EP1S25F672C8N - Stratix 25K LE FPGA, 672-FBGA, 1.5V | Intel
Référence : EP1S25F672C8N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $276 | $276,00 |
| 10 | $248.4 | $2 484,00 |
| 100 | $220.8 | $22 080,00 |
| 500 | $193.2 | $96 600,00 |
| 1 000 | $179.4 | $179 400,00 |
EP1S25F672C8N Présentation
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows engineers to implement arbitrary digital logic through SRAM-based configuration cells. Within the broader taxonomy, an FPGA belongs to programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix family was Intel's (formerly Altera's) first high-end FPGA family built on a 1.5 V core, introducing embedded TriMatrix memory, DSP blocks, and high-speed transceivers in a single fabric. These architectural elements positioned Stratix as the predecessor to Stratix II, III, and the modern Stratix 10 families.
Key features of the EP1S25F672C8N include 25,660 logic elements (LEs), 1,944 Kbit of embedded RAM (in three memory block sizes), twelve embedded DSP blocks optimized for multiplication and multiply-accumulate operations, six phase-locked loops (PLLs), and up to 426 user I/O pins depending on the package's I/O bank count. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, with eight I/O banks that allow flexible voltage reference selection.
Architecturally, the Stratix core combines a multi-level routing hierarchy (LAB, MegaLAB) with embedded memory, multipliers, and PLL resources distributed throughout the fabric. The 1.5 V core is paired with selectable I/O voltages per bank via VREF pins, allowing the same die to interface with 1.5 V, 1.8 V, 2.5 V, or 3.3 V peripherals without level shifters. The configuration scheme supports passive serial (PS), passive parallel synchronous/asynchronous (PPS/PPA), JTAG, and Altera's EPC configuration devices.
Typical applications include high-throughput digital signal processing (software-defined radio, video processing), custom protocol bridging and packet processing in telecom line cards, ASIC prototyping and emulation, high-speed data acquisition front-ends, and industrial imaging pipelines. The DSP-rich fabric makes it particularly attractive for digital filters, FFT engines, and baseband processing in mid-2000s-generation designs.
When designing with this part, verify Quartus II version support for the EP1S25 family before starting firmware work. Modern toolchains (Quartus II v13.x) still support Stratix but may not include the latest security patches; users targeting new designs should evaluate Stratix II or Cyclone IV for active tool support, while existing EP1S25 boards may rely on legacy Quartus flows for long-term maintenance.
This page synthesizes distributor stock, parametric comparisons against other Stratix density points, and practical design notes (decoupling, JTAG, configuration) not consolidated on any single manufacturer or distributor page.
Alternatives de remplacement direct pour EP1S25F672C8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP1S25F672C8N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Configuration Method, Speed Grade, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP1S25F672C7N
✅ Remplacement direct✓ En stock
$535 / unité
Voir la fiche technique →EP1S25F672C6N
✅ Remplacement direct✓ En stock
$192.75 / unité
Voir la fiche technique →EP1S25F672I8N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP1S25F672C5N
✅ Remplacement direct✓ En stock
$142 / unité
Voir la fiche technique →EP1S25F672C8
✅ Remplacement direct✓ En stock
$525 / unité
Voir la fiche technique →EP1S25F672C8N Valeurs maximales et caractéristiques électriques
| Family | Stratix (EP1S) |
| Logic Elements (LE) | 25,660 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| Embedded Memory | 1,944 Kbit (TriMatrix) |
| DSP Blocks | 12 (9-bit x 9-bit multipliers) |
| PLLs | 6 |
| Maximum User I/O | 426 |
| Température de fonctionnement | 0 °C to 85 °C (commercial) |
| Speed Grade | C8 (-8) |
| Package Type | 672-ball FineLine BGA (FBGA) |
| Package Dimensions | 35 x 35 mm, 1.27 mm pitch |
| Logic Family | CMOS |
| Maximum Internal Frequency | 357.14 MHz |
| Configuration | Passive Serial / Passive Parallel / JTAG / EPC device |
| Statut RoHS | Compliant (lead-free N suffix) |
| Origin | Altera (acquired by Intel, 2015) |
Guide de configuration des broches du EP1S25F672C8N 35 x 35 mm, 1.27 mm pitch
Configuration des broches du EP1S25F672C8N (boîtier 35 x 35 mm, 1.27 mm pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP1S25F672C8N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP1S25F672C8N convient pour 6 applications: Software-Defined Radio (SDR) Baseband, Digital Video Processing / Image Pipeline, Telecom Line-Card Protocol Bridging, ASIC Prototyping and Emulation, High-Speed Data Acquisition Front-End, Industrial Control and Factory Automation.
Software-Defined Radio (SDR) Baseband
The EP1S25F672C8N fits mid-tier SDR baseband pipelines because its 12 DSP blocks and 25,660 LEs deliver sufficient multiply-accumulate throughput for 10-50 MHz channel bandwidths while the 1,944 Kbit of TriMatrix memory holds FFT scratch state without external SRAM. Designers place the FPGA between a wideband ADC and a host CPU, configuring FFT and channelization filters in the DSP blocks and FIFOs in M4K blocks. Compared with a DSP processor approach, this FPGA scales to multiple simultaneous channels at the cost of higher unit price and Quartus II design complexity. The commercial 0-85 °C range suits bench and indoor equipment; outdoor deployments must migrate to the EP1S25F672I8N variant.
Recommandé
Digital Video Processing / Image Pipeline
The EP1S25F672C8N handles real-time video processing because its 1,944 Kbit of embedded memory stores multiple video frame lines and its 12 DSP blocks accelerate 2D filter convolution. The 672-ball FBGA exposes up to 426 user I/O, enough to drive parallel camera interfaces, DDR memory buses, and HDMI/DVI output bridges in parallel. The 1.5 V core plus selectable I/O bank voltages (1.5/1.8/2.5/3.3 V) lets the same die interface with both legacy 3.3 V image sensors and modern 1.8 V DDR. Use the M-RAM blocks for line buffers to minimize off-chip memory cost.
Recommandé
Telecom Line-Card Protocol Bridging
Telecom line cards in the Stratix era used the EP1S25F672C8N as a glue logic + packet processor between TDM framer ASICs and Ethernet MACs. The 25,660 LEs provide generous logic capacity for custom HDLC/PPP/ML-PPP framers while the six PLLs generate multiple independent clock domains from a single backplane reference. The 672-ball BGA's 426 I/O support dense parallel TDM buses plus Ethernet GMII without external muxing. For new designs Intel recommends Stratix V or Cyclone 10, but legacy line cards remain in service and the EP1S25F672C8N continues to source from aftermarket distributors.
Recommandé
ASIC Prototyping and Emulation
With 25,660 LEs and 1,944 Kbit of embedded memory the EP1S25F672C8N fits mid-complexity ASIC prototyping where multiple FPGAs are not yet required. Designers partition the ASIC RTL across several EP1S25 devices using the LVDS-capable I/O pins for chip-to-chip bridging, and exploit the device's six PLLs to deskew clocks across the prototype board. Compared to ASIC tape-out this is a low-NRE path but is limited to about 2-3 million ASIC gates per board. Quartus II 13.1 remains the last actively supported toolchain for the EP1S family.
Recommandé
High-Speed Data Acquisition Front-End
The EP1S25F672C8N suits high-speed data acquisition because the 12 DSP blocks execute FIR/CIC decimation filters in real time, the TriMatrix memory absorbs sample bursts, and the LVDS-capable I/O pins interface directly to high-speed ADCs without external buffers. The 1.5 V core and 0-85 °C commercial range suit bench instruments; the industrial variant EP1S25F672I8N extends to field-deployed acquisition units. Common configurations acquire 12-16 bit ADC data at 100-200 MSPS and either store to DDR2 memory or stream via Ethernet.
Recommandé
Industrial Control and Factory Automation
Factory automation systems integrate the EP1S25F672C8N as a flexible controller for multi-axis motion, custom real-time Ethernet protocols, or vision-guided robotics. The 12 DSP blocks accelerate PID loops and motor commutation calculations, the 1,944 Kbit memory buffers sensor data bursts, and the 426 user I/O handle dozens of encoder, GPIO, and communication links. For harsh industrial environments select the EP1S25F672I8N industrial variant. Modern factory automation now uses Intel Cyclone IV/V or Xilinx Zynq SoCs, but legacy Stratix-based PLCs remain in service with 10+ year lifecycles.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP1S25F672C8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP1S25F672C7N | EP1S25F672C6N | EP1S25F672I8N | EP1S25F672C5N | EP1S25F672C8 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-ball FBGA, 35x35 mm | 672-ball FBGA, 35x35 mm | 672-ball FBGA, 35x35 mm | 672-ball FBGA, 35x35 mm | 672-ball FBGA, 35x35 mm | 672-ball FBGA, 35x35 mm |
| Logic Elements | 25,660 LE | 25,660 LE | 25,660 LE | 25,660 LE | 25,660 LE | 25,660 LE |
| Speed Grade | -8 (357 MHz Fmax) | -7 (~420 MHz Fmax) | -6 (~300 MHz Fmax) | -8 (357 MHz Fmax) | -5 (~250 MHz Fmax) | -8 (357 MHz Fmax) |
| Temperature Grade | Commercial (0-85 °C) | Commercial (0-85 °C) | Commercial (0-85 °C) | Industrial (-40 to 100 °C) | Commercial (0-85 °C) | Commercial (0-85 °C) |
| RoHS Compliant | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | No (leaded) |
| Embedded Memory | 1,944 Kbit | 1,944 Kbit | 1,944 Kbit | 1,944 Kbit | 1,944 Kbit | 1,944 Kbit |
| DSP Blocks | 12 | 12 | 12 | 12 | 12 | 12 |
| Approx. Unit Price (qty 1) | US $276 | US $310-$340 (faster grade premium) | US $240-$260 | US $300-$320 | US $220-$240 | US $260-$280 (leaded) |
Principaux différenciateurs
- Same silicon die as EP1S25F672C7N, EP1S25F672C6N, EP1S25F672C5N, EP1S25F672I8N - only speed grade or temperature grade differs (vs EP1S25F672C7N)
- Industrial temperature option available in same package (vs EP1S25F672I8N)
- RoHS-compliant lead-free N suffix preserves drop-in compatibility with legacy leaded designs (vs EP1S25F672C8)
Notes de conception
Estimated: the EP1S25F672C8N draws approximately 1.5-2.5 W quiescent depending on configuration and clock rates, with dynamic current scaling with toggle rates. Provide at least six 0.1 µF decoupling capacitors within 5 mm of the package plus bulk 47-100 µF tantalum or polymer capacitors on each VCCINT and VCCIO rail. The 672-ball BGA's power/ground ball distribution requires a multi-layer PCB with dedicated power planes; never use signal-only routing layers for VCCINT. Per the Stratix Device Handbook, VCCINT must be 1.5 V ±5 % and VCCIO must be sequenced after VCCINT to avoid I/O latch-up during power-up.
The 672-ball FBGA at 1.27 mm pitch demands at least a 6-layer PCB with microvia or via-in-pad technology to escape the inner rows of balls. Inner ball rows are not accessible with through-hole vias on a 1.27 mm grid; use laser-drilled microvias stacked to inner signal layers. Maintain a continuous reference plane (GND) on layer 2 directly beneath the BGA to control impedance for LVDS pairs. Per Altera's Stratix hardware reference, route all differential pairs with 100 Ω differential impedance and length-match within 20 mil.
Common pitfalls: (1) selecting the EP1S25F672C8N for new designs - this part is obsolete and the latest Quartus II support is v13.1; for new builds choose Stratix II EP2S or Cyclone IV. (2) Confusing the 'C' commercial temperature code with 'I' industrial - they look identical but the electrical limits differ at temperature extremes. (3) Forgetting that the C8 speed grade has lower Fmax than C7 - if your design closes timing at C8 in one lot it may fail in a C6 lot. (4) Mixing EPC configuration device families - older EPC1/EPC2 devices only support 5 V tolerance which the 1.5 V core does not have natively.
Estimated: at full utilization (90 % LE + 75 % DSP) the EP1S25F672C8N can dissipate 3-5 W. The 672-ball BGA's exposed thermal balls (if present in the package variant) must be soldered to a thermal pad on the PCB connected to the inner ground plane with thermal vias (typically 9-16 vias under the pad). Without thermal vias the junction-to-ambient thermal resistance (θJA) exceeds 15 °C/W, causing the device to throttle or fail in commercial-temp applications. Always attach a heatsink or forced-air cooling when continuous internal clock rates exceed 300 MHz.
Informations de conformité
N suffix denotes lead-free RoHS-compliant package finish. The Stratix (EP1S) family is not AEC-Q100 qualified - use the EP1S25F672I8N industrial variant for automotive-adjacent applications only, never for safety-critical systems. Halogen-free status not explicitly stated in datasheet excerpts reviewed.