EP20K400CB652C9ES - 400K Gates APEX 20KC FPGA | Intel (Altera)
Référence : EP20K400CB652C9ES ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2 650,00 |
| 100 | $240 | $24 000,00 |
| 500 | $215 | $107 500,00 |
| 1 000 | $195 | $195 000,00 |
EP20K400CB652C9ES Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can program in-circuit to implement arbitrary digital logic. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) and are commonly positioned between discrete logic ICs and fixed-function ASICs in terms of flexibility, density, and per-unit cost. The APEX 20KC family specifically targets high-performance, high-bandwidth designs that combine lookup-table (LUT) logic with embedded memory and LVDS-capable I/O.
Key features of the EP20K400CB652C9ES include 212,992 bits of embedded memory, 488 user I/Os, support for multiple I/O standards including LVDS, and in-system programmability via the IEEE 1149.1 JTAG interface. The device integrates a four-phase PLL for clock management and provides hot-socketing capability for line-card applications. Compared with the older APEX 20K family, the 20KC variants offer roughly 2x density and improved signal integrity at high toggle rates.
The EP20K400CB652C9ES is widely used in telecommunications line cards, data-acquisition and signal-processing front ends, industrial control, and high-speed prototyping. Its combination of high gate count and LVDS I/O makes it especially well suited for parallel bus bridging, serializer/deserializer (SerDes) glue logic, and custom coprocessors in imaging and test equipment.
Designers should note that the EP20K400CB652C9ES is a mature, second-generation APEX part and is now considered legacy hardware. Altera's Quartus II design tool (version 5.1 or earlier) is required for compilation, and a 1.8 V core regulator with proper decoupling is mandatory for stable operation.
This page synthesizes distributor stock data, drop-in pin-compatible alternatives, and practical design notes for engineers maintaining or replicating legacy APEX 20KC designs - information that is not consolidated in any single source.
Alternatives de remplacement direct pour EP20K400CB652C9ES — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K400CB652C9ES (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Propagation Delay, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K400CB652C9
✅ Remplacement direct✓ En stock
$89.2 / unité
Voir la fiche technique →EP20K400CB652C8N
✅ Remplacement direct✓ En stock
$155 / unité
Voir la fiche technique →EP20K400CB652C7N
✅ Remplacement direct✓ En stock
$158 / unité
Voir la fiche technique →EP20K400CB652C7ES
✅ Remplacement direct✓ En stock
$215 / unité
Voir la fiche technique →EP20K400BI652-2V
✅ Remplacement direct✓ En stock
$84.5 / unité
Voir la fiche technique →EP20K400BI652-2
✅ Remplacement direct✓ En stock
$108.4 / unité
Voir la fiche technique →EP20K400CB652C9ES Valeurs maximales et caractéristiques électriques
| Series | APEX 20KC |
| Family | APEX 20KC |
| Logic Elements / Cells | 16640 |
| Total System Gates | 400000 |
| Embedded Memory (Bits) | 212992 |
| Number of User I/O | 488 |
| Number of Logic Array Blocks | 1040 |
| Maximum Operating Frequency | 250 MHz |
| Core Voltage | 1.8 V |
| Process Technology | 0.15 µm CMOS |
| Plage de température de fonctionnement | 0°C to +85°C (Commercial) |
| Type de montage | Surface Mount |
| Boîtier / Format | 652-BGA |
| Niveau MSL | 3 (168 Hours) |
| Packaging | Tray |
| Programmability Type | In-system programmable (SRAM-based) |
| I/O Standards Supported | LVTTL, LVCMOS, PCI, LVDS, HSTL, SSTL |
| JTAG (IEEE 1149.1) | Yes |
| PLL | Yes (4-phase) |
Guide de configuration des broches du EP20K400CB652C9ES 652-bga
Configuration des broches du EP20K400CB652C9ES (boîtier 652-bga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP20K400CB652C9ES.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP20K400CB652C9ES convient pour 6 applications: Telecommunications Line-Card Glue Logic, High-Speed Parallel Bus Bridging, Custom Coprocessor for DSP Front Ends, Industrial Control and Machine Vision, Legacy System Replication and Sustainment, ASIC Prototyping and Emulation.
Telecommunications Line-Card Glue Logic
The EP20K400CB652C9ES is well suited for telecommunications line-card glue logic where high gate count and LVDS I/O are required. Its 16,640 logic elements handle complex bus-bridging and protocol-conversion functions between network processors and SERDES devices, while 488 user I/Os support wide parallel datapaths. The 250 MHz internal frequency comfortably meets typical 200 MHz LVDS toggle rates. Compared with discrete logic, the single-chip APEX 20KC approach reduces board area and BOM cost. Quartus II handles floor-planning, JTAG-based configuration simplifies in-system updates.
Recommandé
High-Speed Parallel Bus Bridging
The EP20K400CB652C9ES serves as a parallel-bus bridge between processors, memories, and peripherals in test and measurement equipment. Its 488 I/Os support wide data buses (32/64-bit plus control) and its LVDS capability enables sub-nanosecond skew control across parallel channels. Embedded memory blocks (212 Kbits total) provide FIFO and elastic buffer storage for cross-clock-domain transfers. Designers typically instantiate 16-32 ESBs as FIFOs. The 1.8 V core reduces dynamic power versus older 3.3 V FPGAs.
Recommandé
Custom Coprocessor for DSP Front Ends
The EP20K400CB652C9ES functions as a custom DSP coprocessor handling pre/post-processing in radar, sonar, and software-defined radio front ends. Its 16,640 logic elements and 250 MHz fMAX sustain multiply-accumulate chains at high sample rates, while distributed ESBs store coefficient tables and delay lines. Designers implement pipelined FIR filters and FFT butterflies entirely in fabric. LVDS I/O links the FPGA directly to high-speed ADCs. Quartus II DSP Builder accelerates algorithm development.
Recommandé
Industrial Control and Machine Vision
The EP20K400CB652C9ES integrates image-processing pipelines, motor-control state machines, and fieldbus interfaces for industrial machine-vision systems. Its 488 I/Os accept multiple Camera Link channels while embedded memory buffers full frames; LVDS I/O maintains signal integrity on long cables. Hot-socketing allows line-card replacement without system shutdown. Industrial temperature variants (-2/-2V speed grade) of the same die extend operating range to -40 °C to +100 °C.
Recommandé
Legacy System Replication and Sustainment
The EP20K400CB652C9ES is most commonly sourced today for legacy system replication and long-term sustainment programs in defense and aerospace. Its mature tooling (Quartus II 5.1 or earlier) and existing bitstream libraries make it irreplaceable in many fielded platforms. Same-family variants in the 652-BGA package allow direct drop-in replacement when original inventory is exhausted. Engineers should design the PCB footprint to accept both -9ES and -8N speed grades.
Recommandé
ASIC Prototyping and Emulation
The EP20K400CB652C9ES is frequently used as an ASIC prototyping platform for designs targeting gate counts in the 300-500K range. Its high logic density, embedded memory, and LVDS I/O allow realistic emulation of ASIC subsystems before tape-out, and multiple FPGAs can be tiled via LVDS to prototype larger chips. Quartus II provides gate-level timing simulation that closely matches ASIC implementation. The 652-BGA package supports high-pin-count prototyping boards.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K400CB652C9ES — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K400CB652C9 | EP20K400CB652C8N | EP20K400CB652C7N | EP20K400CB652C7ES | EP20K400BI652-2V | EP20K400BI652-2 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Package | 652-BGA | 652-BGA - same | 652-BGA - same | 652-BGA - same | 652-BGA - same | 652-BGA - same | 652-BGA - same |
| Family | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC | APEX 20KC |
| Logic Elements | 16640 | 16640 | 16640 | 16640 | 16640 | 16640 | 16640 |
| System Gates | 400K | 400K | 400K | 400K | 400K | 400K | 400K |
| Embedded Memory (bits) | 212992 | 212992 | 212992 | 212992 | 212992 | 212992 | 212992 |
| User I/O Count | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Speed Grade / fMAX Indicator | -9ES (250 MHz max) | -9 (same as -9ES) | -8N (~200 MHz, -20%) | -7N (~175 MHz, -30%) | -7ES (~175 MHz, -30%) | -2V (industrial, slower) | -2 (industrial, slower) |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial | Industrial | Industrial |
Principaux différenciateurs
- Highest speed grade in the EP20K400CB652 family (vs EP20K400CB652C8N)
- Engineering sample suffix with full die capability (vs EP20K400CB652C9)
- Commercial temperature grade versus industrial alternates (vs EP20K400BI652-2V)
Notes de conception
The EP20K400CB652C9ES requires a clean 1.8 V core supply with bulk decoupling (>= 100 uF low-ESR) plus 0.1 uF and 0.01 uF ceramic capacitors adjacent to every VCC pin pair. According to Altera's APEX 20KC datasheet, VCCIO must be supplied separately for each I/O bank to support mixed-voltage standards; tying VCCIO banks together will prevent the bank from configuring its I/O standard independently. Use a ferrite-bead-isolated analog supply (VCC_PLL) for each PLL to minimize jitter.
The 652-BGA package has a typical theta_JA of approximately 12 C/W with 1 oz copper on inner PCB layers. At maximum toggle activity (100% logic utilization at 250 MHz), the device can dissipate 2-3 W. According to the Altera APEX 20KC datasheet, exceeding 85 C junction temperature requires airflow or heatsink attachment for reliable long-term operation. Engineers should leave thermal vias under the central BGA ball array.
The 652-BGA package has a fine ball pitch that requires 0.5-0.8 mm PCB micro-via fanout. According to APEX 20KC hardware design guidelines, all signal layers must use matched impedance traces (50 ohm single-ended, 100 ohm differential) for LVDS pairs, and inner layers should be continuous ground/power planes to provide return paths. Avoid routing LVDS signals across plane splits to prevent EMI and signal-integrity issues.
Do not attempt to program the EP20K400CB652C9ES with Quartus II versions newer than 5.1, as later releases dropped APEX 20KC device support. According to Altera legacy toolchain notes, the configuration bitstream format must match the device ID; using a -9ES bitstream on a -8N device will fail CRC check. Always include a JTAG header on the PCB for in-system reprogramming during bring-up, and verify all VCCIO banks are powered before initiating configuration.
Informations de conformité
Compliance status not present in verified web data; APEX 20KC family predates widespread RoHS documentation. Engineers should request the specific date code RoHS declaration from the distributor. Not AEC-Q100 - this is a commercial/industrial FPGA, not an automotive grade.