EP20K30EFI144-2X - APEX 20KE FPGA 1200 Cells 93 I/O 144-BGA | Intel
Référence : EP20K30EFI144-2X ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $45 | $45,00 |
| 10 | $38.5 | $385,00 |
| 100 | $32.75 | $3 275,00 |
| 500 | $27.5 | $13 750,00 |
| 1 000 | $22.95 | $22 950,00 |
EP20K30EFI144-2X Présentation
What is an APEX 20KE FPGA? The APEX (Advanced Programmable Element Matrix) 20KE family is a multi-vendor-compatible programmable logic architecture combining look-up table (LUT)-based logic elements with embedded system blocks (ESBs) that double as RAM, ROM, or product-term logic. In the broader taxonomy, an FPGA is a programmable logic device (PLD) within the semiconductor integrated circuit family, sitting between ASICs and discrete logic in flexibility and density. APEX 20KE parts were widely deployed in telecom, networking, and DSP applications in the late 1990s and early 2000s.
Key features of the EP20K30EFI144-2X include 1200 logic elements, 192 macrocells, 24576 embedded RAM bits, 93 maximum user I/O, and 1.8 V core operation. The device supports in-system programmability via IEEE 1149.1 JTAG, multi-vendor I/O standards (LVTTL, LVCMOS, PCI, GTL+, SSTL, HSTL), and dedicated clock and PLL resources. The 144-ball FineLine BGA package provides a compact footprint while preserving sufficient I/O count for typical glue-logic and DSP datapath designs.
Architecturally, the APEX 20KE combines a MegaLAB structure with embedded system blocks, allowing designers to trade logic density against memory width. The LUT-based logic elements support cascade chains for wide datapaths, while the ESBs can be configured as dual-port RAM or FIFO buffers. Hardware multipliers are not present in the 20KE family, so DSP functions are typically implemented using LUT-based multiplication or external co-processors.
Typical applications for the EP20K30EFI144-2X include telecom interface cards, protocol bridging logic, low-density DSP preprocessing, industrial control state machines, and PCI bus interface glue logic. The industrial temperature grade makes it suitable for factory automation and outdoor telecom equipment. Note that the APEX 20KE family is end-of-life; modern Cyclone IV/V or Lattice ECP5 devices are recommended for new designs.
When designing with this part, plan the I/O bank VCCIO assignments carefully because mixed-voltage standards require multiple supply rails. The Quartus II design tool (legacy versions supporting APEX 20KE) is required for bitstream generation. JTAG programming via a ByteBlaster or USB-Blaster download cable is the standard configuration path.
Alternatives de remplacement direct pour EP20K30EFI144-2X — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K30EFI144-2X (même facteur de forme et même empreinte) — différant par Speed Grade, Family, Operating Temperature, Series, Typical Gates.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K30EFC144-2X
✅ Remplacement direct✓ En stock
$58.5 / unité
Voir la fiche technique →EP20K30EFC144-1
✅ Remplacement direct✓ En stock
$51.4 / unité
Voir la fiche technique →EP20K30EFI144-2XN
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP20K30EFC144-3
✅ Remplacement direct✓ En stock
$10.4 / unité
Voir la fiche technique →EP20K30EFC144-1N
✅ Remplacement direct✓ En stock
$125 / unité
Voir la fiche technique →EP20K30EFC144-3N
✅ Remplacement direct✓ En stock
$64 / unité
Voir la fiche technique →EP20K30EFI144-2X Valeurs maximales et caractéristiques électriques
| Series | APEX 20KE |
| Family | APEX 20KE Field Programmable Gate Array |
| Logic Elements / Cells | 1200 |
| Macrocells | 192 |
| Embedded RAM Bits | 24576 |
| Number of I/O | 93 |
| Maximum User I/O | 93 |
| Boîtier | 144-BGA (FineLine BGA) |
| Nombre de broches | 144 |
| Core Voltage | 1.8 V |
| Process Technology | 0.22 µm CMOS |
| Operating Temperature Grade | Industrial (E suffix) |
| Speed Grade | -2 |
| Type de montage | Surface Mount |
Configuration des broches de EP20K30EFI144-2X
| Broche A1 | I/O — User I/O pin (bank 1) |
| Broche A2 | I/O — User I/O pin (bank 1) |
| Broche A3 | I/O — User I/O pin (bank 1) |
| Broche A4 | VCCIO1 — I/O bank 1 supply voltage |
| Broche A5 | I/O — User I/O pin (bank 1) |
| Broche A6 | I/O — User I/O pin (bank 1) |
| Broche A7 | I/O — User I/O pin (bank 1) |
| Broche A8 | GND — Ground |
| Broche A9 | I/O — User I/O pin (bank 2) |
| Broche A10 | I/O — User I/O pin (bank 2) |
| Broche A11 | I/O — User I/O pin (bank 2) |
| Broche A12 | VCCIO2 — I/O bank 2 supply voltage |
| Broche B1 | I/O — User I/O pin (bank 1) |
| Broche B2 | GND — Ground |
| Broche B3 | I/O — User I/O pin (bank 1) |
| Broche B4 | I/O — User I/O pin (bank 1) |
| Broche B5 | I/O — User I/O pin (bank 1) |
| Broche B6 | GND — Ground |
| Broche B7 | I/O — User I/O pin (bank 1) |
| Broche B8 | I/O — User I/O pin (bank 1) |
| Broche B9 | VCCIO2 — I/O bank 2 supply voltage |
| Broche B10 | I/O — User I/O pin (bank 2) |
| Broche B11 | I/O — User I/O pin (bank 2) |
| Broche B12 | I/O — User I/O pin (bank 2) |
| Broche C1 | I/O — User I/O pin (bank 1) |
| Broche C2 | I/O — User I/O pin (bank 1) |
| Broche C3 | VCCINT — Core supply voltage (1.8 V) |
| Broche C4 | I/O — User I/O pin (bank 1) |
| Broche C5 | GND — Ground |
| Broche C6 | I/O — User I/O pin (bank 1) |
| Broche C7 | I/O — User I/O pin (bank 1) |
| Broche C8 | VCCINT — Core supply voltage (1.8 V) |
| Broche C9 | I/O — User I/O pin (bank 2) |
| Broche C10 | GND — Ground |
| Broche C11 | I/O — User I/O pin (bank 2) |
| Broche C12 | I/O — User I/O pin (bank 2) |
| Broche D1 | I/O — User I/O pin (bank 3) |
| Broche D2 | I/O — User I/O pin (bank 3) |
| Broche D3 | I/O — User I/O pin (bank 3) |
| Broche D4 | VCCIO3 — I/O bank 3 supply voltage |
| Broche D5 | I/O — User I/O pin (bank 3) |
| Broche D6 | I/O — User I/O pin (bank 3) |
| Broche D7 | I/O — User I/O pin (bank 3) |
| Broche D8 | GND — Ground |
| Broche D9 | I/O — User I/O pin (bank 4) |
| Broche D10 | I/O — User I/O pin (bank 4) |
| Broche D11 | I/O — User I/O pin (bank 4) |
| Broche D12 | VCCIO4 — I/O bank 4 supply voltage |
| Broche E1 | I/O — User I/O pin (bank 3) |
| Broche E2 | GND — Ground |
| Broche E3 | I/O — User I/O pin (bank 3) |
| Broche E4 | I/O — User I/O pin (bank 3) |
| Broche E5 | I/O — User I/O pin (bank 3) |
| Broche E6 | GND — Ground |
| Broche E7 | I/O — User I/O pin (bank 3) |
| Broche E8 | I/O — User I/O pin (bank 3) |
| Broche E9 | VCCIO4 — I/O bank 4 supply voltage |
| Broche E10 | I/O — User I/O pin (bank 4) |
| Broche E11 | I/O — User I/O pin (bank 4) |
| Broche E12 | I/O — User I/O pin (bank 4) |
| Broche F1 | I/O — User I/O pin (bank 3) |
| Broche F2 | I/O — User I/O pin (bank 3) |
| Broche F3 | VCCINT — Core supply voltage (1.8 V) |
| Broche F4 | I/O — User I/O pin (bank 3) |
| Broche F5 | GND — Ground |
| Broche F6 | I/O — User I/O pin (bank 3) |
| Broche F7 | I/O — User I/O pin (bank 3) |
| Broche F8 | VCCINT — Core supply voltage (1.8 V) |
| Broche F9 | I/O — User I/O pin (bank 4) |
| Broche F10 | GND — Ground |
| Broche F11 | I/O — User I/O pin (bank 4) |
| Broche F12 | I/O — User I/O pin (bank 4) |
| Broche G1 | I/O — User I/O pin (bank 5) |
| Broche G2 | I/O — User I/O pin (bank 5) |
| Broche G3 | I/O — User I/O pin (bank 5) |
| Broche G4 | VCCIO5 — I/O bank 5 supply voltage |
| Broche G5 | I/O — User I/O pin (bank 5) |
| Broche G6 | I/O — User I/O pin (bank 5) |
| Broche G7 | I/O — User I/O pin (bank 5) |
| Broche G8 | GND — Ground |
| Broche G9 | I/O — User I/O pin (bank 6) |
| Broche G10 | I/O — User I/O pin (bank 6) |
| Broche G11 | I/O — User I/O pin (bank 6) |
| Broche G12 | VCCIO6 — I/O bank 6 supply voltage |
| Broche H1 | I/O — User I/O pin (bank 5) |
| Broche H2 | GND — Ground |
| Broche H3 | I/O — User I/O pin (bank 5) |
| Broche H4 | I/O — User I/O pin (bank 5) |
| Broche H5 | I/O — User I/O pin (bank 5) |
| Broche H6 | GND — Ground |
| Broche H7 | I/O — User I/O pin (bank 5) |
| Broche H8 | I/O — User I/O pin (bank 5) |
| Broche H9 | VCCIO6 — I/O bank 6 supply voltage |
| Broche H10 | I/O — User I/O pin (bank 6) |
| Broche H11 | I/O — User I/O pin (bank 6) |
| Broche H12 | I/O — User I/O pin (bank 6) |
| Broche J1 | I/O — User I/O pin (bank 7) |
| Broche J2 | I/O — User I/O pin (bank 7) |
| Broche J3 | VCCINT — Core supply voltage (1.8 V) |
| Broche J4 | I/O — User I/O pin (bank 7) |
| Broche J5 | GND — Ground |
| Broche J6 | I/O — User I/O pin (bank 7) |
| Broche J7 | I/O — User I/O pin (bank 7) |
| Broche J8 | VCCINT — Core supply voltage (1.8 V) |
| Broche J9 | I/O — User I/O pin (bank 8) |
| Broche J10 | GND — Ground |
| Broche J11 | I/O — User I/O pin (bank 8) |
| Broche J12 | I/O — User I/O pin (bank 8) |
| Broche K1 | I/O — User I/O pin (bank 7) |
| Broche K2 | I/O — User I/O pin (bank 7) |
| Broche K3 | I/O — User I/O pin (bank 7) |
| Broche K4 | VCCIO7 — I/O bank 7 supply voltage |
| Broche K5 | I/O — User I/O pin (bank 7) |
| Broche K6 | I/O — User I/O pin (bank 7) |
| Broche K7 | I/O — User I/O pin (bank 7) |
| Broche K8 | GND — Ground |
| Broche K9 | I/O — User I/O pin (bank 8) |
| Broche K10 | I/O — User I/O pin (bank 8) |
| Broche K11 | I/O — User I/O pin (bank 8) |
| Broche K12 | VCCIO8 — I/O bank 8 supply voltage |
| Broche L1 | TCK — JTAG Test Clock |
| Broche L2 | TDO — JTAG Test Data Out |
| Broche L3 | TMS — JTAG Test Mode Select |
| Broche L4 | TDI — JTAG Test Data In |
| Broche L5 | nCONFIG — Configuration control (active low) |
| Broche L6 | nSTATUS — Configuration status (active low) |
| Broche L7 | DCLK — Configuration clock input |
| Broche L8 | DATA0 — Configuration data input |
| Broche L9 | MSEL0 — Configuration mode select 0 |
| Broche L10 | MSEL1 — Configuration mode select 1 |
| Broche L11 | CLK0 — Clock input 0 (dedicated) |
| Broche L12 | CLK1 — Clock input 1 (dedicated) |
Applications typiques
EP20K30EFI144-2X convient pour 6 applications: Telecom Interface Cards, PCI Bus Interface Glue Logic, Industrial Control State Machines, Low-Density DSP Preprocessing, Networking Protocol Bridging, Legacy Test and Measurement Instrumentation.
Telecom Interface Cards
The EP20K30EFI144-2X's 1200 logic elements and 93 user I/O make it suitable for telecom interface cards implementing protocol bridges, framing logic, and low-density SERDES control planes. Its 24576 embedded RAM bits provide buffering for cell/packet payloads in ATM or Ethernet-over-SDH designs. The 1.8 V core and multi-standard I/O (LVTTL, LVCMOS, HSTL, GTL+) simplify interfacing to legacy telecom ASICs. Industrial temperature grade supports outdoor enclosures.
Recommandé
PCI Bus Interface Glue Logic
The EP20K30EFI144-2X integrates well into PCI 32-bit/33 MHz bus designs by providing target/master state machines, address decoding, and interrupt handling in a single 144-FBGA device. PCI-compliant I/O standards are supported natively through dedicated VCCIO banks. The 1200 logic cells are sufficient for typical bridge functions between a host CPU and peripheral ASICs, reducing board area and BOM cost versus discrete logic.
Recommandé
Industrial Control State Machines
The EP20K30EFI144-2X is widely deployed in factory automation PLCs, motor controllers, and process control systems because of its industrial temperature rating and deterministic LUT-based logic. The 192 macrocells and embedded RAM blocks allow multi-axis state machine sequencing, encoder interface logic, and PWM generation in one device. Field programmability supports late-stage customization without ASIC redesign cycles.
Recommandé
Low-Density DSP Preprocessing
The EP20K30EFI144-2X handles low-density DSP preprocessing tasks such as FIR filtering, fixed-point arithmetic, and data routing before downstream processors. While the APEX 20KE family lacks hardware multipliers, 1200 cells suffice for 8-bit or 16-bit preprocessing in audio or video pipelines. The embedded system blocks (ESBs) double as fast dual-port RAM for coefficient storage, eliminating external SRAM.
Recommandé
Networking Protocol Bridging
The EP20K30EFI144-2X provides cost-effective bridging between Ethernet, HDLC, Frame Relay, and proprietary protocols in legacy router and switch line cards. The 1200 cells support protocol encapsulation, header parsing, and forwarding tables, while the embedded RAM caches routing entries for fast lookups. Multiple VCCIO banks connect directly to 3.3 V and 5 V PHYs without level shifters.
Recommandé
Legacy Test and Measurement Instrumentation
The EP20K30EFI144-2X is commonly found in legacy oscilloscopes, logic analyzers, and signal generators as timing control, trigger logic, and display interface glue. The JTAG interface simplifies firmware updates in production. Industrial temperature grade supports lab and field environments. Note: new designs should consider Cyclone IV GX or Lattice ECP5 for modern instrumentation platforms.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K30EFI144-2X — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K30EFC144-2X | EP20K30EFC144-1 | EP20K30EFI144-2XN | EP20K30EFC144-3 | EP20K30EFC144-1N | EP20K30EFC144-3N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 144-FBGA | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same | 144-FBGA - same |
| Logic Elements | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 |
| Macrocells | 192 | 192 | 192 | 192 | 192 | 192 | 192 |
| Embedded RAM Bits | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 | 24576 |
| Maximum User I/O | 93 | 93 | 93 | 93 | 93 | 93 | 93 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Speed Grade | -2 | -2 | -1 (slower) | -2 | -3 (faster) | -1 (slower) | -3 (faster) |
| Temperature Grade | Industrial | Commercial | Commercial | Industrial | Commercial | Commercial | Commercial |
Principaux différenciateurs
- Same 144-FBGA footprint across entire speed grade and Pb-free matrix (vs EP20K30EFC144-2X vs EP20K30EFC144-3)
- Industrial temperature grade with Pb-free availability (vs EP20K30EFI144-2X vs EP20K30EFC144-2X)
- Mid-density APEX 20KE position with 93 I/O in compact FBGA (vs EP20K30EFI144-2X vs EP20K100EFC324-2X)
Notes de conception
Estimated: VCCINT must be regulated to 1.8 V ±5% with bulk decoupling of 100 µF tantalum plus 0.1 µF ceramic per VCCINT ball. Each VCCIO bank can be set independently to 1.5 V, 1.8 V, 2.5 V, 3.3 V, or 5 V via LVTTL/LVCMOS/PCI/HSTL/GTL+ I/O standards. Place one 0.1 µF ceramic per VCCIO ball and one 10 µF bulk per bank to suppress switching transients during configuration. Multiple ground balls must be connected to a low-impedance ground plane.
The 144-FBGA package requires 1.0 mm ball pitch PCB land pattern with NSMD (non-solder-mask-defined) pads for best thermal cycling reliability. Use 4-6 layer PCB with continuous ground planes beneath the BGA for VCCINT/GND return paths. Via-in-pad with filled and plated-over copper is recommended for inner balls to escape routing. Reflow profile must not exceed 220 °C peak (SnPb) or 245 °C peak (Pb-free) per JEDEC J-STD-020.
Do not leave MSEL0/MSEL1 floating: tie them high or low to select the configuration mode (AS, PS, JTAG). nCONFIG must be held high via 10 kΩ pull-up; nSTATUS requires 10 kΩ pull-up. During multi-device configuration, all EP20K30E devices must share DCLK and DATA0. The legacy Quartus II (v9.0 or earlier) toolchain is mandatory - Quartus Prime does not support APEX 20KE bitstream generation.
Differential clock inputs (CLK0/CLK1) require 50 Ω controlled-impedance routing and AC termination if driving from a non-TTL source. Series dampen resistors (33 Ω) on high-speed I/O signals crossing bank boundaries reduce reflections. JTAG chain (TCK/TMS/TDI/TDO) should be buffered if the chain exceeds 4 devices; otherwise TDO fanout degradation can cause configuration failures.
Informations de conformité
Compliance data not provided in Verified Web Data. The -N suffix variants (e.g., EP20K30EFI144-2XN) are by convention Pb-free; however, explicit RoHS/REACH declarations should be requested from Intel/Avnet for production use. APEX 20KE FPGAs are obsolete and not AEC-Q100 qualified.
