EP20K600CF672C8 - 508-I/O APEX-20K FPGA | Intel
Référence : EP20K600CF672C8 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $322.4109 | $322,41 |
| 10 | $322.4109 | $3 224,11 |
| 100 | $322.4109 | $32 241,09 |
| 500 | $322.4109 | $161 205,45 |
| 1 000 | $322.4109 | $322 410,90 |
EP20K600CF672C8 Présentation
A field-programmable gate array, or FPGA, is a programmable logic device containing configurable logic blocks, routing resources, and input/output blocks. FPGA devices combine software-defined digital logic with hardware parallelism, placing them between conventional fixed-function integrated circuits and fully custom silicon in the programmable-logic hierarchy. Their reconfigurable architecture supports interface bridging, protocol implementation, digital signal processing, control logic, and prototype development.
The EP20K600CF672C8 provides 508 user I/O, 24,320 logic elements, and 311,296 RAM bits. The 672-ball FBGA package supports high pin-count connectivity in a surface-mount design, while the 0 to 85 C operating-temperature range suits commercial and many industrial environments. A propagation-delay figure of 1.48 ns is reported in the retrieved technical listing. Because exact speed-grade and electrical-limit data are not present in the supplied web excerpts, designers should consult the manufacturer datasheet before release.
The device belongs to the APEX-20K family and uses a programmable logic architecture intended to support system-level integration. Embedded RAM can reduce the need for separate memory in selected datapaths, while the large I/O count enables multiple buses, communications channels, and control interfaces. Configuration storage, pin assignment, timing constraints, and termination must be handled using the appropriate legacy design flow and verified against the manufacturer documentation.
Typical applications include communications-interface aggregation, industrial control systems, test and measurement equipment, image-processing pipelines, and high-density prototyping. Its 508 user I/O and 311,296 RAM bits are particularly relevant where many external devices must be connected without expanding the logic design into multiple smaller FPGAs.
PCB design should use the official 672-ball land pattern and follow the manufacturer power, decoupling, signal-integrity, and thermal recommendations. BGA assembly requires controlled vias, escape routing, solder-paste inspection, and reliable reflow processing. The published source data reports conflicting BGA pin-count descriptions, so the official manufacturer package drawing is authoritative.
This product page combines verified distributor specifications, current market references, package hierarchy, and engineering guidance. Pricing and availability are not a substitute for lifecycle confirmation, and obsolete or mature devices should be qualified through appropriate procurement, counterfeit-risk, and redesign processes.
Alternatives de remplacement direct pour EP20K600CF672C8 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K600CF672C8 (même facteur de forme et même empreinte) — différant par Process Technology, Operating Temperature, Package, Speed Grade, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K600CF672C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$108 / unité
Voir la fiche technique →EP20K600CF672C7ES
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$360 / unité
Voir la fiche technique →EP20K600CF672C7
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2267.89 / unité
Voir la fiche technique →EP20K600CF672C6
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$480 / unité
Voir la fiche technique →EP20K600CF672C-8
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1150 / unité
Voir la fiche technique →EP20K600CF672C8 Valeurs maximales et caractéristiques électriques
| Device Type | Field Programmable Gate Array (FPGA) |
| Product Family | APEX-20K |
| User I/O Count | 508 |
| Logic Elements | 24,320 |
| Total RAM Bits | 311,296 bits |
| Propagation Delay | 1.48 ns |
| Package Pin Count | 672 balls |
| Supplier Device Package | 672-FBGA, 27 mm x 27 mm |
| Alternate Package Description | BGA-652, 45 mm x 45 mm, 1.27 mm pitch |
| Package Type | FBGA |
| Type de montage | Surface Mount |
| Tension d'alimentation | 1.71 V to 1.89 V |
| Température de fonctionnement | 0 C to 85 C |
| Fabrication Process | 0.15 um |
| Statut RoHS | Non-compliant |
Guide de configuration des broches du EP20K600CF672C8 fbga
Configuration des broches du EP20K600CF672C8 (boîtier fbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP20K600CF672C8.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP20K600CF672C8 convient pour 6 applications: Industrial Control and Automation, Communications Interface Aggregation, Test and Measurement Equipment, High-Density Digital Prototyping, Video and Image-Processing Pipelines, Legacy Embedded System Integration.
Industrial Control and Automation
EP20K600CF672C8 fits industrial control and automation designs that must connect many sensors, actuators, motion controllers, and supervisory interfaces. Its 508 user I/O provides substantial parallel connectivity, while 24,320 logic elements can host state machines, protocol handlers, interlocks, and data-format conversion. The 311,296 RAM bits can support buffering and lookup operations. Use the device between field-level signals and a controller or communications backplane, with careful input filtering, output isolation, and fault handling. The published 0 C to 85 C range suits many controlled industrial environments, but the verified data does not establish an industrial qualification, vibration rating, or long-term availability commitment. Validate those requirements independently.
Recommandé
Communications Interface Aggregation
EP20K600CF672C8 is suitable for communications equipment that combines several slower interfaces into a higher-speed domain. The 508 user I/O count can terminate numerous parallel or serialized channels, and the 24,320 logic elements can implement framing, channel coding, buffering, and protocol adaptation. Embedded RAM totaling 311,296 bits can reduce external buffering for selected data paths. Place the FPGA at the boundary between physical-layer devices and a processor or packet processor, using source-synchronous clocking where appropriate and constraining setup, hold, and skew in the design tool. The retrieved data reports 1.48 ns propagation delay, but it does not provide maximum clock frequency or receiver-transmitter limits. Use the manufacturer timing tables before closing the interface budget.
Recommandé
Test and Measurement Equipment
EP20K600CF672C8 can serve in test and measurement platforms that require parallel acquisition, stimulus sequencing, trigger logic, and deterministic control. With 508 user I/O, the device can interface to ADC and DAC control lines, relays, counters, and instrument buses. Its 24,320 logic elements support timing generators, encoders, decoders, and protocol monitoring, while 311,296 RAM bits provide storage for capture windows, coefficients, or lookup tables. Implement the FPGA as a timed acquisition or stimulus engine and place the instrument front end on controlled impedance routes. The reported 0 C to 85 C operating range is useful for bench and controlled equipment, but calibration, measurement accuracy, and long-term stability depend on the complete signal chain. Exact analog supply and timing limits require the official datasheet.
Recommandé
High-Density Digital Prototyping
EP20K600CF672C8 supports high-density digital prototypes that need to emulate interfaces, test algorithms, or bridge development hardware before ASIC or production deployment. The combination of 24,320 logic elements and 311,296 RAM bits provides more implementation headroom than a small CPLD, while 508 user I/O permits rapid connection to legacy buses and evaluation fixtures. Use the FPGA for architecture validation, real-time debug, and firmware-assisted logic iteration. Reprogramming workflows, configuration storage, and tool support must be confirmed because the supplied web data does not identify the current design software or device-programming requirements. Treat the BGA package as a prototype-layout commitment: use the official land pattern, maintain escape-room for all balls, and provide test points for configuration, clocks, resets, and critical buses.
Recommandé
Video and Image-Processing Pipelines
EP20K600CF672C8 can support image-processing pipelines where multiple video or camera interfaces must be captured, formatted, and routed to a display or processor. Its 508 user I/O helps accommodate parallel pixel buses, control signals, and synchronization inputs, while 24,320 logic elements can implement line buffers, color conversion, timing generation, and overlay functions. The 311,296 RAM bits are useful for small frame or line buffers, although memory depth and bandwidth must be checked against the selected image format and resolution. Use controlled-impedance routing, matched clock distribution, and careful timing constraints for pixel buses. The available web data does not establish supported video standards, maximum pixel clock, or transceiver capability, so the design cannot assume a particular video interface without a manufacturer reference design.
Recommandé
Legacy Embedded System Integration
EP20K600CF672C8 is appropriate for legacy embedded systems that need a configurable bridge between obsolete processors, memory devices, and modern peripherals. The FPGA can translate bus widths, clock domains, interrupt structures, and protocol timing while presenting 508 available I/O for glue-less integration. Its 24,320 logic elements can host state machines, FIFOs, and address decoders, and 311,296 RAM bits can assist small buffers or register maps. Place the device between the legacy bus and the replacement subsystem, with isolation and bus-hold considerations for inactive signals. The retrieved data does not verify configuration-method compatibility, I/O voltage details, or supported memory interfaces, so review the legacy board schematic and official electrical tables before implementation. The RoHS non-compliant listing also matters when the system has environmental-material constraints.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K600CF672C8 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K600CF672C7N | EP20K600CF672C7ES | EP20K600CF672C7 | EP20K600CF672C6 | EP20K600CF672C-8 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA, 27 mm x 27 mm | 672-FBGA class | 672-FBGA class | 672-FBGA class | 672-FBGA class | 672-FBGA class |
Principaux différenciateurs
- High published user-I/O capacity (vs EP2A25F672C7)
- Large embedded memory resource (vs EP20K600CF672C7)
- Documented logic capacity (vs EP20K600CF672C6)
- Commercial-temperature published range (vs EP20K600CF672C-8)
Notes de conception
Use the official Intel or Altera 672-ball land pattern rather than relying on conflicting secondary package descriptions. The supplied sources contain a 672-FBGA 27 mm by 27 mm listing and a separate 652-pin, 45 mm by 45 mm description. Confirm the package drawing before footprint generation, pin escape, paste-mask definition, assembly stencil, and inspection criteria. BGA implementation should include enough via and routing escape room for every ball and should keep power, ground, clocks, and critical I/O on the shortest practical paths.
The retrieved listing reports a 1.71 V to 1.89 V device supply range, but the manufacturer datasheet is required to identify every rail, tolerance, current limit, sequencing condition, and decoupling value. Do not treat the listed range as sufficient to design the power tree. Use the official recommended capacitors, place local high-frequency bypass at the associated balls, provide a low-impedance ground return, and verify startup and shutdown behavior. Add test access for each rail and configuration signal so assembly and field diagnostics are possible without depopulating the FPGA.
The verified data does not provide a thermal resistance, maximum junction temperature, or power-consumption curve for EP20K600CF672C8, so a numerical thermal estimate would be fabrication. Before layout release, obtain the manufacturer thermal model and calculate worst-case dissipation from the intended logic utilization, clock tree, I/O switching, and supply currents. Use the package body's exposed or internal thermal features only as directed by the official drawing. Provide copper spreading where allowed, avoid thermal bottlenecks in the via field, and verify junction and case temperatures under production corner conditions.
The 508-I/O interface capacity makes controlled-impedance routing and return-path continuity especially important. Classify clocks, high-speed buses, and low-speed controls separately, then apply the FPGA's official I/O standards, drive strengths, termination guidance, and timing constraints. Maintain continuous reference planes across layer transitions, avoid stubs where possible, and use matched clock and data routing for source-synchronous interfaces. The retrieved sources do not provide maximum clock frequency or I/O timing limits, so timing closure must rely on the manufacturer timing model rather than the 1.48 ns propagation-delay listing alone.
Do not assume that a same-package APEX-20K ordering code is automatically a drop-in replacement. Speed grade, temperature grade, pin options, configuration behavior, I/O standards, and package construction must be checked against the exact device ordering information. The cross-reference data only identifies broad package and I/O similarities for named devices. A substitution board review should compare every used pin, unused-pin treatment, power rails, decoupling, clock resources, configuration interface, and timing constraint before approving a new MPN.
Informations de conformité
The supplied Altera-focused result explicitly reports RoHS non-compliant. REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals status are not established in the verified web data.
