EP2A40F672C6 - APEX II FPGA, 40K LE, 672-pin FBGA | Altera / Intel
Référence : EP2A40F672C6 ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $162.5 | $1 625,00 |
| 100 | $138 | $13 800,00 |
| 500 | $119.75 | $59 875,00 |
| 1 000 | $105 | $105 000,00 |
EP2A40F672C6 Présentation
An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs / LEs), programmable interconnect, and I/O cells, all controlled by SRAM-based configuration memory. FPGAs sit at the apex of programmable logic in the taxonomy: programmable logic -> CPLD/FPGA -> logic IC -> integrated circuit. They are widely used for hardware acceleration, custom datapaths, glue logic, prototyping ASICs, and high-speed signal processing where the parallelism and reconfigurability of the silicon deliver orders-of-magnitude performance wins over general-purpose microcontrollers.
Key features of the APEX II family include embedded system blocks that can be configured as dual-port RAM, ROM, FIFO, CAM, or multiplier blocks; LVDS and LVTTL I/O support; a dedicated clock network with PLL support; and JTAG-based boundary-scan testing compliant with IEEE 1149.1. The EP2A40F672C6 in particular supports up to 12 high-speed clock networks, embedded array blocks optimized for datapath arithmetic, and a deterministic interconnect fabric aimed at high-utilization designs above 50K system gates.
Architecturally, APEX II combines look-up-table-based logic elements with embedded memory/multiplier blocks (MultiCore elements), enabling designers to implement wide datapaths, DSP functions, and packet-processing pipelines in a single device. The FineLine BGA-672 package provides dense, high-pin-count I/O for memory interfaces and multi-gigabit serial or parallel LVDS channels.
Typical applications include telecommunications line cards, high-speed packet classification, ASIC prototyping, image and video preprocessing pipelines, and industrial DSP controllers. The wide I/O count also suits memory-heavy designs such as deep FIFO buffers and multi-bank external memory controllers.
When designing with the EP2A40F672C6, note that the APEX II family has reached end-of-life and is no longer recommended for new designs. Designers should treat the part as long-term support only and prefer current-generation Intel/Altera FPGA families such as Cyclone IV/V, Arria, or Stratix for new projects, while reserving the EP2A40F672C6 for legacy board drop-in or repair.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers decide whether to source, replace, or redesign around the EP2A40F672C6.
Alternatives de remplacement direct pour EP2A40F672C6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2A40F672C6 (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Speed Grade, Logic Elements.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2A40F672C7
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$195 / unité
Voir la fiche technique →EP2A40F672C8
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$68 / unité
Voir la fiche technique →EP2A40F672I6
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP2A40F672C9
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$62 / unité
Voir la fiche technique →EP2A40B724C7
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$650 / unité
Voir la fiche technique →EP2A40F672C6 Valeurs maximales et caractéristiques électriques
| Family | APEX II |
| Device | EP2A40 |
| Logic Elements (typical) | 40,000 |
| Boîtier | 672-ball FineLine BGA (FBGA-672) |
| Speed Grade | C6 (commercial) |
| Température de fonctionnement | Commercial (0C to +85C) |
| Process Technology | 0.18-micron CMOS |
| Configuration Memory | SRAM-based |
| JTAG Support | Yes (IEEE 1149.1) |
| PLL Support | Yes |
| Type de montage | Surface Mount (BGA) |
| Lifecycle | Obsolete / EOL (per Intel/Altera product discontinuation notice) |
Guide de configuration des broches du EP2A40F672C6 672-ball fineline bga (fbga-672)
Configuration des broches du EP2A40F672C6 (boîtier 672-ball fineline bga (fbga-672)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2A40F672C6.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2A40F672C6 convient pour 6 applications: Telecommunications Line Cards, ASIC Prototyping and Emulation, High-Speed Packet Classification, Industrial DSP and Motor Control, Image and Video Preprocessing, Legacy Board Repair and Sustaining Engineering.
Telecommunications Line Cards
The EP2A40F672C6's 40,000 logic elements and embedded system blocks (ESBs) make it well suited to telecommunications line-card datapath functions. The 672-ball FineLine BGA package exposes the wide I/O count required for parallel bus connections to external SRAM/SDRAM, while the embedded memory blocks can be configured as dual-port RAM, FIFO, or CAM to implement packet buffers and lookup tables. Compared with general-purpose DSPs, the FPGA's parallel fabric delivers higher throughput on cell-processing and protocol-conversion tasks at line rates of 1-2.5 Gbps per channel.
Recommandé
ASIC Prototyping and Emulation
With approximately 40,000 logic elements and high-speed interconnect, the EP2A40F672C6 can serve as a building block in multi-FPGA ASIC prototyping platforms. Designers partition large ASIC RTL across multiple APEX II devices and use the LVDS-capable I/O for inter-FPGA hand-off. The JTAG-based configuration via IEEE 1149.1 enables rapid bring-up and incremental bitstream iteration, which is essential when prototyping million-gate ASICs before tape-out. The SRAM-based configuration also allows re-use of the same silicon for multiple ASIC projects.
Recommandé
High-Speed Packet Classification
The APEX II's embedded system blocks support content-addressable memory (CAM) configurations, making the EP2A40F672C6 suitable for ternary CAM-based packet classification engines on routers and switches. Designers can implement wide TCAM lookups directly in the FPGA fabric without external CAM devices, saving board space and power. At the C6 speed grade, the part supports core clock rates around 200+ MHz for combinational lookups, which is sufficient for multi-gigabit line-rate ACL and QoS classification.
Recommandé
Industrial DSP and Motor Control
The EP2A40F672C6's embedded multiplier blocks (in ESB configuration) and high-speed interconnect make it a fit for industrial multi-axis motor controllers and DSP pipelines. Engineers can implement multiple PID loops, space-vector modulators, and encoder interfaces in parallel logic, achieving sub-microsecond control-loop latency. The commercial temperature grade suits factory-floor enclosures, while the industrial variant (EP2A40F672I6) extends to outdoor and automotive under-hood applications.
Recommandé
Image and Video Preprocessing
The 40K-LE fabric and embedded memory blocks of the EP2A40F672C6 can absorb real-time image-processing kernels such as 2D convolutions, color-space conversion, and Sobel edge detection at video rates up to 1080p60. Each line buffer fits in a configured ESB block, while pixel-rate datapaths are implemented in LUTs feeding the embedded multipliers. Compared with a DSP processor running the same kernels, the FPGA delivers 5-10x throughput per watt, which is critical in surveillance and machine-vision enclosures.
Recommandé
Legacy Board Repair and Sustaining Engineering
Many telecom, military, and industrial systems shipped in the 2000s with EP2A40F672C6 on the BOM. As APEX II is now obsolete, the part's primary use today is repair and sustaining engineering of these deployed systems. Sourcing from authorized brokers with full traceability documentation is critical to avoid counterfeit parts, especially for safety-critical or long-lifecycle installations such as rail signaling, avionics, and medical imaging.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2A40F672C6 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2A40F672C7 | EP2A40F672C8 | EP2A40F672I6 | EP2A40F672C9 | EP2A40B724C7 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 672-ball FineLine BGA (FBGA-672) | 672-ball FineLine BGA (FBGA-672) - same | 672-ball FineLine BGA (FBGA-672) - same | 672-ball FineLine BGA (FBGA-672) - same | 672-ball FineLine BGA (FBGA-672) - same | 724-ball BGA - different ball map |
| Family / Logic Elements | APEX II / 40,000 LEs | APEX II / 40,000 LEs | APEX II / 40,000 LEs | APEX II / 40,000 LEs | APEX II / 40,000 LEs | APEX II / 40,000 LEs |
| Speed Grade | C6 (commercial, mid-speed) | C7 (slower) | C8 (slowest) | C6 (industrial temp) | C9 (fastest) | C7 (slower) |
| Operating Temperature | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C |
| Pin-Compatible Drop-In | Reference | Yes (same ball map) | Yes (same ball map) | Yes (same ball map) | Yes (same ball map) | No (724-ball, not 672) |
| Lifecycle Status | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL |
| Configuration Memory | SRAM (volatile, JTAG) | SRAM (volatile, JTAG) | SRAM (volatile, JTAG) | SRAM (volatile, JTAG) | SRAM (volatile, JTAG) | SRAM (volatile, JTAG) |
Principaux différenciateurs
- Mid-tier speed grade C6 balances timing margin and performance (vs EP2A40F672C7)
- Commercial temperature grade suits most indoor deployments (vs EP2A40F672I6)
- Same 672-ball FBGA footprint across speed grades enables PCB reuse (vs EP2A40B724C7)
Notes de conception
The EP2A40F672C6 uses a 672-ball FineLine BGA with a fine pitch (typically 1.0 mm). PCB layout must use microvia or via-in-pad technology to fan out the BGA balls to inner layers. Plan at least 4-6 PCB layers with continuous ground and power planes under the device to provide low-impedance return paths for high-speed signals and to dissipate the 0.18-micron CMOS core power.
Because APEX II uses SRAM-based configuration memory, the device loses its bitstream on power-down. A configuration PROM (EPC family) or microcontroller-based JTAG loader is required at every power-up. Failing to provide configuration memory will leave the device in an undefined state, and I/O pins may drive random values during configuration that can damage downstream devices.
Estimated: At typical APEX II utilization (60-70% LEs, 50% ESBs) and a 100 MHz core clock, the EP2A40F672C6 may dissipate 1.5-3 W depending on toggle rate. The FBGA-672 package requires a thermally enhanced PCB layout with thermal vias under the central ball grid to spread heat to inner copper planes. Designers should measure junction temperature in prototype builds before finalizing enclosure cooling.
APEX II supports LVDS and LVTTL I/O at speeds up to several hundred Mbps. Matched-length routing with controlled impedance (50 ohm single-ended, 100 ohm differential) is required for LVDS pairs. Use series termination at the FPGA driver and verify signal integrity with IBIS simulations before tape-out, especially for memory interfaces running above 100 MHz.
Informations de conformité
Compliance data not present in the verified web data for EP2A40F672C6. As an obsolete 0.18-micron APEX II part originally released in the early 2000s, the original factory lead-finish status is uncertain; sourced broker stock may be either leaded or lead-free depending on date code. Markers [DATA_NEEDED] apply to RoHS, REACH, lead-free, halogen-free, and conflict-minerals fields.