EP1SGX25DF1020I7 - Stratix GX FPGA 25,660 Cells 1020-BGA | Intel
Référence : EP1SGX25DF1020I7 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $252 | $2 520,00 |
| 100 | $220 | $22 000,00 |
| 500 | $195 | $97 500,00 |
| 1 000 | $175 | $175 000,00 |
EP1SGX25DF1020I7 Présentation
A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit that combines configurable logic blocks, programmable interconnect, and dedicated I/O and memory resources. In the system design hierarchy, FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism, deterministic latency, and post-production reconfigurability. The Stratix GX family was Intel's first generation of FPGAs with embedded multi-gigabit transceivers, enabling protocol-agnostic serial connectivity for telecom, storage, and defense designs.
Key features of the EP1SGX25DF1020I7 include dedicated high-speed transceiver channels supporting data rates up to 3.125 Gbps, embedded TriMatrix memory blocks for efficient on-chip buffering, and an enhanced routing architecture optimized for timing closure. The 1020-ball FC-FBGA package provides high signal and power pin density while supporting controlled-impedance differential pairs, which is essential for multi-gigabit serial links. Industrial temperature grade ensures operation across extended thermal ranges without derating logic performance.
The device is engineered for high-bandwidth serial I/O applications including backplane interfaces, telecommunications line cards, and high-end test equipment. The high logic cell count supports complex state machines, soft processor cores, and parallel data-path processing that would be impractical in a fixed-function ASIC during prototyping. The transceiver-rich architecture lets designers implement protocols such as Serial RapidIO, PCI Express Gen 1, Gigabit Ethernet, and XAUI directly in the fabric without external PHY components.
Typical applications include high-speed data acquisition systems, software-defined radio (SDR) baseband processing, optical transport network (OTN) line cards, and military/aerospace signal processing. The high pin count accommodates hundreds of LVDS, LVTTL, and SSTL I/O, which is valuable for parallel ADC/DAC interfaces.
When designing with this part, pay careful attention to PCB layout for the FC-FBGA footprint: use microvia stack-ups and matched-length differential routing for transceiver channels. Decoupling must follow Intel's Stratix GX power distribution network guidelines, with both bulk and high-frequency ceramic capacitors placed within 100 mils of each supply pin. The I7 industrial temperature grade also requires thermal modeling to ensure junction temperature stays within datasheet limits at maximum toggle rates.
This page synthesizes distributor pricing, drop-in same-family alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP1SGX25DF1020I7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1SGX25DF1020I7 (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Package Dimensions, Package Type, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1SGX25DF1020I6N
✅ Remplacement direct✓ En stock
$165 / unité
Voir la fiche technique →EP1SGX25DF1020I5N
✅ Remplacement direct✓ En stock
$985 / unité
Voir la fiche technique →EP1SGX25DF1020I5
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP1SGX25DF1020C7N
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →EP1SGX25DF1020C7ES
✅ Remplacement direct✓ En stock
$1950 / unité
Voir la fiche technique →EP1SGX25DF1020C7
✅ Remplacement direct✓ En stock
$145 / unité
Voir la fiche technique →EP1SGX25DF1020I7 Valeurs maximales et caractéristiques électriques
| Family | Stratix GX |
| Logic Cells | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Maximum Operating Frequency | 4,385.97 MHz |
| Combinatorial CLB Delay | 9.48 ns |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Boîtier | 1020-ball FC-FBGA |
| Speed Grade | I7 (industrial) |
| Température de fonctionnement | -40C to +100C (industrial) |
| Nombre de broches | 1020 |
| Package Code | BGA |
| Package Shape | Square |
| Form of Terminal | Ball |
| Transceiver Support | Embedded multi-gigabit transceivers (Stratix GX family) |
Guide de configuration des broches du EP1SGX25DF1020I7 square
Configuration des broches du EP1SGX25DF1020I7 (boîtier square). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1SGX25DF1020I7.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1SGX25DF1020I7 convient pour 6 applications: Telecom Backplane Interface Card, Software-Defined Radio (SDR) Baseband, High-Speed Data Acquisition System, Optical Transport Network (OTN) Line Card, Military / Aerospace Signal Processing, Test & Measurement Instrumentation.
Telecom Backplane Interface Card
The EP1SGX25DF1020I7 is a strong fit for telecom backplane line cards because its 1020-ball FC-FBGA package exposes embedded multi-gigabit transceivers capable of up to 3.125 Gbps per channel - the rate needed for XAUI, Serial RapidIO, and PCI Express Gen 1 backplanes. The 25,660 logic cells accommodate protocol state machines, framing logic, and FIFO buffering for multiple ports without external glue logic. Designers typically instantiate 4-8 transceiver channels plus 8b/10b encoders and a soft Nios CPU for management plane control. The I7 industrial speed grade also ensures timing closure across the -40C to +100C operating range demanded by central-office equipment.
Recommandé
Software-Defined Radio (SDR) Baseband
In SDR baseband processing the EP1SGX25DF1020I7 supplies the parallel compute density needed to implement multi-channel digital down-conversion (DDC), finite impulse response (FIR) filtering, and FFT engines for radar and wireless-infrastructure applications. The 25,660 logic cells and 2,566 CLBs sustain 16-32 parallel DSP slices while the embedded transceivers stream digitized IF samples from front-end ADCs at multi-gigabit rates. The I7 industrial temperature grade suits outdoor base-station and tactical-radio deployments. Bitstream portability with the broader Stratix GX family means existing firmware IP can be reused across multiple boards.
Recommandé
High-Speed Data Acquisition System
The EP1SGX25DF1020I7 fits high-speed data acquisition systems where hundreds of LVDS or SSTL parallel I/O lines interface to multi-channel ADCs and DACs. The 1020-ball FC-FBGA exposes sufficient I/O banks to support 16-bit wide LVDS data buses plus dedicated clock, frame, and sync pins, with 25,660 logic cells providing on-chip memory buffering and reduction logic. The I7 industrial grade lets the design sit next to high-power analog front ends without thermal derating. The fabric's deterministic latency is critical for time-correlated multi-channel capture in physics instrumentation and radar receivers.
Recommandé
Optical Transport Network (OTN) Line Card
The EP1SGX25DF1020I7's combination of 3.125 Gbps multi-gigabit transceivers and 25,660 logic cells directly maps to OTN line-card requirements: 4x transceiver lanes for OTU2/OTU2e, forward-error-correction (FEC) encoders, framing and de-framing, plus GFP mapping logic. The industrial temperature grade (I7) is required for central-office and outside-plant environments. The 1020-ball package's high pin density accommodates the multiple clock domains and synchronization buses typical of OTN designs. The device can be paired with a small microcontroller for OTN overhead processing, allowing most of the FPGA fabric to focus on high-speed data path functions.
Recommandé
Military / Aerospace Signal Processing
Defense and aerospace signal processing systems such as electronic-warfare (EW) receivers, radar front ends, and secure-communication modems benefit from the EP1SGX25DF1020I7's combination of high logic density, embedded transceivers, and the I7 industrial temperature grade. The 25,660 logic cells and 2,566 CLBs support pulse compression, MTI filtering, and adaptive-beamforming DSP. The 1020-ball FC-FBGA is ruggedized through underfill and lid options for vibration and thermal-shock compliance. Designers also value bitstream compatibility with the rest of the Stratix GX family, allowing single firmware IP reuse across multiple platform variants.
Recommandé
Test & Measurement Instrumentation
High-end test-and-measurement instruments such as protocol analyzers, BERT testers, and high-speed digitizers use the EP1SGX25DF1020I7 as the central pattern-generation and data-acquisition engine. The transceivers connect to the device under test at multi-gigabit rates while the 25,660 logic cells implement pattern generators, error counters, and protocol-aware decoding. The industrial temperature grade supports bench and lab environments without thermal-throttling concerns. Deterministic fabric timing is essential for triggering accuracy and timing-correlation measurements required by compliance test platforms.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1SGX25DF1020I7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1SGX25DF1020I6N | EP1SGX25DF1020I5N | EP1SGX25DF1020I5 | EP1SGX25DF1020C7N | EP1SGX25DF1020C7 |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Speed Grade | I7 (industrial) | I6 | I5 | I5 | C7 | C7 |
| Temperature Range | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Logic Cells | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
Principaux différenciateurs
- Pin-compatible speed-grade flexibility within the Stratix GX family (vs EP1SGX25CF672I7)
- Higher transceiver count vs smaller Stratix GX siblings (vs EP1SGX10DF672I6N)
- Industrial temperature grade vs commercial-only Stratix GX variants (vs EP1SGX25DF1020C7)
Notes de conception
The 1020-ball FC-FBGA package requires a high-density PCB stack-up with laser-drilled microvias and via-in-pad technology to break out the fine-pitch BGA balls. Use a 4-6 layer stack-up with continuous ground planes adjacent to signal layers; place 0.1 uF high-frequency ceramic decoupling capacitors within 100 mils of every VCCINT and VCCIO pin, plus bulk 10-100 uF tantalum or polymer capacitors near the FPGA power pins. Matched-length differential routing (within 5 mil tolerance) is mandatory for the multi-gigabit transceiver channels. Reference the Stratix GX Device Family Data Sheet for the full pinout and pin-type tables.
The 1020-ball FC-FBGA package's thermal performance is highly dependent on the PCB copper area connected to the central ground pad and the optional heat-spreader attach. Estimate worst-case junction temperature using theta_JA from the datasheet (typically 12-15 C/W for the 1020-ball FC-FBGA on a 1-oz 4-layer JEDEC test board) plus the I7 industrial 100C limit. At 2-3 W typical and 5 W worst-case design power, the device may need a heat spreader or forced airflow to stay under the junction limit. Run a thermal simulation with the actual board copper geometry to confirm.
Three pitfalls are most common in legacy Stratix GX designs: (1) using the wrong bitstream format between the I7 industrial and C7 commercial variants - they are NOT bitstream-compatible and require different SOF files from Quartus; (2) confusing the I7 industrial speed grade with the I7 military temperature grade - the I7 industrial range is -40C to +100C, not the full military -55C to +125C; (3) sourcing counterfeit or remarked devices from the open market - always require a C-of-C and third-party authentication report (ERAI, SiliconExpert) for obsolete FPGAs. The EP1SGX25DF1020I7 is a high-value target for counterfeiters because of its $200+ typical aftermarket price.
Informations de conformité
Stratix GX family compliance status not in verified web data. The N suffix typically indicates lead-free and RoHS-compliant; without N suffix, status is unknown. Always request the latest C-of-C from the distributor.