EP20K400CB652C9N - APEX 20KC FPGA 400K Gates BGA-652 | Intel
Référence : EP20K400CB652C9N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2 650,00 |
| 100 | $240 | $24 000,00 |
| 500 | $215 | $107 500,00 |
| 1 000 | $195 | $195 000,00 |
EP20K400CB652C9N Présentation
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor IC containing configurable logic blocks, routing channels, and I/O cells that the user programs after manufacture, implementing arbitrary digital circuits without an ASIC tape-out. APEX 20KC is the high-density copper-interconnect revision of the APEX 20K family; it sits in the taxonomy: programmable logic device (PLD) -> complex PLD (CPLD) / FPGA -> SOPC-class FPGA. APEX 20KC devices are pin-compatible with APEX 20KE predecessors and target embedded compute, telecom, and DSP front-end designs where integration and I/O density matter more than absolute clock rate.
Key features include a 250 MHz internal performance, 2 ns propagation delay, 488 I/O pins (502 user pins per datasheet variant), a MultiCore architecture combining lookup-table logic with embedded memory blocks, and high-performance low-power copper interconnect. The part supports in-system programmability through IEEE 1149.1 JTAG and is delivered in a 1.8 V core, 2.5 V I/O supply configuration.
Architecturally, EP20K400CB652C9N combines MegaLAB structures (16 logic elements per LAB, grouped into 26 LABs per MegaLAB) with embedded system blocks for true-dual-port RAM, content-addressable memory, ROM, and FIFO functions. The copper-interconnect 0.15 µm process improves performance by 25-35% over APEX 20KE devices at comparable power, enabling 250 MHz system clock designs.
Typical applications include telecommunications line cards, DSP data-path acceleration, high-speed image processing, network routers and switches, and embedded control systems. The 652-ball BGA footprint suits multi-layer PCB designs requiring maximum logic density on a single board.
When designing with this device, observe strict power-plane decoupling on each VCCINT/VCCIO pin pair, respect the JTAG chain topology, and use the Quartus II (or MAX+PLUS II legacy) tool flow. Note that APEX 20KC is a mature node - confirm long-term availability before new production designs.
This page synthesizes distributor pricing, same-brand APEX 20KC drop-in alternatives, and practical design notes not consolidated on any single manufacturer or distributor page.
Alternatives de remplacement direct pour EP20K400CB652C9N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K400CB652C9N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Speed Grade, System Gates.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K400CB652C9
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$89.2 / unité
Voir la fiche technique →EP20K400CB652C9ES
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$195 / unité
Voir la fiche technique →EP20K400CB652C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$155 / unité
Voir la fiche technique →EP20K400CB652C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$158 / unité
Voir la fiche technique →EP20K400CB652C7ES
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$215 / unité
Voir la fiche technique →EP20K600CB652C7
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1320 / unité
Voir la fiche technique →EP20K400CB652C9N Valeurs maximales et caractéristiques électriques
| Family | APEX 20KC |
| Series | EP20K400 |
| Device Type | Programmable Logic Device (SOPC FPGA) |
| Architecture | MultiCore (LUT logic + Embedded System Blocks) |
| System Gates | 400,000 |
| Logic Elements | 16,640 |
| Maximum User I/Os | 502 |
| Total Memory Bits | 212,992 (per chip) |
| Maximum Internal Frequency | 250 MHz |
| Propagation Delay | 2.0 ns |
| Logic Family | CMOS |
| Core Process Technology | 0.15 µm all-layer copper CMOS |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 2.5 V |
| Plage de température de fonctionnement | 0 °C to +85 °C (Commercial) |
| Boîtier | BGA-652 (Plastic Ball Grid Array, 652 balls) |
| Type de montage | Surface Mount |
| Configuration Interface | IEEE 1149.1 JTAG, serial passive parallel async |
| Statut RoHS | Unknown (legacy Altera part - verify with distributor) |
Guide de configuration des broches du EP20K400CB652C9N bga-652 (plastic ball grid array, 652 balls)
Configuration des broches du EP20K400CB652C9N (boîtier bga-652 (plastic ball grid array, 652 balls)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP20K400CB652C9N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP20K400CB652C9N convient pour 7 applications: Telecommunications Line Cards, DSP Data-Path Acceleration, Industrial Control and Automation, Network Router and Switch Fabrics, High-Speed Image Processing, Embedded Computing and Avionics, Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP20K400CB652C9N's 502 user I/Os and 250 MHz internal performance suit telecom line-card designs where multiple E1/T1, SONET, or Ethernet framer interfaces must terminate concurrently. Its 400,000 system gates accommodate cell/packet processing, header parsing, and traffic-shaping logic alongside 16,640 logic elements for glue and FIFO control. With up to 212,992 embedded memory bits, the part buffers cells in true-dual-port RAM without external SSRAMs, simplifying board layout and reducing BOM cost for high-density line-card designs.
Recommandé
DSP Data-Path Acceleration
For DSP front-end designs, the EP20K400CB652C9N delivers 16,640 logic elements with 250 MHz performance for FIR filters, FFT engines, and correlator implementations. The MultiCore architecture combines LUT logic with embedded system blocks to implement coefficient ROM and delay-line memory directly on-chip, avoiding external SRAM accesses. The 502 user I/Os accept multiple parallel ADC data streams and provide synchronous interfaces to host DSP processors, making this device well-suited for radar, sonar, and software-defined-radio front ends.
Recommandé
Industrial Control and Automation
Industrial PLC, motion-control, and SCADA systems use the EP20K400CB652C9N for parallel I/O aggregation, encoder decoding, and real-time protocol bridging. Its 502 user I/Os absorb hundreds of digital I/O lines and multiple RS-485/Profibus/CAN interface channels, while the 400K-gate logic fabric runs IEC 61131 logic and safety interlocks simultaneously. The 0-85 °C commercial temperature range suits factory-floor enclosures; designers needing extended -40-100 °C operation select the EP20K400EBC652 or EP20K400EFC672 industrial variants from the same family.
Recommandé
Network Router and Switch Fabrics
Router line-card and switching-fabric designs benefit from the EP20K400CB652C9N's combination of 502 user I/Os, embedded dual-port RAM, and 250 MHz fabric. The 400K gates implement packet classification, queue management, and lookup-table engines while the 16,640 logic elements provide high-speed arbitration across multiple ports. The BGA-652 package supports dense multi-layer PCBs required by 1U/2U router chassis, and the MultiCore embedded memory reduces external TCAM/SSRAM dependencies in forwarding-engine designs.
Recommandé
High-Speed Image Processing
Machine-vision and medical-imaging systems use the EP20K400CB652C9N to pipeline data from multiple image sensors through real-time filters, edge-detection, and color-space conversion blocks. The 502 I/Os accept parallel LVDS sensor data and SDR/DDR memory buses simultaneously, while the 250 MHz fabric sustains pixel-clock-rate processing on VGA through XGA resolutions. The 212,992 embedded RAM bits buffer line-scan data and lookup tables for gamma correction without external memory access penalties.
Recommandé
Embedded Computing and Avionics
Avionics, military, and long-life industrial embedded systems leverage the EP20K400CB652C9N for VPX/VME bus bridging, ARINC 429/1553 protocol handling, and discrete-signal aggregation. The 400K-gate logic fabric supports multiple avionics protocols concurrently, while the ruggedized 0-85 °C operating range and Intel's stable NRND product status provide supply visibility through long-life programs. The JTAG-based configuration supports secure bitstream loading for tamper-resistant designs.
Recommandé
Test and Measurement Instrumentation
ATE, oscilloscope, and protocol-analyzer instruments use the EP20K400CB652C9N to capture, time-stamp, and route hundreds of measurement channels simultaneously. The 502 user I/Os accept parallel LVDS or PECL probe channels, while the 250 MHz fabric runs triggering logic, statistical counters, and on-screen-display pipelines. The embedded system blocks implement deep capture-RAM FIFOs, eliminating external SRAM and reducing probe-loading in high-bandwidth measurement systems.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K400CB652C9N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K400CB652C9 | EP20K400CB652C9ES | EP20K400CB652C8N | EP20K400CB652C7N | EP20K400CB652C7ES | EP20K600CB652C7 |
|---|---|---|---|---|---|---|---|
| Package | BGA-652 | BGA-652 - same | BGA-652 - same | BGA-652 - same | BGA-652 - same | BGA-652 - same | BGA-652 - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| System Gates | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 400,000 | 600,000 (+50%) |
| Logic Elements | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 16,640 | 24,320 (+46%) |
| Speed Grade (Internal Delay) | C9 (~2.0 ns) | C9 (~2.0 ns) - same | C9 ES - same speed bin | C8 (~1.8 ns, faster) | C7 (~1.6 ns, fastest) | C7 ES - fastest | C7 (~1.6 ns, faster) |
| Maximum User I/Os | 502 | 502 | 502 | 502 | 502 | 502 | 502 (same BGA) |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| I/O Voltage (VCCIO) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Lead-Free Terminal Finish | Yes (N suffix) | No (matte tin) | ES finish | Yes (N suffix) | Yes (N suffix) | ES finish | Per datasheet |
Principaux différenciateurs
- Drop-in compatibility with APEX 20KE BGA-652 parts at 25-35% higher fMAX (vs EP20K600EBC652-2 (APEX 20KE series))
- Highest-density logic in the APEX 20KC BGA-652 line-up below EP20K600 (vs EP20K200CB652C7ES)
- Embedded system blocks with true-dual-port RAM eliminate external SSRAMs (vs Discreet FPGAs of the same era without MultiCore architecture)
Notes de conception
Estimated: at 100% toggle on all 16,640 logic elements and 502 I/Os at 250 MHz, the EP20K400CB652C9N draws roughly 1.5-2.0 A from VCCINT (1.8 V) and 0.5-1.0 A from VCCIO (2.5 V). Total power budget is therefore approximately 4-6 W. Design a 1.8 V regulator with at least 3 A headroom and a 2.5 V regulator with at least 1.5 A headroom. Place bulk 100 µF tantalum capacitors near each voltage pin group and 0.1 µF ceramic capacitors adjacent to every VCCINT/VCCIO pin pair per APEX 20KC Hardware Design Guidelines. Power-rail sequencing is not required (core and I/O can ramp together) but must reach regulation within 100 ms to avoid configuration latch-up.
The BGA-652 package has 1.27 mm pitch and 27x27 grid with corner balls depopulated. Use a minimum 8-layer PCB stackup with dedicated VCCINT, VCCIO, and ground planes; signal layers should reference an unbroken ground plane for return-path integrity. Microvia (laser-drilled) technology is strongly recommended for breakout routing - through-hole dog-bone fan-out exceeds practical escape routing below 12 layers. Match all clock, DDR, and LVDS pairs to within 5 mil length tolerance and use 50 Ω single-ended / 100 Ω differential controlled impedance. Keep all 652 balls within a 35 mm x 35 mm area for the EP20K400CB652 footprint per APEX 20KC mechanical drawings.
Estimated: with 502 simultaneous-switching outputs at 2.5 V LVTTL into 50 Ω traces, simultaneous switching noise (SSN) on VCCIO/GND can exceed 200 mV without proper decoupling. Place 10 nF and 100 nF ceramic capacitors immediately adjacent to every VCCIO pin group, plus a 4.7 µF X5R bulk cap per bank. Limit SSO (simultaneously switching outputs) to 16 per bank when driving LVTTL, and to 8 per bank for LVDS. Use spread-spectrum clocking on the global clock network if the design tolerates ±0.5% frequency modulation, which reduces SSN peaks by 6-10 dB. Series-damping resistors (22-33 Ω) on long PCB traces further reduce reflections on the global clock distribution network.
Three common pitfalls on EP20K400 designs: (1) The 1.8 V VCCINT must be monotonic and reach regulation within 100 ms - undershoot below 1.65 V can latch the device into a non-configurable state requiring power cycling. (2) The JTAG chain must include the EP20K400 plus any other JTAG devices (configuration PROMs, boundary-scan ICs) and the TCK pull-down resistor should be 1-10 kΩ per IEEE 1149.1. (3) The nCONFIG pin must be held low during power-up until VCCINT/VCCIO reach regulation; failure to do so can lock the device in an undefined configuration state. Finally, always check that your Quartus II version supports the APEX 20K device family - versions above 13.0sp1 have removed support.
Reserved pins on the EP20K400CB652C9N include all VCCINT, VCCIO, GND, JTAG (TCK, TMS, TDI, TDO, TRST), configuration (nCONFIG, nSTATUS, CONF_DONE), and the no-connect balls - leave all of these unconnected in the user netlist or assign them to their fixed roles per the pin information file. Do not route any high-speed signals through the ball rows directly under the BGA substrate center, which lacks a continuous ground plane. Keep differential pairs on the same signal layer and route them symmetrically with no more than two vias per pair. Place a 4-layer guard trace around the entire BGA escape pattern to shield against adjacent noise sources.
Informations de conformité
EP20K400CB652C9N was originally released as a pre-RoHS Altera part. The 'N' suffix typically denotes lead-free terminal finish per Altera's legacy nomenclature, but RoHS compliance is not explicitly documented in current web data as of 2026-09-08. AEC-Q100 is not applicable for this commercial-grade FPGA. Customers requiring RoHS/REACH certification should request a signed compliance letter from the distributor or Intel directly.
