EP20K100EFC324-2X - APEX 20KE 100K Gates FPGA | Intel / Altera
Référence : EP20K100EFC324-2X ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $162 | $1 620,00 |
| 100 | $138 | $13 800,00 |
| 500 | $118 | $59 000,00 |
| 1 000 | $99.5 | $99 500,00 |
EP20K100EFC324-2X Présentation
An FPGA (Field Programmable Gate Array) is a type of Programmable Logic Device (PLD) that combines a large array of configurable logic blocks (LABs/CLBs), embedded memory blocks, I/O elements, and programmable interconnect into a single semiconductor IC. FPGAs occupy the high-density end of the programmable-logic hierarchy (above CPLDs and SPLDs) and are widely used for parallel DSP, custom glue logic, bus interfacing, and prototype ASIC replacement. The APEX 20KE family, in particular, pioneered multi-core architecture (MegaLAB) that combines lookup tables, product-term logic and Embedded Array Blocks (EABs) on a single die.
Key features of the EP20K100EFC324-2X include: 100K system gates, 4,160 logic cells, 53248 bits of embedded RAM, 416 LABs/CLBs, 246 maximum user I/Os, 1.8 V core supply, in-system programmability via IEEE 1149.1 JTAG, MultiVolt I/O support for interfacing to 1.8 V / 2.5 V / 3.3 V logic, and a 4-input Look-Up Table (LUT)-based fine-grain architecture. The -2X speed grade delivers approximately 35% faster design performance than the original APEX 20K family, according to Altera's published device-family literature.
The device uses a fine-grain, LUT-based architecture organized into MegaLAB structures that contain 16 Logic Array Blocks (LABs), an Embedded System Block (ESB) of 2 Kbits, and dedicated carry chains for fast arithmetic. Distributed and block RAM combined with dedicated clock networks and PLL-style clock-management blocks (per Altera APEX 20KE family documentation) simplify high-speed digital design. Configuration is stored in SRAM cells and is loaded via JTAG, passive serial, passive parallel, or Altera configuration EPROMs.
Typical applications include telecommunications line-card glue logic, industrial control and factory-automation controllers, ASIC prototyping, DSP coprocessing front-ends, custom bus-bridges, and PCI interface bridging. Its 246 user I/Os make it well-suited to legacy parallel-bus and memory-interface designs that predate modern System-on-Chip integration.
A key design consideration with the EP20K100EFC324-2X is that the APEX 20KE family has been NRND (Not Recommended for New Designs) by Intel / Altera for many years, so engineers should plan a migration path to a Cyclone, MAX, or Stratix equivalent for new production. The FBGA-324 (19x19 mm) package requires careful PCB layout with microvia or via-in-pad technology to route signals out of the inner balls.
This page synthesizes distributor pricing, drop-in same-family alternatives, FBGA-324 footprint compatibility notes, and practical APEX 20KE design migration guidance not aggregated on any single distributor listing.
Alternatives de remplacement direct pour EP20K100EFC324-2X — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K100EFC324-2X (même facteur de forme et même empreinte) — différant par Family, Process Technology, Package, Operating Temperature, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K100EFC324-2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP20K200EFC324-2X
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP20K100EFC324-1N
✅ Remplacement direct✓ En stock
$108 / unité
Voir la fiche technique →EP20K100EFC324-2X Valeurs maximales et caractéristiques électriques
| Family | APEX 20KE |
| Device Type | SPLD / FPGA (Field Programmable Gate Array) |
| System Gates | 100,000 gates |
| Logic Elements / Cells | 4,160 |
| Total RAM Bits | 53,248 bits |
| LABs / CLBs | 416 |
| Maximum User I/Os | 246 |
| Number of I/O Banks | 8 (per APEX 20KE family) |
| Propagation Delay | 1.6 ns |
| Internal Operating Frequency | Up to 250 MHz |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | MultiVolt: 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 0.22 µm CMOS (all-layer copper metal) |
| Speed Grade | -2X |
| Boîtier | 324-ball FBGA (FineLine BGA), 19x19 mm, 1.27 mm pitch |
| Type de montage | Surface Mount |
| Température de fonctionnement | 0 °C to 85 °C (Commercial) |
| Programming Interface | IEEE 1149.1 JTAG |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG, Altera configuration EPROM |
Guide de configuration des broches du EP20K100EFC324-2X 324-ball fbga (fineline bga), 19x19 mm, 1.27 mm pitch
Configuration des broches du EP20K100EFC324-2X (boîtier 324-ball fbga (fineline bga), 19x19 mm, 1.27 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP20K100EFC324-2X.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP20K100EFC324-2X convient pour 6 applications: Telecommunications Line-Card Glue Logic, Industrial Control and Factory Automation Controllers, ASIC Prototyping and Validation, Custom Bus Bridges and Protocol Converters, DSP Coprocessor Front-End, Legacy PCI Interface Card Designs.
Telecommunications Line-Card Glue Logic
The EP20K100EFC324-2X fits telecom line-card glue logic because its 100K system gates, 4,160 logic cells and 246 user I/Os are enough to bridge legacy TDM buses, framing devices and network processors without a co-processor. The MultiVolt I/O (1.8/2.5/3.3 V on VCCIO banks) lets the device talk directly to 3.3 V PHY chips while running its core at 1.8 V, which simplifies mixed-voltage board design. The 53,248 bits of embedded RAM serve as fast lookup-table and packet-header storage for backplane routing. Compared with an ASIC redesign cycle of 12-18 months, this FPGA can be programmed in days via JTAG, accelerating NPI for last-mile DSLAM and SONET line cards.
Recommandé
Industrial Control and Factory Automation Controllers
For industrial PLC and motion-control cards, the EP20K100EFC324-2X delivers deterministic logic through its 4-input LUT-based fabric and dedicated carry chains, which give predictable timing for encoder quadrature decoding and PWM generation. The 246 I/Os support a large number of 24 V opto-isolated digital inputs and relay-driver outputs in parallel, eliminating the need for external mux expanders. Operating from a 1.8 V core, the device dissipates roughly 0.5-1 W in typical gate-utilization designs, which simplifies thermal design inside sealed IP65 enclosures. Existing field installations can keep running on this part while new designs move to MAX 10 or Cyclone IV E for active lifecycle support.
Recommandé
ASIC Prototyping and Validation
The EP20K100EFC324-2X is widely used as an ASIC prototype vehicle because its 100K gates and 246 I/Os are large enough to map an entire mid-complexity ASIC RTL netlist. Engineers partition the design across multiple APEX 20KE devices and use JTAG-based multi-device configuration chains to validate the ASIC's real-world I/O behaviour, timing margins and bus protocols before committing to mask tooling. The 53,248-bit embedded RAM also helps emulate SRAM blocks and FIFO buffers that the final ASIC will integrate. Quartus II synthesis flow matches typical ASIC synthesis, so timing closure on the FPGA is a good predictor of post-layout ASIC timing.
Recommandé
Custom Bus Bridges and Protocol Converters
When a designer needs to bridge PCI, VME, ISA or proprietary backplane buses to a modern processor, the EP20K100EFC324-2X's 246 user I/Os and MultiVolt I/O make it an ideal bus-translation engine. The 4,160 logic cells can implement master/target state machines for both buses simultaneously, while the 53,248-bit embedded RAM acts as a shared mailbox and FIFO buffer between the two domains. Bus-bridge designs that need more logic capacity can drop in the EP20K200EFC324-2X on the same FBGA-324 footprint. This keeps the PCB layout fixed while doubling the available logic resources for higher-throughput bridge designs.
Recommandé
DSP Coprocessor Front-End
The EP20K100EFC324-2X serves as a DSP front-end that pre-processes data streams before handing them to a host DSP or microprocessor. Its 4,160 logic cells and fast carry chains perform FIR filters, FFT butterflies and CORDIC rotations at rates that complement a software DSP running control loops. The 53,248-bit embedded RAM holds twiddle-factor tables and sample buffers, eliminating external memory fetches on each clock cycle. The 246 I/Os simultaneously connect to multiple ADC/DAC channels and the host processor's external memory interface, making this FPGA a cost-effective co-processor for mid-rate signal-processing designs.
Recommandé
Legacy PCI Interface Card Designs
The EP20K100EFC324-2X is a natural fit for legacy 32-bit/33 MHz PCI interface cards because its 246 user I/Os and MultiVolt 3.3 V I/O banks can talk directly to a PCI bus without external transceivers. The 4,160 logic cells hold the PCI target/master state machine, configuration-space registers and interrupt logic in a single device, while the 53,248-bit embedded RAM provides DMA descriptor rings and small payload buffers. Although PCI has been superseded by PCIe in new designs, thousands of industrial, instrumentation and test cards still ship with this FPGA because of its deterministic 33 MHz timing and proven Quartus II IP library.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K100EFC324-2X — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K100EFC324-2 | EP20K200EFC324-2X | EP20K100EFC324-1N |
|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 324-ball FBGA (19x19 mm) | 324-ball FBGA (19x19 mm) - same | 324-ball FBGA (19x19 mm) - same | 324-ball FBGA (19x19 mm) - same |
| System Gates | 100K | 100K | 200K | 100K |
| Logic Cells / Elements | 4,160 | 4,160 | 8,320 | 4,160 |
| Maximum User I/Os | 246 | 246 | 246 | 246 |
| Embedded RAM Bits | 53,248 | 53,248 | 106,496 | 53,248 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Speed Grade | -2X (fastest) | -2 (slower) | -2X | -1N (industrial temp) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Highest speed grade in the APEX 20KE 100K-gate family (vs EP20K100EFC324-2)
- Highest logic density in the same FBGA-324 footprint (vs EP20K100EFC324-1N)
- Lower-density, lower-cost option on the same FBGA-324 footprint (vs EP20K200EFC324-2X)
Notes de conception
The APEX 20KE family uses 1.8 V VCCINT but its I/O banks support 1.8 V / 2.5 V / 3.3 V on VCCIO - mixing the wrong bank voltage is a common bring-up failure. Always check the Quartus II 'Device and Pin Options' report to confirm VCCIO bank assignments before powering the board, and verify that no pin is configured for an I/O standard whose voltage is not present on that bank. Estimated power dissipation for a 50% utilization, 250 MHz design is roughly 0.8 W from VCCINT and another 0.1-0.3 W from VCCIO, depending on toggle rate.
The 324-ball FBGA package has a junction-to-ambient thermal resistance (θJA) in the 25-35 °C/W range when mounted on a JEDEC 4-layer test board with adequate thermal vias. For continuous operation near 250 MHz with high toggle rates, place a thermal-via array directly under the package center pad and stitch copper pours on inner layers. Estimated: at 1.0 W total dissipation and 30 °C/W θJA, junction temperature rises 30 °C above ambient, so an 85 °C commercial-grade device hits its junction limit at 55 °C ambient without thermal management.
Route the 324-ball FBGA (1.27 mm pitch, 19x19 mm body) on a PCB stack-up that supports microvias or via-in-pad to escape inner balls. Use 0.10 mm (4 mil) trace width with 0.10 mm spacing on the top layer for escape routing, and place a 6x6 thermal-via array under the central ground balls. Keep all VCCINT and VCCIO decoupling capacitors within 5 mm of their respective balls, with a 0.1 µF / 1 µF / 10 µF value stack to cover high-frequency and bulk current transients.
Informations de conformité
RoHS, REACH, lead-free and halogen-free status for the EP20K100EFC324-2X were not in the provided verified web data; confirm with the lot-specific manufacturer documentation before shipping into regulated markets. AEC-Q100 does not apply because this is a commercial-grade FPGA, not an automotive-qualified part.
