by the legacy Quartus II toolchain (free Web Edition) and has a manageable logic capacity for student projects. The 256-FBGA development boards expose 100+ I/Os for breadboard prototyping via header pins and include LEDs, switches, and SDRAM. Course labs cover VHDL/Verilog design, state-machine implementation, and basic DSP pipelines. The Cyclone I architecture introduces students to PLLs, embedded multipliers, and configuration memory without overwhelming complexity. Replacement boards are easy to assemble thanks to the part's broad 256-FBGA toolchain support.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1C6F256C7NAB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1C6F256C7N | EP1C6F256C7 | EP1C6F256C8N | EP1C6F256C6N | EP1C6F256C6 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 256-FBGA (FineLine) | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same | 256-FBGA - same |
| Logic Elements | 5,980 | 5,980 - same | 5,980 - same | 5,980 - same | 5,980 - same | 5,980 - same |
| RAM Bits | 92,160 | 92,160 - same | 92,160 - same | 92,160 - same | 92,160 - same | 92,160 - same |
| User I/Os | 185 | 185 - same | 185 - same | 185 - same | 185 - same | 185 - same |
| Speed Grade | C7 | C7 - same | C7 - same | C8 - faster | C6 - slower | C6 - slower |
| Operating Temperature | 0C to +85C (Commercial) | Commercial - same | Commercial - same | Commercial - same | Commercial - same | Commercial - same |
| Trailing Suffix | NAB | N - standard ordering code | (no suffix) - tray option | N - standard, C8 speed | N - standard, C6 speed | (no suffix) - C6, tray option |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Identical Cyclone I silicon - true drop-in on existing 256-FBGA PCBs (vs EP1C6Q240C6 (240-pin PQFP))
- C7 speed grade offers balanced timing and power for commercial designs (vs EP1C6F256C8N (C8 speed grade))
- Backward-compatible Quartus II toolchain support (vs Lattice ECP5 (cross-vendor comparison))
Notes de conception
The EP1C6F256C7NAB requires separate VCCINT (1.5V core) and VCCIO (per-bank 1.5V/1.8V/2.5V/3.3V) supply rails. Use a low-dropout regulator such as a 1.5V LDO for VCCINT capable of delivering 500 mA peak with adequate thermal headroom. Place a 100 nF decoupling capacitor on every VCC pin and at least one 10 µF bulk capacitor per supply rail. Estimated: at 100% resource utilization and 250 MHz toggle rate, VCCINT current draw can reach 250-400 mA; design the regulator for at least 2× margin to avoid inrush droop during configuration.
The 256-ball FineLine BGA uses a 1.0 mm ball pitch, requiring PCB microvia or via-in-pad technology. The escape routing should use 4-6 mil trace-and-space with controlled impedance for high-speed I/O. Place configuration memory (EPCS4SI8N or compatible) within 50 mm of the FPGA's dedicated configuration pins to minimize signal-integrity risk. The exposed die-pad underneath the BGA must be soldered to the PCB ground plane for thermal dissipation - do not leave it floating.
LVDS signaling on the EP1C6F256C7NAB requires external 100 Ω differential termination resistors placed within 7 mm of the FPGA receive pins. Match intra-pair trace lengths to within 150 mil (3.8 mm) and pair-to-pair within 250 mil (6.4 mm) for jitter control. Use the Quartus II pin-planner to assign LVDS pairs and verify with the Cyclone I board-design guidelines. Single-ended I/O should use 50 Ω series termination at the driver end for clock rates above 100 MHz.
Always configure the EP1C6F256C7NAB via Active Serial mode with a configuration memory such as the EPCS4SI8N to allow in-system re-programming via JTAG. Active Serial mode supports a multi-stage bootloader flow. Verify that the configuration memory size is at least 1.5× the bitstream size; typical Cyclone I 6K-LE designs compile to ~1.0-1.2 Mbit bitstreams, so EPCS4 (4 Mbit) is sufficient. Add a 1 ms reset delay after power-up for stable configuration.
Although the EP1C6F256C7NAB has a typical power dissipation below 1 W at moderate toggle rates, the BGA package requires attention to thermal management. Solder the central BGA ground balls and the die-pad to a continuous PCB ground pour to spread heat across the board. Estimated: at room temperature and 50% utilization, junction-to-ambient thermal resistance (θJA) for a properly designed 256-FBGA board is around 30 C/W. Do not use thermal vias under signal balls; only under ground balls and the die-pad.
Informations de conformité
EP1C6F256C7NAB belongs to the legacy Altera Cyclone I family (introduced 2003) before widespread RoHS adoption. Compliance status varies by manufacturing lot. AEC-Q100 is not applicable for FPGAs as they are not automotive-qualified discrete components. Customers should request specific lot compliance documentation from their distributor when needed.
