EP20K100EFC324-2X - APEX 20KE 100K Gates FPGA | Intel / Altera
MPN: EP20K100EFC324-2X ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $162 | $1,620.00 |
| 100 | $138 | $13,800.00 |
| 500 | $118 | $59,000.00 |
| 1,000 | $99.5 | $99,500.00 |
Drop-in alternatives for EP20K100EFC324-2X — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP20K100EFC324-2
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K200EFC324-2X
✅ Drop-In📋 Reference alternative (not in catalog)
EP20K100EFC324-1N
✅ Drop-In✓ In Stock
$108 / Unit
View Datasheet →EP20K100EFC324-2X Maximum Ratings & Electrical Characteristics
| Family | APEX 20KE |
| Device Type | SPLD / FPGA (Field Programmable Gate Array) |
| System Gates | 100,000 gates |
| Logic Elements / Cells | 4,160 |
| Total RAM Bits | 53,248 bits |
| LABs / CLBs | 416 |
| Maximum User I/Os | 246 |
| Number of I/O Banks | 8 (per APEX 20KE family) |
| Propagation Delay | 1.6 ns |
| Internal Operating Frequency | Up to 250 MHz |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | MultiVolt: 1.8 V / 2.5 V / 3.3 V |
| Process Technology | 0.22 µm CMOS (all-layer copper metal) |
| Speed Grade | -2X |
| Package | 324-ball FBGA (FineLine BGA), 19x19 mm, 1.27 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | 0 °C to 85 °C (Commercial) |
| Programming Interface | IEEE 1149.1 JTAG |
| Configuration Modes | Passive Serial, Passive Parallel, JTAG, Altera configuration EPROM |
EP20K100EFC324-2X 324-ball fbga (fineline bga), 19x19 mm, 1.27 mm pitch Pin Configuration Guide
Complete pinout information for EP20K100EFC324-2X (324-ball fbga (fineline bga), 19x19 mm, 1.27 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP20K100EFC324-2X.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP20K100EFC324-2X is suitable for 6 applications: Telecommunications Line-Card Glue Logic, Industrial Control and Factory Automation Controllers, ASIC Prototyping and Validation, Custom Bus Bridges and Protocol Converters, DSP Coprocessor Front-End, Legacy PCI Interface Card Designs.
Telecommunications Line-Card Glue Logic
The EP20K100EFC324-2X fits telecom line-card glue logic because its 100K system gates, 4,160 logic cells and 246 user I/Os are enough to bridge legacy TDM buses, framing devices and network processors without a co-processor. The MultiVolt I/O (1.8/2.5/3.3 V on VCCIO banks) lets the device talk directly to 3.3 V PHY chips while running its core at 1.8 V, which simplifies mixed-voltage board design. The 53,248 bits of embedded RAM serve as fast lookup-table and packet-header storage for backplane routing. Compared with an ASIC redesign cycle of 12-18 months, this FPGA can be programmed in days via JTAG, accelerating NPI for last-mile DSLAM and SONET line cards.
Recommended
Industrial Control and Factory Automation Controllers
For industrial PLC and motion-control cards, the EP20K100EFC324-2X delivers deterministic logic through its 4-input LUT-based fabric and dedicated carry chains, which give predictable timing for encoder quadrature decoding and PWM generation. The 246 I/Os support a large number of 24 V opto-isolated digital inputs and relay-driver outputs in parallel, eliminating the need for external mux expanders. Operating from a 1.8 V core, the device dissipates roughly 0.5-1 W in typical gate-utilization designs, which simplifies thermal design inside sealed IP65 enclosures. Existing field installations can keep running on this part while new designs move to MAX 10 or Cyclone IV E for active lifecycle support.
Recommended
ASIC Prototyping and Validation
The EP20K100EFC324-2X is widely used as an ASIC prototype vehicle because its 100K gates and 246 I/Os are large enough to map an entire mid-complexity ASIC RTL netlist. Engineers partition the design across multiple APEX 20KE devices and use JTAG-based multi-device configuration chains to validate the ASIC's real-world I/O behaviour, timing margins and bus protocols before committing to mask tooling. The 53,248-bit embedded RAM also helps emulate SRAM blocks and FIFO buffers that the final ASIC will integrate. Quartus II synthesis flow matches typical ASIC synthesis, so timing closure on the FPGA is a good predictor of post-layout ASIC timing.
Recommended
Custom Bus Bridges and Protocol Converters
When a designer needs to bridge PCI, VME, ISA or proprietary backplane buses to a modern processor, the EP20K100EFC324-2X's 246 user I/Os and MultiVolt I/O make it an ideal bus-translation engine. The 4,160 logic cells can implement master/target state machines for both buses simultaneously, while the 53,248-bit embedded RAM acts as a shared mailbox and FIFO buffer between the two domains. Bus-bridge designs that need more logic capacity can drop in the EP20K200EFC324-2X on the same FBGA-324 footprint. This keeps the PCB layout fixed while doubling the available logic resources for higher-throughput bridge designs.
Recommended
DSP Coprocessor Front-End
The EP20K100EFC324-2X serves as a DSP front-end that pre-processes data streams before handing them to a host DSP or microprocessor. Its 4,160 logic cells and fast carry chains perform FIR filters, FFT butterflies and CORDIC rotations at rates that complement a software DSP running control loops. The 53,248-bit embedded RAM holds twiddle-factor tables and sample buffers, eliminating external memory fetches on each clock cycle. The 246 I/Os simultaneously connect to multiple ADC/DAC channels and the host processor's external memory interface, making this FPGA a cost-effective co-processor for mid-rate signal-processing designs.
Recommended
Legacy PCI Interface Card Designs
The EP20K100EFC324-2X is a natural fit for legacy 32-bit/33 MHz PCI interface cards because its 246 user I/Os and MultiVolt 3.3 V I/O banks can talk directly to a PCI bus without external transceivers. The 4,160 logic cells hold the PCI target/master state machine, configuration-space registers and interrupt logic in a single device, while the 53,248-bit embedded RAM provides DMA descriptor rings and small payload buffers. Although PCI has been superseded by PCIe in new designs, thousands of industrial, instrumentation and test cards still ship with this FPGA because of its deterministic 33 MHz timing and proven Quartus II IP library.
Recommended
Recommended Products Summary
Engineering reference data for EP20K100EFC324-2X — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP20K100EFC324-2 | EP20K200EFC324-2X | EP20K100EFC324-1N |
|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 324-ball FBGA (19x19 mm) | 324-ball FBGA (19x19 mm) - same | 324-ball FBGA (19x19 mm) - same | 324-ball FBGA (19x19 mm) - same |
| System Gates | 100K | 100K | 200K | 100K |
| Logic Cells / Elements | 4,160 | 4,160 | 8,320 | 4,160 |
| Maximum User I/Os | 246 | 246 | 246 | 246 |
| Embedded RAM Bits | 53,248 | 53,248 | 106,496 | 53,248 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Speed Grade | -2X (fastest) | -2 (slower) | -2X | -1N (industrial temp) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest speed grade in the APEX 20KE 100K-gate family (vs EP20K100EFC324-2)
- Highest logic density in the same FBGA-324 footprint (vs EP20K100EFC324-1N)
- Lower-density, lower-cost option on the same FBGA-324 footprint (vs EP20K200EFC324-2X)
Design Notes
The APEX 20KE family uses 1.8 V VCCINT but its I/O banks support 1.8 V / 2.5 V / 3.3 V on VCCIO - mixing the wrong bank voltage is a common bring-up failure. Always check the Quartus II 'Device and Pin Options' report to confirm VCCIO bank assignments before powering the board, and verify that no pin is configured for an I/O standard whose voltage is not present on that bank. Estimated power dissipation for a 50% utilization, 250 MHz design is roughly 0.8 W from VCCINT and another 0.1-0.3 W from VCCIO, depending on toggle rate.
The 324-ball FBGA package has a junction-to-ambient thermal resistance (θJA) in the 25-35 °C/W range when mounted on a JEDEC 4-layer test board with adequate thermal vias. For continuous operation near 250 MHz with high toggle rates, place a thermal-via array directly under the package center pad and stitch copper pours on inner layers. Estimated: at 1.0 W total dissipation and 30 °C/W θJA, junction temperature rises 30 °C above ambient, so an 85 °C commercial-grade device hits its junction limit at 55 °C ambient without thermal management.
Route the 324-ball FBGA (1.27 mm pitch, 19x19 mm body) on a PCB stack-up that supports microvias or via-in-pad to escape inner balls. Use 0.10 mm (4 mil) trace width with 0.10 mm spacing on the top layer for escape routing, and place a 6x6 thermal-via array under the central ground balls. Keep all VCCINT and VCCIO decoupling capacitors within 5 mm of their respective balls, with a 0.1 µF / 1 µF / 10 µF value stack to cover high-frequency and bulk current transients.
Compliance Information
RoHS, REACH, lead-free and halogen-free status for the EP20K100EFC324-2X were not in the provided verified web data; confirm with the lot-specific manufacturer documentation before shipping into regulated markets. AEC-Q100 does not apply because this is a commercial-grade FPGA, not an automotive-qualified part.
