EP20K600CF672C-7 - 600K Gate APEX 20KC FPGA, 672-FCBGA | Altera
Référence : EP20K600CF672C-7 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2524.76 | $2 524,76 |
| 10 | $2400 | $24 000,00 |
| 100 | $2100 | $210 000,00 |
| 500 | $1850 | $925 000,00 |
| 1 000 | $1620 | $1 620 000,00 |
EP20K600CF672C-7 Présentation
An FPGA (Field Programmable Gate Array) is a programmable logic device (PLD) that lets designers implement arbitrary digital logic through SRAM-based configuration memory. FPGAs sit hierarchically under the broader category of programmable logic devices (SPLD, CPLD, FPGA) and integrated circuits. The APEX 20KC family in particular targets high-density data-path and datapath-plus-control designs requiring fast embedded memory, LVDS support, and integration of processor peripherals on a single die.
Key features of the EP20K600CF672C-7 include a 1.48 ns propagation delay (speed grade -7), 1.27 mm ball pitch on a 45 x 45 mm substrate, an operating temperature range of 0 to 85 °C (commercial grade, indicated by the C in the part suffix), support for MultiVolt I/O interfacing, and in-system programmability via the Enhanced Configuration (EPC) device family. The combination of high gate count, abundant ESB memory, and rich I/O makes the device suitable for bus-interface glue, telecommunications line cards, and parallel DSP datapaths.
Typical applications for this device include high-speed telecommunications switching, parallel DSP processing, video and imaging pipelines, networking line cards, industrial control logic, and ASIC prototyping. Designers migrating from APEX 20K to APEX 20KC typically gain approximately 35% performance improvement due to the 0.15 µm copper-interconnect process used in 20KC.
When designing with the EP20K600CF672C-7, plan for proper decoupling of the FCBGA power balls, controlled-impedance PCB routing for the LVDS channels, and JTAG-driven configuration through an EPC16 or EPC2 configuration device. The Altera Quartus II design suite supports back-annotation and incremental fitting for this device family.
Alternatives de remplacement direct pour EP20K600CF672C-7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K600CF672C-7 (même facteur de forme et même empreinte) — différant par Process Technology, Operating Temperature, Speed Grade, Package, Device Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K600CF672C9
✅ Remplacement direct✓ En stock
$171 / unité
Voir la fiche technique →EP20K600CF672C8
✅ Remplacement direct✓ En stock
$322.4109 / unité
Voir la fiche technique →EP20K600CF672C-7 Valeurs maximales et caractéristiques électriques
| Device Family | APEX 20KC |
| Typical Gates | 600,000 |
| Logic Elements | 24,576 |
| Maximum User I/O | 508 |
| Embedded Memory (ESB) | 311 kbits |
| Number of Terminals | 672 |
| Package Type | 672-BBGA, FCBGA |
| Package Dimensions | 45 x 45 mm |
| Ball Pitch | 1.27 mm |
| Process Technology | 0.18 µm all-layer copper-metal (APEX 20KC) |
| Speed Grade | -7 |
| Propagation Delay | 1.48 ns |
| Température de fonctionnement | 0 °C to 85 °C (Commercial) |
| Configuration Interface | EPC (Enhanced Configuration) device family |
| Type de montage | Surface Mount |
Guide de configuration des broches du EP20K600CF672C-7 45 x 45 mm
Configuration des broches du EP20K600CF672C-7 (boîtier 45 x 45 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP20K600CF672C-7.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP20K600CF672C-7 convient pour 6 applications: Telecommunications Line Card Design, Parallel DSP Datapath Implementation, Video and Imaging Pipeline, Networking Switch Fabric Glue Logic, ASIC Prototyping Platform, Industrial Control Logic Platform.
Telecommunications Line Card Design
The EP20K600CF672C-7's 600,000 typical gates and 508 user I/Os make it well suited for telecom line cards that aggregate multiple E1/T1 or Ethernet channels. The 1.48 ns propagation delay enables high-speed cell processing, while the 311 kbits of embedded dual-port RAM store per-channel context. Compared with ASIC alternatives the FPGA offers flexible late-stage protocol updates. Designers typically pair the device with external PHY transceivers and a TDM bus, using Quartus II for fitting and Static Timing Analysis. Industrial-grade variants are recommended for outdoor cabinet deployments.
Recommandé
Parallel DSP Datapath Implementation
The APEX 20KC's LAB-rich architecture with Embedded System Blocks is ideal for parallel DSP datapaths such as FFT pipelines, FIR filters, and Reed-Solomon codecs. The 24,576 logic elements and 311 kbits of dual-port memory allow wide data-path words with on-chip coefficient storage. The -7 speed grade's 1.48 ns tPD supports 100+ MHz systolic operation. Compared with discrete DSP processors the FPGA offers deterministic latency and concurrent multiply-accumulate paths. Designers commonly implement FIR/FFT kernels in VHDL or Verilog and pipeline across ESBs for sample-by-sample throughput.
Recommandé
Video and Imaging Pipeline
With 508 user I/Os and abundant embedded memory, the EP20K600CF672C-7 can absorb wide video buses (RGB + sync + clock) and implement real-time pixel processing for camera pipelines, frame grabbers, and display controllers. The LVDS-capable I/Os support high-speed serializer/deserializer interfaces to image sensors. The 311 kbits of dual-port RAM hold line buffers and color-conversion tables. Versus an ASIC, the FPGA enables rapid sensor-protocol updates. Designers typically route pixel data through a chain of pipeline stages using LAB registers and ESB-backed FIFOs.
Recommandé
Networking Switch Fabric Glue Logic
The EP20K600CF672C-7 is frequently used to implement glue logic between network processors, switch fabrics, and PHY interfaces in enterprise switches. The high I/O count (508) handles multiple Gigabit Ethernet MACs, SPI/PCI interfaces, and management buses. The 1.48 ns propagation delay supports 100 MHz+ internal buses, and the embedded memory buffers packet descriptors. Compared with CPLDs the FPGA handles full packet-processing pipelines plus statistics counters. Designers commonly place the FPGA between the BCM switch ASIC and the front-panel PHYs with JTAG-bound configuration.
Recommandé
ASIC Prototyping Platform
Engineers commonly use the EP20K600CF672C-7 as a hardware prototyping vehicle for ASIC designs in the 300K to 600K gate range. The APEX 20KC architecture supports RTL synthesis in Quartus II, allowing early software development and system validation months before ASIC tape-out. The 672-FCBGA package exposes enough I/Os to map the full ASIC perimeter, and the 311 kbits of embedded memory approximate many ASIC SRAM blocks. Designers partition the ASIC across one or more APEX 20KC FPGAs and use JTAG-based multi-device configuration chains.
Recommandé
Industrial Control Logic Platform
The EP20K600CF672C-7 supports industrial automation controllers where multiple motor-control loops, encoder interfaces, and fieldbus protocols must coexist on one programmable platform. The 508 user I/Os handle multi-axis encoder inputs, PWM outputs, and CAN/EtherCAT connections. The embedded dual-port RAM stores per-axis trajectory tables, and the -7 speed grade's 1.48 ns tPD enables 200 kHz+ current-loop rates. Designers integrate soft-CPU cores (Nios or custom) for supervisory logic and use ESBs for high-speed quadrature capture. Industrial temperature variants (CB652I9, etc.) extend deployment to harsh environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K600CF672C-7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K600CF672C9 | EP20K600CF672C8 | EP20K600CB652C7 | EP20K600CB652C9 | EP20K600CB652I9 |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 672-FCBGA (45x45 mm, 1.27 mm pitch) | 672-FCBGA (same) | 672-FCBGA (same) | 652-FBGA (smaller, 20 fewer balls) | 652-FBGA (smaller, 20 fewer balls) | 652-FBGA (smaller, industrial) |
| Speed Grade | -7 (1.48 ns tPD) | -9 (slower tPD) | -8 (intermediate tPD) | -7 (1.48 ns tPD, same as target) | -9 (slower tPD) | -9 (slower tPD, industrial) |
| Typical Gates | 600,000 | 600,000 (same die) | 600,000 (same die) | 600,000 (same die) | 600,000 (same die) | 600,000 (same die) |
| Maximum User I/O | 508 | 508 | 508 | 488 (652 balls = fewer I/Os) | 488 | 488 |
| Operating Temperature | 0 to 85 °C (Commercial) | 0 to 85 °C (Commercial) | 0 to 85 °C (Commercial) | 0 to 85 °C (Commercial) | 0 to 85 °C (Commercial) | -40 to 100 °C (Industrial) |
| Embedded Memory (ESB) | 311 kbits | 311 kbits (same die) | 311 kbits (same die) | 311 kbits (same die) | 311 kbits (same die) | 311 kbits (same die) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Highest speed grade (-7) within the APEX 20KC 672-FCBGA family (vs EP20K600CF672C9)
- Maximum I/O count within the APEX 20KC family (vs EP20K600CB652C7)
- Commercial temperature grade with -7 speed grade availability (vs EP20K600CB652I9)
Notes de conception
The 672-FCBGA package uses a 45 x 45 mm substrate with 1.27 mm ball pitch, requiring a multilayer PCB with via-in-pad or microvia technology for reliable BGA assembly. Decouple each VCCINT and VCCIO power pin with a 0.1 µF X7R ceramic placed within 2 mm of the ball, plus bulk 10 µF tantalum capacitors distributed across the power planes. Maintain continuous ground and power planes under the BGA to control return-current paths and minimize inductance for the simultaneous-switching output (SSO) noise.
Do not assume the EP20K600CF672C-7 can be hot-swapped with the EP20K600CB652C7 (652-ball BGA). The CB652 variant has 20 fewer I/O balls and a smaller 33 x 33 mm body, so a PCB designed for the 672-FCBGA cannot accept the 652-FBGA without rework. When migrating, also verify that the unused balls of the 672 package are still defined as power/ground in the 652 pinout to avoid floating inputs. Configuration bitstream files are not interchangeable across packages because the I/O count differs.
LVDS channels on the APEX 20KC family require matched-length differential pairs with 100 Ω differential impedance and length matching to within 50 mil (1.27 mm). Route each LVDS pair on the same PCB layer with no more than two vias to minimize impedance discontinuities. Keep LVDS signals at least 3W (3 × trace width) away from single-ended signals to control crosstalk. The MultiVolt I/O feature requires per-bank VCCIO supplies; ensure bank voltages (1.5 V, 1.8 V, 2.5 V, 3.3 V) are properly decoupled and isolated.
Informations de conformité
RoHS, REACH, lead-free, and halogen-free compliance status was not present in the verified web data. The APEX 20KC family is obsolete; for new designs with strict compliance requirements, migrate to a current-generation Cyclone IV/V or MAX 10 device with documented RoHS/REACH declarations.