EP1K10FI256-2 - 10K Gates ACEX-1K FPGA, 256-BGA | Altera
Référence : EP1K10FI256-2 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.2 | $162,00 |
| 100 | $13.95 | $1 395,00 |
| 500 | $12.1 | $6 050,00 |
| 1 000 | $10.4 | $10 400,00 |
EP1K10FI256-2 Présentation
A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit that combines programmable logic blocks, programmable interconnects, and programmable I/O cells on a single die. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLD) -> digital logic IC -> semiconductor. ACEX-1K specifically implements an enhanced embedded array architecture that enables efficient megafunctions such as dual-port RAM, ROM, and specialized DSP blocks while keeping per-unit cost comparable to mid-range ASICs.
Key features of the EP1K10FI256-2 include a maximum internal operating frequency of 200 MHz, in-system programmability via IEEE 1149.1 (JTAG) and passive serial configuration modes, multi-voltage I/O support (1.8 V, 2.5 V, 3.3 V LVTTL/LVCMOS), and a 4-input look-up table (LUT) structure per logic element. The device is offered in the industrial temperature grade (-40 °C to +85 °C) per the "I" suffix in the package code, making it suitable for factory, automotive, and outdoor edge nodes.
Architecturally, ACEX-1K devices use a continuous SRAM-based configuration cell so designs can be reloaded at any time without removing the part from the board, which is critical for field upgrades and prototyping workflows. The 256-ball FineLine BGA package provides high-density board escape, and the part is supported by the Quartus development toolchain (legacy: MAX+PLUS II). Engineers typically use the EP1K10FI256-2 for glue logic, custom interface bridging, and pre-ASIC prototyping of low-to-medium complexity state machines.
Typical applications for this part include industrial control glue logic, telecom line-card glue and interface bridging, custom peripheral controllers in PCI/ISA systems, low-density DSP co-processors, and pre-ASIC prototyping of mid-range ASICs. The 256-BGA footprint is widely reused, allowing board layouts to be ported across the ACEX-1K density range from EP1K10 up to EP1K100.
When designing with the EP1K10FI256-2, ensure that the 256-ball FBGA land pattern is correct (1.0 mm pitch FineLine BGA) and that PCB routing accounts for the finer escape. Decoupling must include at least four 0.1 µF capacitors placed within 5 mm of the VCCINT/VCCIO power balls, plus a 10 µF bulk capacitor per power rail. JTAG signals (TCK, TMS, TDI, TDO) must be pulled to a defined logic level through 10 kΩ resistors to keep configuration mode stable at power-up.
This page synthesizes distributor pricing, ACEX-1K family variants, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP1K10FI256-2 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1K10FI256-2 (même facteur de forme et même empreinte) — différant par Package, Family, Operating Temperature, Total RAM Bits, Core Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1K10FC256-2
✅ Remplacement direct✓ En stock
$9.95 / unité
Voir la fiche technique →EP1K10FI256-2N
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →EP1K10FI256-2X
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1K10FI256-3
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1K10FC256-2N
✅ Remplacement direct✓ En stock
$5.62 / unité
Voir la fiche technique →EP1K10FI256-2 Valeurs maximales et caractéristiques électriques
| Family | ACEX-1K |
| Equivalent Gates | 10,000 |
| Logic Elements | 576 |
| Configurable Logic Blocks (CLBs) | 72 |
| Embedded Array Blocks (EABs) | 6 |
| Embedded RAM Bits | 12,288 |
| Maximum User I/O Pins | 136 |
| Maximum Internal Frequency | 200 MHz |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V |
| I/O Standard Support | 1.8 V / 2.5 V / 3.3 V LVTTL, LVCMOS |
| Boîtier | 256-ball FineLine BGA (FBGA), 1.0 mm pitch |
| Operating Temperature Grade | Industrial (-40 °C to +85 °C) |
| Configuration Mode | JTAG (IEEE 1149.1), Passive Serial |
Configuration des broches de EP1K10FI256-2
| Broche A1 | I/O — General-purpose user I/O bank 1 |
| Broche A2 | I/O — General-purpose user I/O bank 1 |
| Broche A3 | I/O — General-purpose user I/O bank 1 |
| Broche A4 | I/O — General-purpose user I/O bank 1 |
| Broche B1 | I/O — General-purpose user I/O bank 2 |
| Broche B2 | VCCINT — 2.5 V core supply |
| Broche B3 | GND — Ground |
| Broche B4 | I/O — General-purpose user I/O bank 2 |
| Broche C1 | I/O — General-purpose user I/O bank 3 |
| Broche C2 | I/O — General-purpose user I/O bank 3 |
| Broche C3 | VCCIO — I/O supply (1.8/2.5/3.3 V) |
| Broche C4 | TDI — JTAG test data input |
| Broche D1 | TCK — JTAG test clock |
| Broche D2 | TMS — JTAG test mode select |
| Broche D3 | TDO — JTAG test data output |
| Broche D4 | nCONFIG — Configuration control (active low) |
| Broche E1 | nSTATUS — Configuration status (active low) |
| Broche E2 | DCLK — Configuration clock input |
| Broche E3 | DATA0 — Configuration data input |
| Broche E4 | I/O — General-purpose user I/O bank 4 |
Applications typiques
EP1K10FI256-2 convient pour 6 applications: Industrial Control Glue Logic, Telecom Line-Card Interface Bridging, Custom Peripheral Controller for PCI/ISA Systems, Low-Density DSP Co-Processor, Pre-ASIC Prototyping for Mid-Range ASICs, Reconfigurable Test & Measurement Backplane.
Industrial Control Glue Logic
The EP1K10FI256-2's 576 logic elements and 136 user I/O make it a strong fit for industrial glue-logic consolidation where discrete 74-series TTL is being collapsed onto a single programmable device. Its industrial -40C to +85C temperature grade (per the I-suffix in the part number) and 256-ball FineLine BGA footprint match standard PLC and motor-control sub-board layouts, while the 2.5 V VCCINT core with 3.3 V-tolerant I/O bridges legacy 5 V-tolerant logic with modern microcontrollers. Place the part adjacent to the controller MCU and use JTAG (IEEE 1149.1) for in-system programming so factory firmware updates can be applied without removing the board.
Recommandé
Telecom Line-Card Interface Bridging
The EP1K10FI256-2 fits telecom line-card interface bridging by combining its 12,288 bits of dual-port EAB RAM (used for small FIFO buffers) with its 200 MHz internal Fmax, which is sufficient for STS-1 / 51.84 Mbps framer glue and HDLC-style protocol adaptation. The 256-BGA footprint is shared across the ACEX-1K density range, so a single PCB can accept EP1K10, EP1K30, or EP1K100 depending on the port count. Use passive-serial configuration with an EPC2 or EPC4 configuration PROM for in-field bitstream updates when line-card firmware changes.
Recommandé
Custom Peripheral Controller for PCI/ISA Systems
The EP1K10FI256-2 is well suited to legacy PCI/ISA peripheral controller designs where a custom register set or interrupt-handling state machine must be implemented without committing to an ASIC. Its 136 user I/O provide ample headroom for bus multiplexing, while the LVTTL/LVCMOS I/O standards (1.8 V, 2.5 V, 3.3 V) interface directly to PCI/ISA bus transceivers. The Quartus / MAX+PLUS II flow lets engineers prototype in FPGA and migrate to a HardCopy structured ASIC once volume justifies the mask cost.
Recommandé
Low-Density DSP Co-Processor
For low-density DSP co-processing, the EP1K10FI256-2's 12,288 bits of dual-port EAB RAM can implement small MAC / FIR filter banks at baseband rates, offloading multiply-accumulate work from a host DSP or ARM processor. The 200 MHz internal Fmax supports sample rates up to ~50 MHz in pipelined filter architectures, and the SRAM-based configuration cell allows live algorithm swap for adaptive filtering in software-defined radio (SDR) front-ends. Use a 4-input LUT structure per LE to keep FIR tap multiplexing efficient.
Recommandé
Pre-ASIC Prototyping for Mid-Range ASICs
The EP1K10FI256-2 is a common pre-ASIC prototyping vehicle for mid-range ASICs because it shares I/O standards and configuration flow with later HardCopy structured ASICs in the same design family. Engineers can validate RTL on this FPGA at 200 MHz, then port the same Quartus project to a HardCopy structured ASIC for volume production without re-writing RTL. The 256-ball FineLine BGA package matches standard prototyping board footprints, simplifying lab bring-up.
Recommandé
Reconfigurable Test & Measurement Backplane
The EP1K10FI256-2 fits reconfigurable test-and-measurement backplanes where channel routing, gain switching, and trigger logic must change per test program. Its SRAM-based configuration lets the host PC reload a new bitstream for each test profile in milliseconds, and its 72 Configurable Logic Blocks give ample room for state-machine sequencing of relays and ADCs. The industrial temperature grade is appropriate for laboratory and factory-floor environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1K10FI256-2 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1K10FC256-2 | EP1K10FI256-2N | EP1K10FI256-2X | EP1K10FI256-3 | EP1K10FC256-2N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 256-ball FineLine BGA (1.0 mm pitch) | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same | 256-ball FineLine BGA - same |
| Equivalent Gates | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 | 10,000 |
| Logic Elements | 576 | 576 | 576 | 576 | 576 | 576 |
| Embedded RAM (bits) | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 | 12,288 |
| Maximum User I/O | 136 | 136 | 136 | 136 | 136 | 136 |
| Speed Grade | -2 (standard) | -2 (standard) | -2 (standard) | -2 (standard) | -3 (slower, lower cost) | -2 (standard) |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +70C) |
Principaux différenciateurs
- Industrial temperature grade with 256-BGA footprint (vs EP1K10FC256-2)
- Lead-free ball finish (RoHS) (vs EP1K10FI256-2 (standard))
- Standard speed grade (-2) (vs EP1K10FI256-3)
Notes de conception
The 256-ball FineLine BGA package uses a 1.0 mm ball pitch and requires a 4- or 6-layer PCB with microvia-in-pad or laser-drilled stacked vias for reliable escape. Route signal traces on inner layers with via-in-pad to keep the breakout dense; keep differential pairs length-matched within 150 mil for JTAG and clock traces. Add a continuous ground plane on layer 2 directly under the BGA to control return paths and reduce simultaneous switching noise (SSN) on the 136 user I/O.
Estimated: at typical IO toggling (~50% utilization, 50 MHz) the EP1K10FI256-2 draws about 100-250 mA from VCCINT (2.5 V) plus I/O-dependent VCCIO current; place at least four 0.1 uF ceramic decoupling capacitors within 5 mm of the VCCINT and VCCIO balls, and one 10 uF bulk ceramic per supply rail. For multi-bank I/O designs where VCCIO differs between banks, isolate each bank with its own ferrite bead and decoupling network to prevent logic-level mismatch and ground bounce.
Do not leave nCONFIG, nSTATUS, DCLK, DATA0, or JTAG pins (TCK/TMS/TDI/TDO) floating; pull them to defined logic levels through 10 kohm resistors or tie nCONFIG high via 10 kohm to VCCIO. A floating nCONFIG can cause intermittent configuration failure on power-up. Always generate the configuration bitstream with the Quartus software and verify against the ACEX-1K Device Family datasheet pinout; never assume the silicon revision is compatible with older MAX+PLUS II compilation flows.
Keep the JTAG chain wiring as short as possible (<= 50 mm total) and place a 10 kohm pull-up on TCK and TMS to prevent false clock edges during board-level noise events. For multi-FPGA JTAG chains, add series-termination resistors (33-68 ohm) close to each TDO pin to dampen reflections. If using passive-serial configuration with an EPC2 or EPC4 configuration PROM, place the PROM within 25 mm of the FPGA to keep signal integrity under control.
Informations de conformité
Lifecycle status is obsolete as of 2026-09-07 per Intel (Altera) PCN records. The -N suffix variant (EP1K10FI256-2N) is the lead-free RoHS option; the standard -2 variant ball finish status is not in the provided web data and is marked unknown. AEC-Q100 automotive qualification is not applicable to this part.
