EP1K30FC256-3N - ACEX 1K FPGA, 30K Gates, 256-BGA | Intel
MPN: EP1K30FC256-3N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $27.99 | $27.99 |
| 10 | $25.19 | $251.90 |
| 100 | $21.8 | $2,180.00 |
| 250 | $19.62 | $4,905.00 |
| 500 | $17.5 | $8,750.00 |
Drop-in alternatives for EP1K30FC256-3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K30FC256-3
✅ Drop-In✓ In Stock
$11.1 / Unit
View Datasheet →EP1K30FC256-2N
✅ Drop-In✓ In Stock
$21.45 / Unit
View Datasheet →EP1K30FC256-1N
✅ Drop-In✓ In Stock
$13.95 / Unit
View Datasheet →EP1K100FC256-3N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP1K100FC256-2N
✅ Drop-In✓ In Stock
$78.1951 / Unit
View Datasheet →EP1K30FI256-2N
✅ Drop-In✓ In Stock
$18.4 / Unit
View Datasheet →EP1K30FC256-3N Maximum Ratings & Electrical Characteristics
| Family | ACEX 1K |
| Logic Elements / Cells | 17,288 logic elements (1,728 cells) |
| Typical Gates | 30,000 |
| Total RAM Bits | 24,576 |
| Number of LABs | 216 |
| User I/Os | 171 |
| Core Supply Voltage | 2.375 V to 2.625 V (nominal 2.5 V) |
| Technology | 0.22 µm CMOS, SRAM configuration |
| Speed Grade | -3 |
| Propagation Delay (typ.) | 0.6 ns |
| Maximum Frequency | 200 MHz |
| Package | 256-ball FineLine BGA (FBGA-256) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to +70 °C (commercial) |
| Configuration | SRAM, serial/parallel, JTAG ISP (IEEE 1149.1) |
EP1K30FC256-3N Pin Configuration
| Pin A1 | I/O — User I/O (Bank 1) |
| Pin A2 | I/O — User I/O (Bank 1) |
| Pin B1 | I/O — User I/O (Bank 1) |
| Pin B2 | VCCIO1 — I/O bank 1 supply |
| Pin C1 | I/O — User I/O (Bank 1) |
| Pin C2 | GND — Ground |
| Pin D1 | I/O — User I/O (Bank 1) |
| Pin D2 | I/O — User I/O (Bank 1) |
| Pin E1 | I/O — User I/O (Bank 1) |
| Pin E2 | I/O — User I/O (Bank 1) |
| Pin F1 | VCCINT — Core supply (2.5 V) |
| Pin F2 | I/O — User I/O (Bank 2) |
| Pin G1 | I/O — User I/O (Bank 2) |
| Pin G2 | GND — Ground |
| Pin H1 | I/O — User I/O (Bank 2) |
| Pin H2 | I/O — User I/O (Bank 2) |
| Pin J1 | I/O — User I/O (Bank 2) |
| Pin J2 | VCCIO2 — I/O bank 2 supply |
| Pin K1 | I/O — User I/O (Bank 2) |
| Pin K2 | I/O — User I/O (Bank 2) |
| Pin L1 | GND — Ground |
| Pin L2 | I/O — User I/O (Bank 3) |
| Pin M1 | I/O — User I/O (Bank 3) |
| Pin M2 | I/O — User I/O (Bank 3) |
| Pin N1 | VCCINT — Core supply (2.5 V) |
| Pin N2 | I/O — User I/O (Bank 3) |
| Pin TDI | TDI — JTAG Test Data In (IEEE 1149.1) |
| Pin TDO | TDO — JTAG Test Data Out (IEEE 1149.1) |
| Pin TMS | TMS — JTAG Test Mode Select (IEEE 1149.1) |
| Pin TCK | TCK — JTAG Test Clock (IEEE 1149.1) |
| Pin nCONFIG | nCONFIG — Configuration reset (active low) |
| Pin nSTATUS | nSTATUS — Configuration status (active low) |
| Pin CONFIG_DONE | CONFIG_DONE — Configuration complete (open-drain) |
| Pin DCLK | DCLK — Configuration clock input |
| Pin DATA0 | DATA0 — Configuration data input (LSB) |
| Pin MSEL0 | MSEL0 — Configuration mode select 0 |
| Pin MSEL1 | MSEL1 — Configuration mode select 1 |
| Pin GND | GND — Ground (multiple balls) |
| Pin VCCINT | VCCINT — Core supply (2.5 V, multiple balls) |
| Pin VCCIO | VCCIO — I/O bank supply (per bank, multiple balls) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K30FC256-3N is suitable for 7 applications: Telecommunications Interface Bridging, Digital Signal Processing Glue Logic, Peripheral Bus Expansion (PCI / Embedded CPU), Industrial Control Logic, ASIC Replacement / Low-Volume Custom Logic, Legacy System Sustainment / Field Upgrades, Test & Measurement Backplane Bridging.
Telecommunications Interface Bridging
The EP1K30FC256-3N fits telecommunications interface bridging because its 171 user I/Os accommodate wide parallel buses (e.g., UTOPIA, H.110, MVIP) and its 24,576 RAM bits support small FIFO buffers for rate-adaptation between backplane and framer. At 200 MHz in the -3 speed grade, the device achieves deterministic timing suitable for TDM/SONET glue logic, and the multiple VCCIO banks allow direct 3.3 V/2.5 V/1.8 V interfacing to mixed-voltage framers and transceivers without external level shifters. SameFrame pin-migration to EP1K100 enables a future upgrade without PCB rework when channel counts grow.
Recommended
Digital Signal Processing Glue Logic
For DSP glue logic between a fixed-function DSP processor and external memory, the EP1K30FC256-3N's 30K-gate capacity is well-matched to state-machine control, address decoding, and protocol conversion. Its 4-input LUTs and dedicated carry chains deliver efficient address-generation logic, while 24,576 embedded RAM bits can hold coefficient buffers for programmable filters. The 256-FBGA package's small footprint (17 mm × 17 mm) supports dense PCB layouts alongside DSP chips, and the -3 speed grade enables 200 MHz interfaces to SDRAM controllers without timing closure issues.
Recommended
Peripheral Bus Expansion (PCI / Embedded CPU)
The EP1K30FC256-3N is well-suited for peripheral bus expansion in PCI and embedded CPU systems because its 171 I/Os easily accommodate 32-bit address/data buses plus control signals. Its 30K gates handle state machines for DMA controllers, bus arbiters, and protocol translators between local buses (e.g., ISA, VME, PC/104) and host CPUs. The 200 MHz fabric speed enables zero-wait-state bus bridges in the -3 speed grade, while the multiple VCCIO banks allow direct 5 V-tolerant interfacing via external resistors where required for legacy peripherals.
Recommended
Industrial Control Logic
For industrial control and factory-automation controllers, the EP1K30FC256-3N's commercial temperature grade and 256-FBGA package provide reliable glue logic for PLCs, motor-control boards, and sensor aggregators. Its 30K gates can implement multiple encoder counters, PWM generators, and fieldbus state machines in a single device. With same-frame compatibility to the EP1K100 family, designers can migrate upward as I/O counts grow. For industrial-temperature deployments, the EP1K30FI256-2N is the pin-compatible drop-in alternative.
Recommended
ASIC Replacement / Low-Volume Custom Logic
The EP1K30FC256-3N is ideal as an ASIC replacement in low-volume or prototype products because designers can iterate logic without respinning silicon, dramatically reducing NRE costs. Its 30K gates handle typical custom peripherals (timers, watchdogs, protocol engines) that would otherwise require a small ASIC. The SRAM-based configuration supports in-system reprogrammability via JTAG, enabling field firmware updates. SameFrame migration to EP1K100 protects the PCB investment when designs outgrow the 30K-gate capacity.
Recommended
Legacy System Sustainment / Field Upgrades
For sustainment of legacy equipment originally designed around the ACEX 1K family, the EP1K30FC256-3N allows in-kind replacement of failed units without redesigning the PCB. Its 256-FBGA footprint matches the original Altera reference designs, and SRAM configuration means replacement boards can be loaded with the original firmware image via JTAG or configuration EPROM. Because the part is NRD, sourcing from authorized brokers is the primary channel; lifecycle migration to EP1K100FC256-3N is recommended for new production runs.
Recommended
Test & Measurement Backplane Bridging
In test-and-measurement instruments, the EP1K30FC256-3N bridges parallel backplane buses (e.g., VXI, PXI, LXI trigger lines) to custom measurement ASICs. Its 171 I/Os handle wide data and trigger buses, and its 24,576 RAM bits buffer measurement samples. The -3 speed grade supports 200 MHz backplane operation, while the multiple VCCIO banks interface directly to 3.3 V and 1.8 V measurement ADCs without level shifters. SameFrame pin migration enables a quick upgrade to EP1K100FC256-3N when higher gate counts are needed for new measurement channels.
Recommended
Recommended Products Summary
Engineering reference data for EP1K30FC256-3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K30FC256-3 | EP1K30FC256-2N | EP1K30FC256-1N | EP1K100FC256-3N | EP1K100FC256-2N | EP1K30FI256-2N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-256 | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same | FBGA-256 - same (SameFrame) | FBGA-256 - same (SameFrame) | FBGA-256 - same |
| Typical Gates | 30K | 30K | 30K | 30K | 100K (+233 %) | 100K (+233 %) | 30K |
| Speed Grade | -3 (fastest) | -3 | -2 | -1 (slowest) | -3 | -2 | -2 |
| User I/Os | 171 | 171 | 171 | 171 | 171 (same) | 171 (same) | 171 |
| Core Voltage | 2.5 V (2.375–2.625 V) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Total RAM Bits | 24,576 | 24,576 | 24,576 | 24,576 | 49,152 (+100 %) | 49,152 (+100 %) | 24,576 |
| Temperature Grade | Commercial (0 °C to +70 °C) | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial (-40 °C to +85 °C) |
| Lead-Free / RoHS | Lead-free ('N' suffix) | Lead-bearing (no 'N') | Lead-free | Lead-free | Lead-free | Lead-free | Lead-free |
| Lifecycle Status | NRD (Not Recommended for New Designs) | NRD | NRD | NRD | NRD | NRD | NRD |
Key Differentiators
- SameFrame pin-compatible upgrade path to 100K gates on the same 256-FBGA (vs EP1K10FC256-3N)
- Largest embedded RAM (24,576 bits) in the ACEX 1K 30K-gate class (vs EP1K30FC256-2N)
- Lead-free / RoHS-compliant packaging ('N' suffix) (vs EP1K30FC256-3)
- Commercial temperature grade for cost-sensitive designs (vs EP1K30FI256-2N)
Design Notes
The EP1K30FC256-3N requires three supply rails: VCCINT (2.5 V core, 2.375–2.625 V) and per-bank VCCIO supplies (1.8 V, 2.5 V, or 3.3 V depending on interfacing logic). Decouple each VCCINT ball with a 0.1 µF X7R ceramic capacitor placed within 5 mm of the ball, plus a 10 µF bulk tantalum or polymer capacitor per supply plane. Estimate (core current ~50–150 mA typical, scales with toggle rate and LAB utilization): Iccint ≈ 50 mA + 0.3 mA per utilized LAB at 100 MHz; verify against the datasheet's ICC vs frequency curves for production designs.
The 256-ball FineLine BGA has a 1.0 mm ball pitch and requires a 4–6 layer PCB with microvia or via-in-pad technology for reliable assembly. Use a solid ground plane on layer 2 directly beneath the BGA to provide a low-impedance return path and thermal dissipation. Route all signal traces on layers 3 and above; keep BGA escape traces short (≤ 5 mm). Per the Altera ACEX 1K datasheet, an exposed copper pad array of at least 100 mm² on the top side is recommended to keep junction temperature below 100 °C at maximum power.
Three common pitfalls when designing with the EP1K30FC256-3N: (1) confusing speed grade ordering — '-3' is the FASTEST bin, not the slowest (Altera convention reversed vs some competitors); (2) omitting the external configuration EPROM — the device is SRAM-based and loses its design on every power-down, so a serial configuration PROM (e.g., EPC2) or JTAG loader is mandatory; (3) mixing VCCIO voltages incorrectly — each bank must be powered to a single uniform voltage; mixing 3.3 V and 1.8 V within the same bank damages the I/O cells. Always consult the Bank VCCIO table before PCB layout.
The 256-FBGA package dissipates heat through the PCB rather than a top-side heat spreader. Estimate (junction-to-ambient thermal resistance θJA ≈ 18 °C/W for a 256-BGA on a 4-layer JEDEC test board): at 0.5 W typical dissipation, junction temperature rise above ambient is ~9 °C; at 1.5 W worst-case, rise is ~27 °C. For commercial-grade (0 °C to +70 °C) operation, ambient up to 70 °C is achievable at 1 W dissipation. Above 1.5 W, reduce ambient or add airflow to keep Tj below 100 °C.
JTAG signals (TDI, TDO, TMS, TCK) must be routed with 4.7 kΩ pull-ups to VCCIO and matched lengths within 25 mm to preserve signal integrity per IEEE 1149.1. The nCONFIG and nSTATUS signals are open-drain and require external 10 kΩ pull-ups to VCCIO. Place the configuration EPROM (EPC2 or compatible) within 50 mm of the FPGA to keep configuration trace impedance matched; long configuration traces (>100 mm) require series termination.
Compliance Information
'N' suffix indicates lead-free RoHS-compliant solder balls per Altera/Intel packaging convention. AEC-Q100 not applicable — FPGAs are not qualified for automotive AEC-Q100 by Altera/Intel; use automotive-grade Cyclone or other families for that purpose. Halogen-free and conflict-minerals status not stated in retrieved data.