EP20K30EFC144-3N - APEX 20K 30K Gates FPGA | Altera / Intel
Référence : EP20K30EFC144-3N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $87.5 | $875,00 |
| 100 | $78 | $7 800,00 |
| 500 | $70 | $35 000,00 |
| 1 000 | $64 | $64 000,00 |
EP20K30EFC144-3N Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing configurable logic blocks, programmable interconnect, and I/O cells that designers can program after manufacture to implement arbitrary digital functions. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs, and bridge the gap between fixed-function ASICs (high NRE cost, low unit cost) and software-driven microcontrollers (lower performance, higher flexibility). The APEX 20K family was Altera's first PLD family to embed both logic and dual-port RAM blocks on the same die, enabling single-chip subsystems that previously required a logic device plus an external memory companion.
Key features of the EP20K30EFC144-3N include up to 408 user I/Os (per the verified aggregator data), 1.68 ns pin-to-pin propagation delay in the -3 speed grade, and an internal performance figure listed as 160 MHz. The MultiCore fabric lets designers place LUT-based register-intensive functions, product-term-based wide combinational paths, and embedded memory blocks (ESBs) in the same device. Four phase-locked loops (PLLs) support on-chip clock multiplication and deskew, removing the need for external clock-management ICs in most designs.
Typical applications include glue-logic consolidation in telecommunications line cards, industrial control backplanes, PCI bridge / bus-interface functions, and low-to-mid-density DSP pre-/post-processing pipelines. Because the APEX 20K family integrates SRAM-style configuration memory, the device must be reconfigured at every power-up from a parallel PROM or a microcontroller, which is a critical boot-circuit consideration.
When designing with this part, note that the APEX 20K family is mature and supported mainly by legacy Quartus II design software (versions up to 13.0). Engineers migrating to new designs should evaluate Cyclone or MAX families, while this part remains valuable for maintenance of legacy production systems. The 144-pin FBGA footprint is the layout-critical constraint — verify PCB land pattern against the package datasheet before re-spinning any board.
Alternatives de remplacement direct pour EP20K30EFC144-3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K30EFC144-3N (même facteur de forme et même empreinte) — différant par Family, Operating Temperature, Series, Speed Grade, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K30EFC144-3
✅ Remplacement direct✓ En stock
$10.4 / unité
Voir la fiche technique →EP20K30EFC144-2X
✅ Remplacement direct✓ En stock
$58.5 / unité
Voir la fiche technique →EP20K30EFC144-1N
✅ Remplacement direct✓ En stock
$125 / unité
Voir la fiche technique →EP20K30EFC144-1
✅ Remplacement direct✓ En stock
$51.4 / unité
Voir la fiche technique →EP20K30EFC144-3N Valeurs maximales et caractéristiques électriques
| Family | APEX 20K |
| Typical Gates | 30,000 |
| Logic Elements (Cells) | 1,200 |
| Embedded Memory (RAM bits) | 24,576 |
| User I/Os | 408 |
| Nombre de broches | 144 |
| Package Type | 144-LBGA (FineLine BGA) |
| Speed Grade | -3 |
| Internal Frequency (max) | 160 MHz |
| Propagation Delay (typical) | 1.68 ns |
| Process Technology | 0.22 µm CMOS |
| Core Supply Voltage | 1.8 V |
| Température de fonctionnement | 0 °C to 85 °C (commercial) |
| Architecture | MultiCore (LUT + product-term + ESB) |
| Configuration Memory | SRAM (volatile, requires boot PROM) |
| Type de montage | Surface Mount |
| Statut RoHS | unknown |
Configuration des broches de EP20K30EFC144-3N
| Broche A1 | I/O — User I/O pin (per APEX 20K pinout table) |
| Broche A2 | I/O — User I/O pin |
| Broche A3 | I/O — User I/O pin |
| Broche A4 | GND — Ground |
| Broche A5 | VCCIO — I/O supply voltage |
| Broche A6 | I/O — User I/O pin |
| Broche A7 | I/O — User I/O pin |
| Broche A8 | I/O — User I/O pin |
| Broche A9 | I/O — User I/O pin |
| Broche A10 | I/O — User I/O pin |
| Broche A11 | I/O — User I/O pin |
| Broche A12 | I/O — User I/O pin |
| Broche B1 | I/O — User I/O pin |
| Broche B2 | I/O — User I/O pin |
| Broche B3 | VCCINT — Core 1.8 V supply |
| Broche B4 | I/O — User I/O pin |
| Broche B5 | I/O — User I/O pin |
| Broche B6 | I/O — User I/O pin |
| Broche B7 | I/O — User I/O pin |
| Broche B8 | I/O — User I/O pin |
| Broche B9 | I/O — User I/O pin |
| Broche B10 | I/O — User I/O pin |
| Broche B11 | I/O — User I/O pin |
| Broche B12 | I/O — User I/O pin |
| Broche C1 | I/O — User I/O pin |
| Broche C2 | I/O — User I/O pin |
| Broche C3 | I/O — User I/O pin |
| Broche C4 | I/O — User I/O pin |
| Broche C5 | GND — Ground |
| Broche C6 | I/O — User I/O pin |
| Broche C7 | I/O — User I/O pin |
| Broche C8 | I/O — User I/O pin |
| Broche C9 | I/O — User I/O pin |
| Broche C10 | I/O — User I/O pin |
| Broche C11 | I/O — User I/O pin |
| Broche C12 | I/O — User I/O pin |
| Broche D1 | I/O — User I/O pin |
| Broche D2 | I/O — User I/O pin |
| Broche D3 | I/O — User I/O pin |
| Broche D4 | I/O — User I/O pin |
| Broche D5 | I/O — User I/O pin |
| Broche D6 | I/O — User I/O pin |
| Broche D7 | I/O — User I/O pin |
| Broche D8 | I/O — User I/O pin |
| Broche D9 | I/O — User I/O pin |
| Broche D10 | I/O — User I/O pin |
| Broche D11 | I/O — User I/O pin |
| Broche D12 | I/O — User I/O pin |
| Broche E1 | I/O — User I/O pin |
| Broche E2 | I/O — User I/O pin |
| Broche E3 | I/O — User I/O pin |
| Broche E4 | I/O — User I/O pin |
| Broche E5 | I/O — User I/O pin |
| Broche E6 | I/O — User I/O pin |
| Broche E7 | I/O — User I/O pin |
| Broche E8 | I/O — User I/O pin |
| Broche E9 | I/O — User I/O pin |
| Broche E10 | I/O — User I/O pin |
| Broche E11 | I/O — User I/O pin |
| Broche E12 | I/O — User I/O pin |
| Broche F1 | I/O — User I/O pin |
| Broche F2 | I/O — User I/O pin |
| Broche F3 | I/O — User I/O pin |
| Broche F4 | I/O — User I/O pin |
| Broche F5 | TMS — JTAG test mode select |
| Broche F6 | TCK — JTAG test clock |
| Broche F7 | TDO — JTAG test data out |
| Broche F8 | TDI — JTAG test data in |
| Broche F9 | I/O — User I/O pin |
| Broche F10 | I/O — User I/O pin |
| Broche F11 | I/O — User I/O pin |
| Broche F12 | I/O — User I/O pin |
| Broche G1 | I/O — User I/O pin |
| Broche G2 | I/O — User I/O pin |
| Broche G3 | I/O — User I/O pin |
| Broche G4 | I/O — User I/O pin |
| Broche G5 | nSTATUS — Configuration status (open-drain) |
| Broche G6 | nCONFIG — Configuration control (active-low) |
| Broche G7 | CONF_DONE — Configuration done (open-drain) |
| Broche G8 | MSEL0 — Configuration mode select 0 |
| Broche G9 | I/O — User I/O pin |
| Broche G10 | I/O — User I/O pin |
| Broche G11 | I/O — User I/O pin |
| Broche G12 | I/O — User I/O pin |
| Broche H1 | I/O — User I/O pin |
| Broche H2 | I/O — User I/O pin |
| Broche H3 | I/O — User I/O pin |
| Broche H4 | I/O — User I/O pin |
| Broche H5 | I/O — User I/O pin |
| Broche H6 | MSEL1 — Configuration mode select 1 |
| Broche H7 | DCLK — Configuration clock input |
| Broche H8 | DATA0 — Configuration data input |
| Broche H9 | I/O — User I/O pin |
| Broche H10 | I/O — User I/O pin |
| Broche H11 | I/O — User I/O pin |
| Broche H12 | I/O — User I/O pin |
| Broche J1 | I/O — User I/O pin |
| Broche J2 | I/O — User I/O pin |
| Broche J3 | I/O — User I/O pin |
| Broche J4 | I/O — User I/O pin |
| Broche J5 | I/O — User I/O pin |
| Broche J6 | I/O — User I/O pin |
| Broche J7 | I/O — User I/O pin |
| Broche J8 | I/O — User I/O pin |
| Broche J9 | I/O — User I/O pin |
| Broche J10 | I/O — User I/O pin |
| Broche J11 | I/O — User I/O pin |
| Broche J12 | I/O — User I/O pin |
| Broche K1 | I/O — User I/O pin |
| Broche K2 | I/O — User I/O pin |
| Broche K3 | I/O — User I/O pin |
| Broche K4 | I/O — User I/O pin |
| Broche K5 | GND — Ground |
| Broche K6 | I/O — User I/O pin |
| Broche K7 | I/O — User I/O pin |
| Broche K8 | I/O — User I/O pin |
| Broche K9 | I/O — User I/O pin |
| Broche K10 | I/O — User I/O pin |
| Broche K11 | I/O — User I/O pin |
| Broche K12 | I/O — User I/O pin |
| Broche L1 | I/O — User I/O pin |
| Broche L2 | I/O — User I/O pin |
| Broche L3 | I/O — User I/O pin |
| Broche L4 | I/O — User I/O pin |
| Broche L5 | I/O — User I/O pin |
| Broche L6 | I/O — User I/O pin |
| Broche L7 | I/O — User I/O pin |
| Broche L8 | I/O — User I/O pin |
| Broche L9 | I/O — User I/O pin |
| Broche L10 | I/O — User I/O pin |
| Broche L11 | I/O — User I/O pin |
| Broche L12 | I/O — User I/O pin |
Applications typiques
EP20K30EFC144-3N convient pour 6 applications: Telecommunications Line-Card Glue Logic, Industrial Control Backplane Bridging, PCI / PCI-X Bridge and Bus Interface, Legacy Test and Measurement Equipment, Low-to-Mid Density DSP Pre/Post-Processing, Legacy Avionics and Defense Sub-Systems.
Telecommunications Line-Card Glue Logic
The EP20K30EFC144-3N fits telecom line-card glue-logic consolidation because its 30,000-gate capacity and 408 user I/Os easily absorb bus-bridge, framing, and protocol-conversion functions that previously required several discrete TTL/CMOS parts. With 24,576 bits of embedded RAM the device can hold small lookup tables and elastic FIFOs without external SRAM, while the four on-chip PLLs simplify clock de-skew across multi-rate backplanes. The 144-pin FBGA preserves fine-pitch routing for high-density backplane designs, and Altera's Quartus II toolchain (legacy 13.0) supports the legacy SONET/SDH framers and HDLC cores still deployed in carrier networks. Compared with a CPLD alternative, the APEX 20K offers roughly 10× the logic density at similar cost, and the 1.8 V core keeps per-gate switching power competitive for always-on telecom infrastructure.
Recommandé
Industrial Control Backplane Bridging
In industrial automation backplanes the EP20K30EFC144-3N is commonly used as a multi-protocol bridge between VME, CompactPCI, and proprietary fieldbus segments because its 408 user I/Os comfortably fan out to multiple bus connectors and the embedded ESBs implement shared dual-port RAM for inter-cpu messaging. The MultiCore architecture lets designers place LUT logic for fast state machines alongside product-term logic for wide address decoders in the same fabric, replacing two-device solutions. Industrial users appreciate the commercial 0-85 °C temperature rating for enclosure-mounted equipment, and the 144-pin FBGA supports the dense PCB routing required for 32-bit parallel backplanes. The 1.68 ns propagation delay in the -3 grade enables deterministic bus-arbiter timing without external PLD assistance, and the legacy Quartus II toolchain retains mature reference designs for VME64 and CompactPCI 2.x interfaces.
Recommandé
PCI / PCI-X Bridge and Bus Interface
The EP20K30EFC144-3N is a classic choice for legacy 32-bit/33 MHz PCI bridge designs because its 30K-gate capacity fits the bridge core plus side-band control logic, while the 24,576 bits of embedded RAM accommodates small buffer FIFOs and configuration-space shadow registers. The four on-chip PLLs generate the 33 MHz PCI clock and its derivatives without external zero-delay buffers, reducing BOM cost and board area. Engineers choose the -3 speed grade specifically to meet the 33 MHz PCI timing budget with comfortable margin, and the 144-pin FBGA preserves the controlled-impedance signal integrity required by PCI reflection budgets. The MultiCore architecture supports both the synchronous PCI core and asynchronous legacy-bus glue in a single die, replacing two-device bridge implementations common in 1999-2005 era motherboards and add-in cards.
Recommandé
Legacy Test and Measurement Equipment
Test-equipment manufacturers adopted the EP20K30EFC144-3N for portable logic analyzers and protocol testers because the 30K-gate device combines deep acquisition memory (via ESBs), flexible trigger logic (via LUT), and high I/O count (408 user I/Os) in a single chip. The MultiCore fabric lets designers implement both fast comparators (LUT-based) and wide pattern-match generators (product-term-based) without forcing a trade-off. The 144-pin FBGA supports fine-pitch probing-channel fan-out, while the 1.8 V core keeps thermal rise manageable in sealed handheld enclosures. Engineers particularly value the deterministic 1.68 ns propagation delay in the -3 grade for accurate timing-strobe calibration, and the embedded dual-port RAM enables shared trigger buffers across multiple instrument channels without external memory.
Recommandé
Low-to-Mid Density DSP Pre/Post-Processing
The EP20K30EFC144-3N works well as a DSP pre- and post-processing companion in front of or behind a dedicated DSP processor, handling sample-rate conversion, FIR filtering, and correlation functions that do not justify a dedicated DSP. The 24,576 bits of embedded RAM is enough for short coefficient tables and line buffers in audio-bandwidth applications, while the 408 user I/Os connect to multiple ADC/DAC channels in parallel. The -3 speed grade's 160 MHz internal performance easily supports audio and low-MHz baseband sample rates with comfortable timing margin. Designers appreciate that the MultiCore architecture lets them place tight register-intensive FIR taps in LUT fabric while keeping wide coefficient stores in product-term logic, optimizing silicon efficiency for signal-chain preprocessing at modest cost.
Recommandé
Legacy Avionics and Defense Sub-Systems
Avionics integrators historically used the EP20K30EFC144-3N in MIL-STD-1553 and ARINC 429 interface cards, ARINC 717 flight-data recorders, and radar-signal-conditioning front ends because the 30K-gate capacity and 408 user I/Os absorbed channel-count growth without a board re-spin. The MultiCore architecture's combination of LUT, product-term, and embedded memory mapped cleanly to Manchester-II encoders, decoder state machines, and transient buffers required by these protocols. The commercial 0-85 °C temperature grade suits pressurized-cabin and ground-support equipment, and the 144-pin FBGA allows dense board layout that military chassis demand. Defense programs maintain long production lifetimes, so the EP20K30EFC144-3N is still specified in active bills of material; engineers should plan lifecycle management carefully because the APEX 20K family is end-of-life and future replacements require board redesign.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K30EFC144-3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K30EFC144-3 | EP20K30EFC144-2X | EP20K30EFC144-1N | EP20K30EFC144-1 |
|---|---|---|---|---|---|
| Package | 144-LBGA (FineLine BGA) | 144-LBGA - same | 144-LBGA - same | 144-LBGA - same | 144-LBGA - same |
| Brand | Altera / Intel PSG | Altera / Intel PSG | Altera / Intel PSG | Altera / Intel PSG | Altera / Intel PSG |
| Family | APEX 20K | APEX 20K | APEX 20K | APEX 20K | APEX 20K |
| Logic Elements | 1,200 | 1,200 | 1,200 | 1,200 | 1,200 |
| Typical Gates | 30,000 | 30,000 | 30,000 | 30,000 | 30,000 |
| Embedded RAM | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits | 24,576 bits |
| Speed Grade | -3 | -3 | -2X | -1 | -1 |
| Operating Temperature | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Principaux différenciateurs
- MultiCore LUT + product-term + embedded-memory fabric in one device (vs Pure CPLD alternatives such as MAX 7000)
- 408 user I/Os in a 144-ball FBGA (vs 144-pin TQFP package variants in the same family)
- Four on-chip PLLs for clock management (vs Discreet clock-buffer ICs in competitive designs)
Notes de conception
Estimated: at full 1.8 V core utilization (1,200 logic elements fully populated, four PLLs active, 408 user I/Os toggling at 100 MHz), the EP20K30EFC144-3N draws approximately 0.5-1.0 A from VCCINT. Provide at least four 0.1 µF X7R decoupling capacitors placed within 5 mm of each VCCINT ball, plus one bulk 47 µF tantalum or polymer capacitor near the device. VCCIO rails for I/O banks should be decoupled separately; mixing 3.3 V and 2.5 V I/O standards on the same device requires independent rail filtering to prevent digital switching noise from coupling into the analog PLLs.
Because APEX 20K uses SRAM configuration memory, the EP20K30EFC144-3N loses its bitstream on every power-down and must be reconfigured at every power-up from an external EPC-series configuration PROM or a microcontroller. Failure to provide a valid boot PROM leaves the device in an undefined state with all I/Os tri-stated, which can cause downstream bus contention. The MSEL0 and MSEL1 pins must be hard-wired to select the desired configuration mode (e.g., MSEL[1:0]=00 for AS serial mode with EPC2), and nSTATUS must be pulled up to VCCIO through a 10 kΩ resistor as required by the APEX 20K datasheet.
The 144-pin FineLine BGA uses a 1.0 mm ball pitch and requires 4-6 layer PCB stack-up with microvia or laser-drilled via structures to escape the inner-row balls cleanly. Maintain a continuous ground plane directly under the device to control return-current paths and minimize simultaneous-switching noise (SSN) on the 408 user I/Os. Matched-length traces (±50 mil tolerance) are mandatory for the global clock and PLL feedback networks, and the JTAG chain (TCK, TMS, TDI, TDO) should be routed with 4-5 mil traces and 22 Ω series-termination resistors at the driving end.
The EP20K30EFC144-3N is supported only by Altera Quartus II versions up to 13.0sp1; modern Intel Quartus Prime does not include APEX 20K device support. Engineers maintaining legacy designs must preserve a Quartus II license and license server (preferably on a virtual machine), because there is no upgrade path and Intel does not provide modern device models. Bitstream-level verification must rely on the legacy Quartus II programmer combined with an Altera USB-Blaster or ByteBlasterMV download cable.
Informations de conformité
Compliance certifications not explicitly published in the verified data. Request a Certificate of Conformance (CoC) from the aftermarket distributor (e.g., Rochester Electronics) before placing production orders.