EP1SGX25DF1020I7 - Stratix GX FPGA 25,660 Cells 1020-BGA | Intel
Teilenummer: EP1SGX25DF1020I7 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $252 | $2.520,00 |
| 100 | $220 | $22.000,00 |
| 500 | $195 | $97.500,00 |
| 1.000 | $175 | $175.000,00 |
EP1SGX25DF1020I7 Übersicht
A Field-Programmable Gate Array (FPGA) is a reprogrammable integrated circuit that combines configurable logic blocks, programmable interconnect, and dedicated I/O and memory resources. In the system design hierarchy, FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering hardware-level parallelism, deterministic latency, and post-production reconfigurability. The Stratix GX family was Intel's first generation of FPGAs with embedded multi-gigabit transceivers, enabling protocol-agnostic serial connectivity for telecom, storage, and defense designs.
Key features of the EP1SGX25DF1020I7 include dedicated high-speed transceiver channels supporting data rates up to 3.125 Gbps, embedded TriMatrix memory blocks for efficient on-chip buffering, and an enhanced routing architecture optimized for timing closure. The 1020-ball FC-FBGA package provides high signal and power pin density while supporting controlled-impedance differential pairs, which is essential for multi-gigabit serial links. Industrial temperature grade ensures operation across extended thermal ranges without derating logic performance.
The device is engineered for high-bandwidth serial I/O applications including backplane interfaces, telecommunications line cards, and high-end test equipment. The high logic cell count supports complex state machines, soft processor cores, and parallel data-path processing that would be impractical in a fixed-function ASIC during prototyping. The transceiver-rich architecture lets designers implement protocols such as Serial RapidIO, PCI Express Gen 1, Gigabit Ethernet, and XAUI directly in the fabric without external PHY components.
Typical applications include high-speed data acquisition systems, software-defined radio (SDR) baseband processing, optical transport network (OTN) line cards, and military/aerospace signal processing. The high pin count accommodates hundreds of LVDS, LVTTL, and SSTL I/O, which is valuable for parallel ADC/DAC interfaces.
When designing with this part, pay careful attention to PCB layout for the FC-FBGA footprint: use microvia stack-ups and matched-length differential routing for transceiver channels. Decoupling must follow Intel's Stratix GX power distribution network guidelines, with both bulk and high-frequency ceramic capacitors placed within 100 mils of each supply pin. The I7 industrial temperature grade also requires thermal modeling to ensure junction temperature stays within datasheet limits at maximum toggle rates.
This page synthesizes distributor pricing, drop-in same-family alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für EP1SGX25DF1020I7 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit EP1SGX25DF1020I7 (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Package Dimensions, Package Type, RoHS Status.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
EP1SGX25DF1020I6N
✅ Drop-In✓ Auf Lager
$165 / Stück
Datenblatt ansehen →EP1SGX25DF1020I5N
✅ Drop-In✓ Auf Lager
$985 / Stück
Datenblatt ansehen →EP1SGX25DF1020I5
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →EP1SGX25DF1020C7N
✅ Drop-In✓ Auf Lager
$171 / Stück
Datenblatt ansehen →EP1SGX25DF1020C7ES
✅ Drop-In✓ Auf Lager
$1950 / Stück
Datenblatt ansehen →EP1SGX25DF1020C7
✅ Drop-In✓ Auf Lager
$145 / Stück
Datenblatt ansehen →EP1SGX25DF1020I7 Grenzwerte & elektrische Eigenschaften
| Family | Stratix GX |
| Logic Cells | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 |
| Maximum Operating Frequency | 4,385.97 MHz |
| Combinatorial CLB Delay | 9.48 ns |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Gehäuse | 1020-ball FC-FBGA |
| Speed Grade | I7 (industrial) |
| Betriebstemperatur | -40C to +100C (industrial) |
| Anzahl der Pins | 1020 |
| Package Code | BGA |
| Package Shape | Square |
| Form of Terminal | Ball |
| Transceiver Support | Embedded multi-gigabit transceivers (Stratix GX family) |
EP1SGX25DF1020I7 square Pinbelegungsleitfaden
Pinbelegung für EP1SGX25DF1020I7 (square-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für EP1SGX25DF1020I7.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
EP1SGX25DF1020I7 ist geeignet für 6 Anwendungs: Telecom Backplane Interface Card, Software-Defined Radio (SDR) Baseband, High-Speed Data Acquisition System, Optical Transport Network (OTN) Line Card, Military / Aerospace Signal Processing, Test & Measurement Instrumentation.
Telecom Backplane Interface Card
The EP1SGX25DF1020I7 is a strong fit for telecom backplane line cards because its 1020-ball FC-FBGA package exposes embedded multi-gigabit transceivers capable of up to 3.125 Gbps per channel - the rate needed for XAUI, Serial RapidIO, and PCI Express Gen 1 backplanes. The 25,660 logic cells accommodate protocol state machines, framing logic, and FIFO buffering for multiple ports without external glue logic. Designers typically instantiate 4-8 transceiver channels plus 8b/10b encoders and a soft Nios CPU for management plane control. The I7 industrial speed grade also ensures timing closure across the -40C to +100C operating range demanded by central-office equipment.
Empfohlen
Software-Defined Radio (SDR) Baseband
In SDR baseband processing the EP1SGX25DF1020I7 supplies the parallel compute density needed to implement multi-channel digital down-conversion (DDC), finite impulse response (FIR) filtering, and FFT engines for radar and wireless-infrastructure applications. The 25,660 logic cells and 2,566 CLBs sustain 16-32 parallel DSP slices while the embedded transceivers stream digitized IF samples from front-end ADCs at multi-gigabit rates. The I7 industrial temperature grade suits outdoor base-station and tactical-radio deployments. Bitstream portability with the broader Stratix GX family means existing firmware IP can be reused across multiple boards.
Empfohlen
High-Speed Data Acquisition System
The EP1SGX25DF1020I7 fits high-speed data acquisition systems where hundreds of LVDS or SSTL parallel I/O lines interface to multi-channel ADCs and DACs. The 1020-ball FC-FBGA exposes sufficient I/O banks to support 16-bit wide LVDS data buses plus dedicated clock, frame, and sync pins, with 25,660 logic cells providing on-chip memory buffering and reduction logic. The I7 industrial grade lets the design sit next to high-power analog front ends without thermal derating. The fabric's deterministic latency is critical for time-correlated multi-channel capture in physics instrumentation and radar receivers.
Empfohlen
Optical Transport Network (OTN) Line Card
The EP1SGX25DF1020I7's combination of 3.125 Gbps multi-gigabit transceivers and 25,660 logic cells directly maps to OTN line-card requirements: 4x transceiver lanes for OTU2/OTU2e, forward-error-correction (FEC) encoders, framing and de-framing, plus GFP mapping logic. The industrial temperature grade (I7) is required for central-office and outside-plant environments. The 1020-ball package's high pin density accommodates the multiple clock domains and synchronization buses typical of OTN designs. The device can be paired with a small microcontroller for OTN overhead processing, allowing most of the FPGA fabric to focus on high-speed data path functions.
Empfohlen
Military / Aerospace Signal Processing
Defense and aerospace signal processing systems such as electronic-warfare (EW) receivers, radar front ends, and secure-communication modems benefit from the EP1SGX25DF1020I7's combination of high logic density, embedded transceivers, and the I7 industrial temperature grade. The 25,660 logic cells and 2,566 CLBs support pulse compression, MTI filtering, and adaptive-beamforming DSP. The 1020-ball FC-FBGA is ruggedized through underfill and lid options for vibration and thermal-shock compliance. Designers also value bitstream compatibility with the rest of the Stratix GX family, allowing single firmware IP reuse across multiple platform variants.
Empfohlen
Test & Measurement Instrumentation
High-end test-and-measurement instruments such as protocol analyzers, BERT testers, and high-speed digitizers use the EP1SGX25DF1020I7 as the central pattern-generation and data-acquisition engine. The transceivers connect to the device under test at multi-gigabit rates while the 25,660 logic cells implement pattern generators, error counters, and protocol-aware decoding. The industrial temperature grade supports bench and lab environments without thermal-throttling concerns. Deterministic fabric timing is essential for triggering accuracy and timing-correlation measurements required by compliance test platforms.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für EP1SGX25DF1020I7 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | EP1SGX25DF1020I6N | EP1SGX25DF1020I5N | EP1SGX25DF1020I5 | EP1SGX25DF1020C7N | EP1SGX25DF1020C7 |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Speed Grade | I7 (industrial) | I6 | I5 | I5 | C7 | C7 |
| Temperature Range | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Logic Cells | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process Technology | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
Wichtigste Unterscheidungsmerkmale
- Pin-compatible speed-grade flexibility within the Stratix GX family (vs. EP1SGX25CF672I7)
- Higher transceiver count vs smaller Stratix GX siblings (vs. EP1SGX10DF672I6N)
- Industrial temperature grade vs commercial-only Stratix GX variants (vs. EP1SGX25DF1020C7)
Designhinweise
The 1020-ball FC-FBGA package requires a high-density PCB stack-up with laser-drilled microvias and via-in-pad technology to break out the fine-pitch BGA balls. Use a 4-6 layer stack-up with continuous ground planes adjacent to signal layers; place 0.1 uF high-frequency ceramic decoupling capacitors within 100 mils of every VCCINT and VCCIO pin, plus bulk 10-100 uF tantalum or polymer capacitors near the FPGA power pins. Matched-length differential routing (within 5 mil tolerance) is mandatory for the multi-gigabit transceiver channels. Reference the Stratix GX Device Family Data Sheet for the full pinout and pin-type tables.
The 1020-ball FC-FBGA package's thermal performance is highly dependent on the PCB copper area connected to the central ground pad and the optional heat-spreader attach. Estimate worst-case junction temperature using theta_JA from the datasheet (typically 12-15 C/W for the 1020-ball FC-FBGA on a 1-oz 4-layer JEDEC test board) plus the I7 industrial 100C limit. At 2-3 W typical and 5 W worst-case design power, the device may need a heat spreader or forced airflow to stay under the junction limit. Run a thermal simulation with the actual board copper geometry to confirm.
Three pitfalls are most common in legacy Stratix GX designs: (1) using the wrong bitstream format between the I7 industrial and C7 commercial variants - they are NOT bitstream-compatible and require different SOF files from Quartus; (2) confusing the I7 industrial speed grade with the I7 military temperature grade - the I7 industrial range is -40C to +100C, not the full military -55C to +125C; (3) sourcing counterfeit or remarked devices from the open market - always require a C-of-C and third-party authentication report (ERAI, SiliconExpert) for obsolete FPGAs. The EP1SGX25DF1020I7 is a high-value target for counterfeiters because of its $200+ typical aftermarket price.
Compliance-Informationen
Stratix GX family compliance status not in verified web data. The N suffix typically indicates lead-free and RoHS-compliant; without N suffix, status is unknown. Always request the latest C-of-C from the distributor.