EP1S25F672C8 - 25,660 LEs Stratix FPGA 672-BGA | Intel / Altera
Référence : EP1S25F672C8 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $652.85 | $652,85 |
| 10 | $620.21 | $6 202,10 |
| 100 | $587.56 | $58 756,00 |
| 500 | $555 | $277 500,00 |
| 1 000 | $525 | $525 000,00 |
EP1S25F672C8 Présentation
An FPGA (Field Programmable Gate Array) is a programmable logic device that combines the integration density of an Application-Specific Integrated Circuit (ASIC) with the design flexibility of software-configurable hardware. FPGAs sit at the top of the programmable logic hierarchy (FPGA > CPLD > programmable logic > digital semiconductor) and are widely used for parallel data-path processing, high-speed serial interfaces, and ASIC prototyping where time-to-market and field reconfigurability outweigh raw unit cost.
Key features of the EP1S25F672C8 include 25,660 logic elements organized into 2,566 Logic Array Blocks (LABs), dedicated on-chip memory blocks (TriMatrix memory), DSP blocks for high-throughput arithmetic, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates up to 40 high-speed transceiver channels in the Stratix family, providing multi-gigabit serial connectivity for communications and storage applications.
From an architecture standpoint, the Stratix family employs an LUT-based fabric with embedded RAM and multiplier blocks. The 130 nm process and 1.5 V core deliver a balance of performance and power efficiency suitable for ASIC prototyping, communications infrastructure, and high-performance digital signal processing where deterministic latency and parallel execution are required.
Typical applications include ASIC prototyping, telecom line-card design, video and image processing pipelines, military/aerospace signal processing, and high-speed serial interface bridging. The 672-pin BGA package supports the high I/O count needed for memory and bus interfaces in these demanding systems.
When designing with the EP1S25F672C8, ensure the PCB layout follows BGA escape routing best practices and that decoupling capacitors are placed close to each power pin per the Stratix pin connection guidelines. Configuration via JTAG or an Altera configuration device must be planned at the board level.
This page synthesizes distributor pricing from 19 active sources, drop-in alternatives from the same Stratix family and competitor equivalents, and practical design considerations not aggregated on a single datasheet page.
Alternatives de remplacement direct pour EP1S25F672C8 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S25F672C8 (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Configuration Method, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S25F672C7N
✅ Remplacement direct✓ En stock
$535 / unité
Voir la fiche technique →EP1S25F672C7
✅ Remplacement direct✓ En stock
$595 / unité
Voir la fiche technique →EP1S25F672C6N
✅ Remplacement direct✓ En stock
$192.75 / unité
Voir la fiche technique →EP1S25F672C6
✅ Remplacement direct✓ En stock
$125 / unité
Voir la fiche technique →EP1S25F672C5N
✅ Remplacement direct✓ En stock
$142 / unité
Voir la fiche technique →EP1S25F672C8 Valeurs maximales et caractéristiques électriques
| Family | Stratix |
| Logic Elements | 25,660 |
| Logic Array Blocks (LABs) | 2,566 |
| User I/Os | 473 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Maximum Operating Frequency | 357.14 MHz |
| Boîtier | 672-ball FineLine BGA (FBGA) |
| Package Dimensions | 35 x 35 mm, 1.27 mm pitch |
| Speed Grade | C8 (commercial, -8) |
| Température de fonctionnement | 0 C to +85 C (commercial) |
| Type de montage | Surface Mount |
| Logic Family | CMOS |
| Configuration Method | JTAG / Altera configuration device |
Guide de configuration des broches du EP1S25F672C8 35 x 35 mm, 1.27 mm pitch
Configuration des broches du EP1S25F672C8 (boîtier 35 x 35 mm, 1.27 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1S25F672C8.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1S25F672C8 convient pour 7 applications: ASIC Prototyping, Telecom Line-Card Design, Video and Image Processing Pipelines, Military and Aerospace Signal Processing, High-Speed Serial Interface Bridging, Industrial Control and Automation, Legacy Storage System Design.
ASIC Prototyping
The EP1S25F672C8 fits ASIC prototyping because its 25,660 logic elements provide sufficient capacity to map mid-complexity ASIC RTL into a real, measurable FPGA target. Designers can validate timing, power, and I/O behavior before committing to silicon, reducing respin risk. The 672-BGA package supports up to 473 user I/Os, which is more than enough for ASIC prototyping boards with DDR memory buses and parallel chip-to-chip interfaces. Compared to a fixed-function ASIC, the FPGA fabric gives the engineering team the ability to iterate RTL changes in hours rather than weeks. The C8 commercial speed grade is suitable for lab validation, though production prototypes targeting faster timing closure typically migrate to the C6 or C7 bins.
Recommandé
Telecom Line-Card Design
Telecom line cards need high logic density and many I/Os for framer, mapper, and traffic-manager functions, and the EP1S25F672C8 provides 25,660 LEs in a 672-BGA package with 473 user I/Os to support those parallel data paths. The integrated DSP blocks accelerate Reed-Solomon, FEC, and CRC operations common in SONET/SDH and Ethernet line cards. The 130 nm process and 1.5 V core keep dynamic power manageable for always-on telecom infrastructure. The C8 speed grade is appropriate for backplane speeds in the 100-200 MHz range typical of legacy line-card designs.
Recommandé
Video and Image Processing Pipelines
The EP1S25F672C8 is well suited to video processing because its TriMatrix on-chip memory and dedicated DSP blocks deliver the parallelism required for real-time pixel pipelines, deinterlacers, and scaling engines. The 473 user I/Os accept wide parallel video buses from external video ADCs and drive DDR memory for frame buffering. 25,660 logic elements support multi-tap filters and motion-estimation kernels in broadcast and surveillance applications. The 130 nm Stratix fabric is widely cited in legacy video reference designs from Altera's broadcast development kit family.
Recommandé
Military and Aerospace Signal Processing
For military and aerospace signal-processing applications, the EP1S25F672C8 offers the logic density and DSP throughput needed for radar pulse compression, electronic-warfare demodulation, and software-defined-radio baseband chains. Designers often select the EP1S25 family because of its maturity, extensive reference designs, and availability of industrial-temperature variants (EP1S25B672) for rugged environments. The 672-BGA package supports high-bandwidth data converters and external SRAM interfaces. Note that for true military/aerospace programs, the EP1S25F672I (industrial) or EP1S25B672C (military-temp) speed grades are typically required.
Recommandé
High-Speed Serial Interface Bridging
The EP1S25F672C8 is suitable for high-speed serial bridging because the Stratix family integrates dedicated transceiver channels supporting multi-gigabit serial protocols. Designers use the device to bridge between legacy parallel buses and serial backplanes, or to aggregate lower-speed links onto a higher-speed uplink. The 25,660 logic elements comfortably fit serializer/deserializer, clock-data-recovery, and protocol-state-machine functions. The 672-BGA package supplies the power and ground pins required by the high-speed transceivers to meet jitter budgets.
Recommandé
Industrial Control and Automation
The EP1S25F672C8 supports industrial control designs by combining 25,660 LEs of programmable logic with 473 user I/Os for sensor aggregation, motor-control loop timing, and safety-logic integration. The TriMatrix memory blocks implement deterministic buffer pools required for closed-loop control, and the DSP blocks accelerate field-oriented control algorithms. The commercial 0 to +85 C operating range covers most factory-floor enclosures; for harsher environments, designers specify the EP1S25B672 industrial-temperature variant.
Recommandé
Legacy Storage System Design
The EP1S25F672C8 is frequently retained in legacy storage controller designs (RAID, SAN switches, storage accelerators) where the Stratix fabric handles parallel data-path processing and protocol bridging. Its 25,660 logic elements and on-chip memory absorb the buffer-management and XOR-acceleration logic typical in RAID-6 implementations. The 672-BGA footprint and 473 I/Os connect to multiple SATA/SAS PHYs and DDR-II memory channels. For new designs, Intel recommends Stratix V or Cyclone V, but the EP1S25 remains a common BOM entry in long-lifecycle storage platforms.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S25F672C8 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S25F672C7N | EP1S25F672C7 | EP1S25F672C6N | EP1S25F672C6 | EP1S25F672C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 672-ball FineLine BGA (FBGA) | 672-ball FineLine BGA (FBGA) - same | 672-ball FineLine BGA (FBGA) - same | 672-ball FineLine BGA (FBGA) - same | 672-ball FineLine BGA (FBGA) - same | 672-ball FineLine BGA (FBGA) - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| LABs | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 | 2,566 |
| Speed Grade | C8 (-8) | C7N (-7, lead-free) | C7 (-7) | C6N (-6, lead-free) | C6 (-6) | C5N (-5, lead-free) |
| User I/Os | 473 | 473 | 473 | 473 | 473 | 473 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Process | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS | 130 nm CMOS |
| Operating Temperature | 0 C to +85 C (commercial) | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C | 0 C to +85 C |
| Lifecycle Status | Obsolete (legacy Stratix) | Obsolete (legacy Stratix) | Obsolete (legacy Stratix) | Obsolete (legacy Stratix) | Obsolete (legacy Stratix) | Obsolete (legacy Stratix) |
Principaux différenciateurs
- Multiple speed grades share the same 672-BGA footprint (vs EP1S25F780C7N)
- Mature Stratix reference-design ecosystem (vs Generic 130 nm FPGA)
- Higher I/O count than smaller-density Stratix devices (vs EP1S10F672C7N)
Notes de conception
The EP1S25F672C8's 672-ball FineLine BGA at 1.27 mm pitch demands via-in-pad or microvia escape routing on the PCB. Use a 4- or 6-layer stack-up with continuous power and ground planes to supply the 1.5 V core and I/O voltage rails. Per Stratix pin connection guidelines, place decoupling capacitors within 200 mils of each power pin, and use 0.1 uF / 0.01 uF / 10 uF combinations per the Quartus power-play tuner recommendations. Fan-out pattern must respect anti-pad clearances and use blind/buried vias if signal escape is congested under the BGA field.
Estimated: when migrating from C8 (this device) to C6 or C7 speed grades, expect approximately 15-25% faster Fmax on internal timing paths but identical logic utilization. Designers often forget to update the Quartus device-selection field, leaving the synthesis target as the slower C8 even after PCB re-spin, which loses the benefit of the higher speed grade. Always re-run the Quartus Fitter with the new device selection before tape-out. Also note that the C5N variant requires explicit Quartus timing-model verification because the -5 bin was a niche offering.
Estimated: at typical Stratix utilization of 70% logic + 60% memory + active transceivers, the EP1S25F672C8 dissipates approximately 5-8 W steady-state. With the 672-BGA's typical theta_JA of 15-20 C/W (depending on PCB stack-up and airflow), expect junction-temperature rises of 75-160 C above ambient. The commercial device is rated to 85 C ambient, so airflow or a heatsink is recommended if the design runs near full utilization. Do not confuse the EP1S25F672C8 (commercial, 0 to +85 C) with the EP1S25B672C8 (industrial/extended, -40 to +125 C) when calculating thermal margin.
Informations de conformité
EP1S25F672C8 is a legacy Altera / Intel Stratix FPGA. MSL Level, RoHS, REACH, and lead-free status were not present in the Verified Web Data; the C7/C6/C5 variants with the "N" suffix denote lead-free finishes per Altera ordering nomenclature. AEC-Q100 is not applicable (FPGA, not an automotive-qualified IC).