EP20K600EFC672-1XN - APEX 20K 600K Gates FPGA, 672-BGA | Intel
Référence : EP20K600EFC672-1XN ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $395 | $3 950,00 |
| 100 | $360 | $36 000,00 |
| 500 | $320 | $160 000,00 |
| 1 000 | $285 | $285 000,00 |
EP20K600EFC672-1XN Présentation
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that combines configurable logic blocks, programmable interconnect, and I/O cells on a single silicon die. As a leading-edge platform at the time of its release, the APEX 20K family bridged classic CPLDs and high-end FPGAs by embedding Look-Up Tables (LUTs), Embedded System Blocks (ESBs) for memory, and dedicated clock management. In the broader hierarchy, FPGAs sit within programmable logic devices, which in turn are part of the integrated circuit family used for digital logic implementation.
Key features include multi-core architecture supporting both registered and combinatorial operations, built-in PLLs for clock synthesis, embedded array blocks for high-density memory, and JTAG-based IEEE 1149.1 boundary-scan test support. The device supports in-system programmability via the Altera ByteBlaster or MasterBlaster download cables, and configuration can be loaded from serial or parallel EPROMs at power-up. With 508 user I/O pins, the EP20K600EFC672-1XN supports LVTTL, LVCMOS, SSTL, and GTL+ I/O standards for flexible system design.
Typical applications include high-speed telecommunications equipment, networking line cards, ASIC prototyping, complex DSP datapaths, and embedded computing platforms. The 672-BGA package enables dense PCB layouts for designs requiring maximum logic density per square inch. The device has been widely adopted in industrial control systems and legacy telecom infrastructure where the APEX 20K family's proven Quartus design flow remains in active use.
When designing with this part, ensure the PCB footprint matches the 672-ball FineLine BGA land pattern exactly, including the 1.0 mm ball pitch. Power decoupling requires at least 12 low-ESR capacitors distributed around the package perimeter to suppress simultaneous switching noise across the 508 I/O banks.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP20K600EFC672-1XN — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP20K600EFC672-1XN (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Process Technology, Speed Grade, System Gates.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP20K600EFC672-1X
✅ Remplacement direct✓ En stock
$980 / unité
Voir la fiche technique →EP20K600EFC672-2N
✅ Remplacement direct✓ En stock
$158 / unité
Voir la fiche technique →EP20K600EFC672-1N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP20K400EFC672-1XN
✅ Remplacement direct✓ En stock
$215 / unité
Voir la fiche technique →EP20K600CF672-1X
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$95 / unité
Voir la fiche technique →EP20K600EFC672-1XN Valeurs maximales et caractéristiques électriques
| Family | APEX 20K (APEX-20KE) |
| System Gates | 1,560,000 (typical 600K) |
| Logic Elements | 24,320 |
| Typical Logic Elements | 311,296 |
| Macros (Logic Array Blocks) | 2,432 |
| User I/O Pins | 508 |
| Boîtier | 672-ball FineLine BGA (FBGA) |
| Ball Pitch | 1.0 mm |
| Process Technology | 0.18 micron CMOS |
| Supply Voltage (Core) | 1.8 V typical |
| Température de fonctionnement | 0C to 85C (commercial) |
| Speed Grade | -1 (fastest) |
| Configuration Method | Serial or parallel, JTAG |
| Type de montage | Surface Mount (BGA) |
Configuration des broches de EP20K600EFC672-1XN
| Broche A1 | I/O — User I/O pin (bank 1) |
| Broche A2 | I/O — User I/O pin (bank 1) |
| Broche B1 | I/O — User I/O pin (bank 1) |
| Broche B2 | GND — Ground |
| Broche C1 | VCCIO — I/O supply voltage |
| Broche C2 | VCCINT — Core supply voltage 1.8V |
Applications typiques
EP20K600EFC672-1XN convient pour 6 applications: Telecommunications Line Cards, ASIC Prototyping, Networking and Router Equipment, Embedded Computing Platforms, Digital Signal Processing (DSP) Datapaths, Industrial Control Systems.
Telecommunications Line Cards
The EP20K600EFC672-1XN's 600K system gates and 508 user I/O pins make it ideal for high-density telecom line card designs requiring parallel data path processing. With 24,320 logic elements and embedded array blocks, it supports complex framers, mappers, and protocol converters in SDH/SONET or ATM infrastructure. The 672-BGA FineLine package enables compact line card layouts where PCB real estate is constrained. Its LVTTL and LVCMOS I/O standards interface directly to serializer/deserializer chips and network PHYs without external level shifters, reducing BOM cost and improving signal integrity on high-speed parallel buses.
Recommandé
ASIC Prototyping
The EP20K600EFC672-1XN serves as a high-capacity prototyping vehicle for ASIC designs up to 600K gates, providing fast design iteration before committing to mask production. Its 2,432 macros and embedded memory blocks map efficiently to large ASIC RTL, allowing designers to validate functionality, timing margins, and system integration. Quartus II design flow supports incremental compilation and timing-driven place-and-route, mirroring ASIC design methodology. The 672-BGA footprint also enables prototype-to-production PCB reuse when migrating validated designs into lower-cost ASIC fabrication.
Recommandé
Networking and Router Equipment
With 508 user I/O pins and high logic density, the EP20K600EFC672-1XN supports router backplane interfacing, packet processing pipelines, and traffic management functions in legacy networking equipment. The device's embedded system blocks provide fast on-chip memory for lookup tables and FIFO buffers needed in switching fabrics. LVTTL/LVCMOS support allows direct connection to PHY devices and memory controllers, while the APEX 20K multi-core architecture handles parallel packet classification at line rate. Industrial temperature grade (0-85C) suits controlled-environment central office deployments.
Recommandé
Embedded Computing Platforms
The EP20K600EFC672-1XN provides the logic capacity and I/O flexibility required for custom embedded computing systems, including industrial controllers, test and measurement equipment, and military/aerospace subsystems. Its 672-BGA FineLine package delivers high pin density for designs interfacing to DDR memory, parallel ADC/DAC converters, and custom peripheral buses. The APEX 20K family's proven reliability and long-term availability through specialty distributors make it suitable for legacy systems with multi-year deployment cycles requiring sustained production runs.
Recommandé
Digital Signal Processing (DSP) Datapaths
The EP20K600EFC672-1XN supports high-speed DSP datapaths including FIR filters, FFT processors, and custom codec implementations through its abundant logic and embedded multipliers when paired with companion ICs. Its 508 I/O pins accommodate wide data buses for streaming DSP applications in audio processing, video preprocessing, and software-defined radio baseband. The device's PLLs provide flexible clock synthesis for multi-rate DSP systems, while embedded memory blocks enable efficient coefficient storage and sample buffering without external memory accesses.
Recommandé
Industrial Control Systems
The EP20K600EFC672-1XN is widely deployed in industrial automation, motor control, and process control systems where deterministic logic response and high I/O count are required. Its 508 user I/O pins support multiple sensor interfaces, encoder inputs, and actuator drive signals in a single device, reducing board complexity. The APEX 20K family's long-term availability through industrial channels and proven reliability in factory environments make it a preferred choice for legacy PLC and CNC controller designs that must remain in production for decades.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP20K600EFC672-1XN — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP20K600EFC672-1X | EP20K600EFC672-2N | EP20K400EFC672-1XN |
|---|---|---|---|---|
| Package | 672-BBGA FineLine | 672-BBGA FineLine (same) | 672-BBGA FineLine (same) | 672-BBGA FineLine (same) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| System Gates | 600K typical (1.56M max) | 600K typical (1.56M max) | 600K typical (1.56M max) | 400K typical (1.05M max) |
| Logic Elements | 24,320 | 24,320 | 24,320 | 16,640 |
| User I/O Pins | 508 | 508 | 508 | 488 |
| Speed Grade | -1 (fastest) | -1 (fastest) | -2 (slower) | -1 (fastest) |
| Lead Finish | Lead-free (N suffix) | Leaded (SnPb) | Lead-free (N suffix) | Lead-free (N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Principaux différenciateurs
- Highest logic density in APEX 20K family with 672-BGA footprint (vs EP20K400EFC672-1XN)
- Lead-free RoHS-compliant finish (vs EP20K600EFC672-1X)
- Fastest -1 speed grade for timing-critical paths (vs EP20K600EFC672-2N)
Notes de conception
The 672-ball FineLine BGA requires a 1.0 mm ball pitch PCB land pattern with non-solder mask defined (NSMD) pads for best reliability. Use at least 12 low-ESR decoupling capacitors (0.1uF and 10uF combination) distributed around the package perimeter to suppress simultaneous switching noise across 508 I/O banks. Microvia-in-pad technology is recommended for inner-row balls to ensure reliable BGA soldering. Maintain 4-6 PCB layers with dedicated ground and power planes adjacent to the device for signal integrity and power delivery.
At full utilization with 508 I/O switching simultaneously at 100 MHz, the EP20K600EFC672-1XN can dissipate 3-5W. The FineLine BGA package requires thermal vias under the central ball grid to conduct heat to internal copper planes. Without thermal management, junction temperatures can exceed 100C in enclosed industrial environments. Recommended: thermal via array of at least 9 vias per cm2 under the die shadow, with inner-plane copper floods.
Do not assume 'drop-in compatibility' between APEX 20K and APEX 20KE families without verifying the configuration file compatibility. The -1XN suffix indicates APEX-20KE family (enhanced), which differs from APEX 20K in JTAG IDCODE and some configuration timing parameters. Verify MSEL pin strapping matches the desired configuration mode. For multi-device JTAG chains, ensure TDI/TDO ordering is correct or boundary-scan tests will fail. Always validate configuration with the Quartus II programmer before committing to production.
Informations de conformité
Lead-free finish indicated by 'N' suffix. RoHS compliance inferred from N-suffix convention per Altera part numbering. Other compliance attributes not stated in distributor listings.