Intel

EP1C6F256C7N - Cyclone FPGA 5980 LE 256-FBGA | Intel

Référence : EP1C6F256C7N ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
1.5 V Vdss 256-ball FineLine BGA (FBGA-256) Package -7 (C7) Speed
À partir de $18.2 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-06
Tarifs dégressifs
Qté Prix unitaire Total
1 $32.17 $32,17
10 $28.95 $289,50
100 $24.4 $2 440,00
500 $20.85 $10 425,00
1 000 $18.2 $18 200,00
ℹ️ Tous les prix sont en USD

EP1C6F256C7N Présentation

The Intel (Altera) EP1C6F256C7N is a Cyclone-series Field Programmable Gate Array (FPGA) delivering 5,980 logic elements, 92,160 RAM bits, and 185 user I/O in a 256-ball FineLine BGA package. Built on a 1.5 V core, 0.13 µm all-layer copper SRAM process, the device targets mid-density logic integration with on-chip RAM and configurable I/O standards, addressing data-path, memory-interface, and system-control designs at a low unit cost. The 'C7' speed grade denotes a commercial temperature rating (0C to +85C) with a pin-compatible -7 timing closure.

An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, and programmable routing that the designer implements after fabrication. FPGAs sit within the broader hierarchy of programmable logic devices (PLD) -> FPGA -> SRAM-based FPGA -> low-cost FPGA family. Compared with ASICs, FPGAs offer rapid prototyping, in-field re-programmability, and NRE-free development at the expense of unit cost and static power. The Cyclone family specifically targets cost-sensitive volume applications by trimming high-speed transceivers and emphasizing logic density per dollar.

Key features of the EP1C6F256C7N include 5,980 logic elements (LEs), 92,160 total RAM bits distributed across M4K memory blocks, two PLLs for clock multiplication and phase shifting, and 185 user I/O pins supporting LVTTL, LVCMOS, SSTL, and differential I/O standards. The device supports up to four Delay-Locked Loops for source-synchronous memory interfaces such as DDR SDRAM. Configuration is loaded through passive serial (PS), active serial (AS), or JTAG modes, enabling flexible boot from EPCS configuration flash.

The Cyclone architecture uses a 4-input look-up table (LUT) per logic element, with embedded multiplier support implemented in soft logic for low DSP workloads. Internal signal integrity is maintained through a hierarchical routing architecture with predictable timing closure at the -7 speed grade. Static power is minimized by the 1.5 V core, while dynamic power scales with toggle rate and clock frequency. The 256-FBGA package provides a compact 17 mm x 17 mm footprint suitable for space-constrained embedded boards.

Typical applications include industrial control and factory automation, video processing pipelines, motor control and motion drive interfaces, low-cost prototyping for ASIC replacement, and glue-logic consolidation around processors. The Cyclone family is widely used in display controllers, telecom line cards, and test-and-measurement front-ends where 5K-10K LE designs dominate.

When designing with this device, ensure that your Quartus II project targets the EP1C6Q256C7 device symbol, that the I/O bank voltages match the chosen standard, and that the configuration flash (EPCS4 or EPCS16) is sized for the .pof file. Note that the EP1C6 series is mature; lead times can vary and the part is increasingly sourced through brokers for new designs.

This page synthesizes distributor pricing, drop-in Cyclone-family alternatives, and Quartus II configuration guidance not found in a single distributor product page.

Alternatives de remplacement direct pour EP1C6F256C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec EP1C6F256C7N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, RoHS Status, Process Technology.

Altera
Package: 256-FBGA (F256), 17 x 17 mm, 1.0 mm pitch
Speed Grade: 7
Operating Temperature: 0 C to +85 C (Commercial)
Comparer avec EP1C6F256C7N →
Altera
Package: 256-ball FBGA (FineLine BGA), 1.00 mm pitch
Speed Grade: 7
Operating Temperature: -40 °C to +85 °C (Industrial)
Comparer avec EP1C6F256C7N →
Altera
Package: 256-ball FineLine BGA (F256), 17 × 17 mm, 1.0 mm pitch
Speed Grade: C2 (commercial, -40 °C to +85 °C)
Operating Temperature: -40 °C to +85 °C (commercial)
Comparer avec EP1C6F256C7N →
Intel
Package: 256-ball FineLine BGA (FBGA)
Speed Grade: C6
Operating Temperature: 0 °C to 85 °C (commercial)
Comparer avec EP1C6F256C7N →
Intel
Package: 256-BGA (FBGA-256)
Speed Grade: 6
Operating Temperature: 0 °C to +85 °C (commercial)
Comparer avec EP1C6F256C7N →
Altera
Package: 256-ball FineLine BGA (FBGA)
Speed Grade: -7
Operating Temperature: 0 C to +85 C (commercial)
Comparer avec EP1C6F256C7N →
Altera
Package: 256-BGA (FineLine)
Speed Grade: C7
RoHS Status: Unknown (legacy family, pre-RoHS-era variants exist)
Comparer avec EP1C6F256C7N →
Altera
Speed Grade: 8
RoHS Status: unknown
Comparer avec EP1C6F256C7N →
Intel
Package: 256-BGA (FBGA-256), 17 × 17 mm, 1.0 mm pitch
Speed Grade: 8
Operating Temperature: 0 °C to +85 °C (Commercial)
Comparer avec EP1C6F256C7N →
Intel
Package: 256-ball FBGA (F256)
Speed Grade: -7
Operating Temperature: -40C to +100C (industrial)
Comparer avec EP1C6F256C7N →
Intel
Package: 256-BGA (FBGA, 17x17 mm, 1.0 mm pitch)
Speed Grade: I7 (-7, industrial)
Process Technology: 0.13 µm SRAM
Comparer avec EP1C6F256C7N →
Intel
Package: 256-BGA (FBGA, 17 x 17 mm, 1.0 mm pitch)
Operating Temperature: -40 C to +100 C (industrial)
RoHS Status: Compliant (Pb-free)
Comparer avec EP1C6F256C7N →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

EP1C6F256C8N

✅ Remplacement direct
Intel
📦 256-FBGA
Cyclone · Cyclone I · 5,980 · 92,160 · 185 · 2 · 1.5 V · 0 °C to +85 °C (Commercial)

✓ En stock

$21.4 / unité

Voir la fiche technique →

EP1C6F256C6N

✅ Remplacement direct
Intel
📦 256-FBGA
Cyclone · 5,980 · 92,160 · 185 · 256-BGA (FBGA-256) · 1.5 V · 0 °C to +85 °C (commercial) · 6

✓ En stock

$21.8 / unité

Voir la fiche technique →

EP1C6F256I7N

✅ Remplacement direct
Intel
📦 256-FBGA
Cyclone · 5,980 · 598 · 92,160 (90 Kbit M4K blocks) · 185 · 130 nm CMOS · 1.5 V (1.425 V to 1.575 V) · 250 MHz

✓ En stock

$27.94 / unité

Voir la fiche technique →

EP1C6F256C7

✅ Remplacement direct
Altera
📦 256-FBGA
Cyclone I · 5,980 · 92,160 bits · 20 M4K blocks (4,608 bits each) · 185 · 256-ball FineLine BGA (FBGA) · -7 · 130 nm SRAM

✓ En stock

$17.95 / unité

Voir la fiche technique →

EP1C12F256C7N

✅ Remplacement direct
Altera
📦 256-FBGA
Cyclone · Cyclone I · 12060 · 12060 · 239616 · 185 · 1206 · 52

✓ En stock

$27.95 / unité

Voir la fiche technique →

EP1C6F256C7N Valeurs maximales et caractéristiques électriques

Series Cyclone
Manufacturer Intel (formerly Altera)
Logic Elements (LE) 5,980
Total RAM Bits 92,160
User I/O Count 185
Number of PLLs 2
Core Voltage 1.5 V
Process Technology 0.13 µm SRAM, all-layer copper
Speed Grade -7 (C7)
Température de fonctionnement 0C to +85C (commercial)
Package Type 256-ball FineLine BGA (FBGA-256)
Package Dimensions 17 mm x 17 mm
Type de montage Surface Mount
Configuration Mode Passive Serial (PS), Active Serial (AS), JTAG
Statut RoHS Compliant
Lead-Free Yes

Guide de configuration des broches du EP1C6F256C7N 17 mm x 17 mm

Configuration des broches du EP1C6F256C7N (boîtier 17 mm x 17 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.

Schéma de brochage du boîtier 17 mm x 17 mm pour le EP1C6F256C7N

Aucune donnée de brochage détaillée disponible pour EP1C6F256C7N.

Consultez la fiche technique pour la configuration complète des broches.

Applications typiques

EP1C6F256C7N convient pour 6 applications: Industrial Control and Factory Automation, Video Processing and Display Controllers, Motor Control and Motion Drive Interfaces, ASIC Prototyping and Logic Consolidation, Telecom Line Cards and Network Glue Logic, Test and Measurement Front-Ends.

🏭

Industrial Control and Factory Automation

The EP1C6F256C7N fits industrial control designs where 5K logic elements are sufficient for PLC scan engines, sensor fusion glue logic, and EtherCAT or Modbus protocol bridging. With 185 user I/O and 1.5 V low static power, it consolidates multiple 74HC/74LVC discrete logic ICs onto a single programmable device, reducing board area and BOM count. The two on-chip PLLs allow deterministic clock synthesis for motor-control PWM and encoder feedback loops. Industrial designers should pair the EP1C6F256I7N variant when the cabinet ambient exceeds 70C, since the C7N is commercial-grade only. Quartus II supports industrial IP libraries for EtherCAT, Profibus, and CAN, making it a mature platform for factory-floor integration where the 256-FBGA's 17x17 mm footprint fits inside compact DIN-rail enclosures.

📺

Video Processing and Display Controllers

The EP1C6F256C7N is widely used in mid-resolution video pipelines where its 5,980 LEs and 92 Kbit RAM support line buffers, color-space conversion, and on-screen display overlay. The 185 user I/O accept 18-bit or 24-bit RGB buses plus control signals at 65 MHz pixel clock, matching standard SXGA and 720p panel timing. The two PLLs synthesize pixel clocks from a 27 MHz reference, eliminating external clock generators. For 1080p or higher bandwidth, designers should evaluate the EP1C12F256C7N which provides 12K LEs for larger frame buffers. Cyclone remains a low-cost choice for kiosk displays, digital signage controllers, and medical-imaging front-ends where FPGA fabric provides deterministic latency unavailable in general-purpose processors.

🤖

Motor Control and Motion Drive Interfaces

Motor drive designers select the EP1C6F256C7N for resolver-to-digital conversion, PWM generation, and field-oriented control state machines. The 185 user I/O connect directly to 3-phase gate drivers, encoder quadratures, and Hall sensors with LVTTL or LVDS signalling, while the 92 Kbit RAM captures current-loop sample streams at 10-20 kHz. Cyclone's deterministic fabric provides sub-microsecond latency for torque-loop updates, outperforming MCU-based solutions at lower cost than DSP alternatives. Designers should choose the EP1C6F256I7N for under-hood automotive or outdoor cabinet installations where ambient exceeds 85C. The 256-FBGA package's 17x17 mm footprint fits inside IPM modules and integrated servo drive PCBs.

🔧

ASIC Prototyping and Logic Consolidation

Designers use the EP1C6F256C7N as a low-cost prototyping vehicle for ASIC tape-outs in the 5K-10K gate range, validating state machines, bus arbiters, and memory controllers before committing to mask costs. The 256-FBGA package exposes all 185 I/O to 3.3 V LVCMOS or SSTL-II, enabling direct connection to DDR or QDR SRAM for system-level emulation. Quartus II synthesis reports accurate timing closure at the -7 speed grade, allowing correlation with downstream ASIC synthesis flows. For ASIC replacement volumes under 10K units per year, the EP1C6F256C7N often replaces a custom mask with zero NRE. Migration to the EP1C12F256C7N is pin-compatible if the prototype grows beyond 6K LEs during validation.

🌐

Telecom Line Cards and Network Glue Logic

Telecom OEMs deployed the EP1C6F256C7N as a glue-logic aggregator on T1/E1 line cards, DSLAM backplanes, and PTN tributary interfaces where it bridges microprocessors to framer ICs and serializer-deserializer chips. The 5,980 LEs accommodate HDLC controllers, timeslot crossbars, and bit-error-rate testers, while the 92 Kbit RAM holds jitter buffers. The 185 user I/O support LVTTL and LVDS for direct connection to TDM buses without external transceivers. The two PLLs synthesize E1 (2.048 MHz), T1 (1.544 MHz), and N x 8 kHz reference clocks from a single 19.44 MHz system oscillator. Legacy telecom equipment still ships with Cyclone I silicon because of its long-life-cycle status and proven reliability in carrier-grade environments.

🖥️

Test and Measurement Front-Ends

The EP1C6F256C7N serves as a programmable stimulus/response engine in benchtop test equipment, arbitrary waveform generators, and logic analyzer probes. With 185 user I/O, the device routes pattern data at up to 250 MHz LVDS to DUT pins, while embedded RAM holds deep stimulus vectors that exceed microcontroller memory limits. The 92 Kbit RAM supports 2048-sample deep patterns at 18-bit width, suitable for DDR memory margining and protocol compliance testing. Quartus II's SignalTap II logic analyzer provides on-chip debug visibility without external scope channels, accelerating bring-up. The 256-FBGA footprint integrates into compact PXI and USB-form-factor instruments where board area is at a premium.

Récapitulatif des produits recommandés

EPCS4 Serial configuration flash for AS mode Utilisé dans : Industrial Control and Factory Automation, Motor Control and Motion Drive Interfaces, Telecom Line Cards and Network Glue Logic EP1C6F256I7N Intel Utilisé dans : Industrial Control and Factory Automation, Motor Control and Motion Drive Interfaces, Telecom Line Cards and Network Glue Logic EPCS16 Configuration flash for larger bitstreams Utilisé dans : Video Processing and Display Controllers, ASIC Prototyping and Logic Consolidation, Test and Measurement Front-Ends EP1C12F256C7N Altera Utilisé dans : Video Processing and Display Controllers, ASIC Prototyping and Logic Consolidation, Test and Measurement Front-Ends
What is the logic element count of EP1C6F256C7N?
The EP1C6F256C7N contains 5,980 logic elements (LEs) per the Cyclone family datasheet. Each LE consists of a 4-input look-up table, a programmable register, and a carry chain, providing approximately 5K-6K 4-input LUTs of general-purpose logic for state machines, glue logic, and small datapaths. The device also includes 92,160 bits of embedded RAM for FIFOs and small buffers.
How many user I/O pins does EP1C6F256C7N have?
The EP1C6F256C7N provides 185 user I/O pins across the 256-ball FineLine BGA package. The I/O banks support LVTTL, LVCMOS, SSTL-II, SSTL-III, LVDS, and RSDS standards, allowing direct interface to DDR SDRAM, QDR SRAM, and source-synchronous parallel buses without external transceivers.
What is the difference between EP1C6F256C7N and EP1C6F256C8N?
The C7 and C8 are speed-grade variants of the same Cyclone EP1C6F256 die. Per the ETEI comparison data, both share the 256-BGA footprint; the C8 grade offers marginally faster timing closure (about 15% faster internal Fmax) at higher unit cost. They are drop-in compatible on the same PCB land pattern but differ in speed bin only.
What is the difference between EP1C6F256C7N and EP1C6F256C6N?
The C6 and C7 differ in speed grade: C7 is faster than C6 with similar internal logic, both commercial temperature range, identical 256-FBGA package. According to the Cyclone family datasheet, the C6 grade is approximately 25% slower than C7 and is typically chosen for cost-sensitive designs not gated by Fmax.
Where can I download the EP1C6F256C7N datasheet PDF?
The official Cyclone family datasheet is published by Intel at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyc/cyclone_handbook.pdf. The handbook covers device architecture, electrical characteristics, configuration, and package information for the entire EP1C6 family including the F256 BGA variant.
What is the pinout of EP1C6F256C7N?
The EP1C6F256C7N uses a 256-ball FineLine BGA with ball coordinates defined in the Cyclone device handbook. Pin 1 is located at the top-left of the package top view. Power, ground, configuration, and user I/O ball assignments are documented in the EP1C6 pin-out table in Chapter 7 of the Cyclone Handbook.
How much does EP1C6F256C7N cost in single-unit quantity?
The EP1C6F256C7N lists at approximately $32.17 USD per unit at quantity 1 as of 2026-09-06, per Heisener distributor data. Pricing decreases to roughly $18.20 at the 1,000-piece break. Note that mature Cyclone parts are increasingly sourced through brokers rather than authorized distributors, which may affect final unit cost.
Is EP1C6F256C7N in stock and what is the lead time?
Heisener.com lists in stock with immediate shipping capability as of 2026-09-06. Lead time is approximately 1-2 weeks from major brokers. For production volumes, designers should verify current stock at the time of PO since mature Altera FPGAs may face allocation during end-of-life transitions.
What is the best cross-brand alternative for EP1C6F256C7N?
No true cross-brand drop-in replacement exists for the EP1C6F256C7N at the same ballout, since the Cyclone family uses a proprietary Altera architecture and configuration scheme. Designers cross-shopping for a 5K-LE FPGA in a 256-BGA footprint should evaluate Lattice ECP2-6 or Xilinx Spartan-3 XC3S200-256 parts, both of which require redesign of the FPGA fabric, configuration memory, and pin map - these are NOT pin-compatible drop-in parts.
What is the best drop-in replacement for EP1C6F256C7N?
The best drop-in replacement for the EP1C6F256C7N within the same Cyclone family is the EP1C6F256C8N, which shares the identical 256-FBGA package, ball-out, and silicon die; only the speed grade differs (C8 vs C7). For designs seeking pin-compatible higher logic capacity within the same ballout, EP1C12F256C7N provides 12,060 LEs in the same F256 BGA, but consumes slightly more power.
Can EP1C6F256I7N replace EP1C6F256C7N?
No, the EP1C6F256I7N is an industrial temperature grade (-40C to +100C) variant and is pin-to-pin compatible at the 256-FBGA ballout, but the I-grade is typically more expensive. Per the Cyclone datasheet, you may substitute I7N for C7N if your application requires industrial temperature compliance; substituting C7N for I7N in an industrial environment violates the temperature spec.
When should I choose EP1C6F256C7N over EP1C12F256C7N?
Choose the EP1C6F256C7N when your design fits within 5,980 logic elements and you want the lowest unit cost in the EP1C family. Choose the EP1C12F256C7N when your design needs more than 6K LEs, larger on-chip RAM, or future headroom; both share the same 256-FBGA ballout so PCB footprint is identical and migration is straightforward via Quartus II recompile.
Which configuration flash is required for EP1C6F256C7N?
The EP1C6F256C7N typically uses an Altera EPCS4 (4 Mbit) or EPCS16 (16 Mbit) serial configuration flash in Active Serial (AS) mode, per the Cyclone configuration chapter. For larger .pof files or remote upgrade capability, EPCS64 or EPCS128 may be used. The configuration clock (DCLK) and data (DATA0) pins map to dedicated package balls defined in the device handbook.
What design tools support EP1C6F256C7N?
The EP1C6F256C7N is supported by Altera Quartus II design software (versions 6.0 through 13.0sp1), including Quartus II Web Edition (free) for synthesis, place-and-route, timing analysis, and programming file generation. Legacy Cyclone designs also work in ModelSim-Altera for simulation. Quartus Prime does not officially support Cyclone I, so older Quartus II is required.
What is the operating temperature range of EP1C6F256C7N?
The EP1C6F256C7N is specified for commercial temperature range 0C to +85C junction, per the Cyclone family datasheet. For industrial (-40C to +100C) or extended temperature operation, the EP1C6F256I7N variant is required. Designers must check the ambient temperature inside the enclosure and apply appropriate derating for the 256-FBGA thermal resistance.

Données de référence d'ingénierie pour EP1C6F256C7N — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the EP1C6F256C7N when your design requires 4K-6K logic elements, up to 92 Kbit of on-chip RAM, and 185 user I/O, all within a 17x17 mm 256-FBGA footprint for commercial-temperature (0C to +85C) applications. It is the canonical mid-density Cyclone I part for industrial control, video front-ends, motor control, and ASIC prototyping. For designs needing more than 6K LEs or extended memory, migrate to the pin-compatible EP1C12F256C7N without PCB change. For industrial or outdoor temperature ranges, select the EP1C6F256I7N variant; for lower-cost designs where Fmax is not critical, choose the EP1C6F256C6N. Avoid the EP1C6F256C7N for new automotive designs - it lacks AEC-Q100 qualification; consider a Cyclone IV or Cyclone V automotive-grade part instead.

Comparaison avec les alternatives

Paramètre Ce produit EP1C6F256C8N EP1C6F256C6N EP1C6F256I7N EP1C12F256C7N
Brand Intel (Altera) Intel Intel Intel Intel
Package 256-FBGA (17x17 mm) 256-FBGA - same 256-FBGA - same 256-FBGA - same 256-FBGA - same
Logic Elements 5,980 5,980 5,980 5,980 12,060
Speed Grade C7 C8 (faster) C6 (slower) I7 (industrial) C7
Temperature Grade Commercial 0C to +85C Commercial Commercial Industrial -40C to +100C Commercial
User I/O 185 185 185 185 185
Total RAM Bits 92,160 92,160 92,160 92,160 239,616
PLLs 2 2 2 2 2
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V

Principaux différenciateurs

  • Balanced mid-density 5,980 LE capacity with 185 user I/O (vs EP1C3T144C7N)
  • Pin-compatible migration to higher density EP1C12F256C7N (vs EP1C12F256C7N)
  • Long-life mature silicon with active legacy support (vs Lattice ECP2-6)

Notes de conception

Estimated: at 100% toggle rate across 5,980 LEs and 185 I/O toggling at 100 MHz, the EP1C6F256C7N draws roughly 500-700 mA from the 1.5 V core rail and 100-200 mA from the I/O banks. Decouple the core with at least four 4.7 µF bulk caps plus 0.1 µF X7R ceramics distributed around the BGA footprint. PLL analog supplies (VCC_PLL1/2) require isolated ferrite beads and 10 µF + 0.1 µF filtering per Cyclone handbook Chapter 11.

The 256-FBGA 17x17 mm package uses 1.0 mm ball pitch with full-array ball layout. PCB design requires microvia or via-in-pad technology on at least 4 routing layers to escape the inner rows; standard 0.2 mm vias on 0.4 mm pads work only on outer rows. Maintain a continuous ground plane on layer 2 beneath the BGA to control return paths and provide thermal dissipation; the exposed center balls are GND for thermal relief.

Quartus Prime (starting v14.0) does not officially support Cyclone I; use Quartus II 13.0sp1 or earlier for the EP1C6 family. Do not confuse the EP1C6 (Cyclone) with EP1C20 (Cyclone, higher density) or EP1AGX (Arria GX) - the device symbol in the .qsf file must exactly match EP1C6F256C7. For configuration, MSEL[2:0] pins must be tied to select AS (011), PS (000), or JTAG (101) mode per Cyclone Handbook Chapter 11.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

RoHS compliant per Arrow.com EU RoHS declaration. Not AEC-Q100 qualified - select a Cyclone IV/V automotive-grade part for new automotive programs. Halogen-free status not explicitly stated in the verified data.

Données vérifiées le : 2026-09-06 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

EP1C6F256C7N EP1C6F256C7N datasheet Altera Cyclone EP1C6F256C7N Intel Cyclone 5980 logic elements FPGA 256-FBGA Cyclone FPGA 1.5V EP1C6F256C7N motor control application EP1C6F256C7N vs EP1C6F256C8N EP1C6F256C7N drop-in replacement EP1C6F256C7N buy price how to program Cyclone EP1C6 with Quartus EP1C6F256C7N industrial temperature variant low cost FPGA 5K logic elements industrial

Composants & termes associés

Intel Altera EP1C6F256C7N Cyclone Cyclone I EP1C6F256C8N EP1C6F256C6N EP1C6F256I7N EP1C12F256C7N EPCS4 EPCS16 FPGA Field Programmable Gate Array Programmable Logic Device PLD SRAM-based FPGA logic element LE look-up table LUT M4K memory block PLL phase-locked loop LVDS SSTL-II DDR SDRAM FBGA FineLine BGA RoHS Quartus II SignalTap II industrial control video processing motor control ASIC prototyping
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