EP2AGX45DF29C5N - Arria II GX FPGA, 42K LE, 364 I/O | Intel
Référence : EP2AGX45DF29C5N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $720 | $720,00 |
| 10 | $685 | $6 850,00 |
| 100 | $620 | $62 000,00 |
| 500 | $560 | $280 000,00 |
| 1 000 | $510 | $510 000,00 |
EP2AGX45DF29C5N Présentation
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, interconnect, and I/O can be programmed by the end user after manufacture, sitting within the broader hierarchy of programmable logic devices (PLD) -> logic ICs -> integrated circuits (IC) -> semiconductors. The Arria II GX family specifically targets transceiver-rich mid-density applications where designers need hard-wired multi-gigabit serial channels alongside general-purpose FPGA fabric, balancing cost against performance for production volumes.
Key specifications include 18050 Adaptive Logic Modules (ALMs), up to 156 18x18 multipliers for DSP, embedded transceiver blocks supporting protocols such as PCIe Gen2, XAUI, Serial RapidIO, and Gbps Ethernet, and a -5C speed grade that places the device in the standard commercial performance bin. The 780-pin FC-BGA package uses 1 mm ball pitch and includes an exposed die for thermal dissipation, supporting industrial thermal envelopes with proper PCB layout.
Typical applications for the EP2AGX45DF29C5N include wireless baseband processing, software-defined radio front-ends, high-speed serial backplane aggregation, video encoding/decoding pipelines, and bridge chips for legacy bus standards. The combination of transceivers and rich logic makes it a frequent choice for prototyping 40 Gbps-class systems before committing to ASIC NRE.
Designers using this part should plan PCB layout for the 780-ball BGA early in the schematic phase, ensure decoupling capacitors cover all power rails (VCC, VCCPT, VCCA, VCCP), and use Altera/Intel Quartus II software with the Arria II GX device support installed. For designs that do not need the integrated transceivers, the smaller Arria II GZ (EP2AGZ45) variants may be considered.
This page synthesizes distributor pricing, drop-in Altera/Intel speed-grade and temperature alternatives, and practical design notes that are not found in the manufacturer datasheet alone. Engineers should cross-check the device handbook chapter for transceiver channel count and PLL availability before locking the bill of materials.
Alternatives de remplacement direct pour EP2AGX45DF29C5N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2AGX45DF29C5N (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Operating Temperature, Process Technology, Mounting Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2AGX45DF29C5G
✅ Remplacement direct✓ En stock
$335 / unité
Voir la fiche technique →EP2AGX45DF29C4N
✅ Remplacement direct✓ En stock
$335.45 / unité
Voir la fiche technique →EP2AGX45DF29C3N
✅ Remplacement direct✓ En stock
$178 / unité
Voir la fiche technique →EP2AGX45DF29C6N
✅ Remplacement direct✓ En stock
$175 / unité
Voir la fiche technique →EP2AGX45DF29I5N
✅ Remplacement direct✓ En stock
$318 / unité
Voir la fiche technique →EP2AGX45DF29C5N Valeurs maximales et caractéristiques électriques
| Family | Arria II GX |
| Series | EP2AGX45 |
| Device Type | FPGA - Field Programmable Gate Array |
| Number of Logic Elements (LE) | 42959 |
| Number of LABs / CLBs | 1805 |
| Adaptive Logic Modules (ALM) | 18050 |
| Total RAM Bits | 3517440 |
| Number of User I/Os | 364 |
| Boîtier / Format | 780-BBGA, FCBGA |
| Package Code | HBGA |
| Package Dimensions | 29 x 29 mm |
| Core Supply Voltage | 0.9 V |
| Process Technology | 40 nm CMOS |
| Speed Grade | -5 (C5) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead Free | Yes |
Guide de configuration des broches du EP2AGX45DF29C5N 29 x 29 mm
Configuration des broches du EP2AGX45DF29C5N (boîtier 29 x 29 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2AGX45DF29C5N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2AGX45DF29C5N convient pour 6 applications: PCIe Gen2 Endpoint / Bridge Card, Wireless Baseband & Software Defined Radio, Broadcast Video Processing Pipeline, High-Speed Serial Backplane Aggregation, ASIC Prototyping & Emulation, Industrial Motor Control & Automation.
PCIe Gen2 Endpoint / Bridge Card
The EP2AGX45DF29C5N's integrated hardened PCIe Gen2 hard IP blocks (up to x4 lanes at 5 Gbps) make it an excellent PCIe endpoint or bridge silicon. With 42,959 logic elements and 3,517,440 bits of embedded RAM, designers have ample fabric to implement custom DMA engines, scatter-gather logic, and protocol translation between PCIe and local buses. The -5 speed grade typically closes timing at 250 MHz fabric and 5 Gbps transceivers for moderate-complexity endpoints. The 364 user I/Os of the FC-FBGA-780 package provide abundant LVDS/LVTTL for memory interfaces (DDR2/DDR3) and side-band signals.
Recommandé
Wireless Baseband & Software Defined Radio
For SDR and wireless baseband processing, the EP2AGX45DF29C5N pairs dedicated 3.125 Gbps transceivers with 18x18 multipliers (up to 156 DSP blocks) and 3.5 Mbit embedded RAM. LTE PHY layer, digital up/down conversion, and channelization filters map efficiently onto the ALM fabric. The 0.9 V core supply keeps power reasonable for radio head designs where multiple FPGAs share a backplane. The FC-FBGA-780 footprint also exposes sufficient I/O for parallel ADC/DAC interfaces such as LVDS at hundreds of Msps, which is critical for direct-RF sampling front-ends.
Recommandé
Broadcast Video Processing Pipeline
Broadcast-grade video processing demands real-time pixel throughput, which the EP2AGX45DF29C5N supports via up to 364 I/Os and dedicated serializer/deserializer resources. Designers use the 3.5 Mbit embedded RAM as line buffers and motion-estimation scratchpad, while DSP blocks accelerate 2D filters, scaling engines, and deinterlacers. The -5 speed grade is sufficient for 3G-SDI and HDMI 1.4 video bridges operating at 148.5 MHz pixel clocks. The 29x29 mm FC-FBGA package fits mid-size video processing boards where multiple FPGAs handle ingest and playout channels in parallel.
Recommandé
High-Speed Serial Backplane Aggregation
Backplane aggregation cards benefit from the EP2AGX45DF29C5N's multiple 3.125 Gbps transceiver channels, which can be bonded for protocols such as XAUI (4x3.125 Gbps = 10 Gbps aggregate) or Serial RapidIO. The 42K LE fabric provides protocol processing, packet buffering (leveraging 3.5 Mbit embedded RAM), and switch-fabric glue logic between aggregated links. Industrial temperature variants (EP2AGX45DF29I5N) extend deployment to outdoor telecom cabinets. The FC-FBGA-780 footprint exposes enough I/O for management Ethernet, status LEDs, and rear-panel transceiver connections.
Recommandé
ASIC Prototyping & Emulation
The EP2AGX45DF29C5N's 42,959 logic elements, 3.5 Mbit embedded memory, and 364 user I/Os make it a strong candidate for ASIC prototyping platforms that need to map mid-complexity ASIC RTL to FPGA fabric. Designers can partition large ASIC designs across multiple Arria II GX FPGAs using the abundant transceiver bandwidth for chip-to-chip emulation links. The -5 speed grade provides sufficient Fmax for most ASIC target frequencies below 200 MHz. The FC-FBGA-780 footprint also enables prototyping boards with high I/O density for connecting to ASIC test fixtures.
Recommandé
Industrial Motor Control & Automation
Industrial motor drives and factory automation controllers leverage the EP2AGX45DF29C5N's high I/O count (364 pins) to interface with multiple encoder channels, resolver feedback, and isolated GPIO. The DSP blocks accelerate field-oriented control (FOC) math, while the embedded RAM serves as lookup tables for sinusoidal modulation and S-curve profiles. Industrial temperature variants (EP2AGX45DF29I5N) operate across -40C to +100C, suiting factory floor environments. The 0.9 V core combined with hardened PCIe enables integration into EtherCAT or PROFINET master controllers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2AGX45DF29C5N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2AGX45DF29C5G | EP2AGX45DF29C4N | EP2AGX45DF29C3N | EP2AGX45DF29C6N | EP2AGX45DF29I5N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | FC-FBGA-780 (DF29) 29x29 mm | FC-FBGA-780 (DF29) 29x29 mm - same | FC-FBGA-780 (DF29) 29x29 mm - same | FC-FBGA-780 (DF29) 29x29 mm - same | FC-FBGA-780 (DF29) 29x29 mm - same | FC-FBGA-780 (DF29) 29x29 mm - same |
| Speed Grade | -5 (C5) | -5 (C5) | -4 (C4) | -3 (C3) | -6 (C6) | -5 (C5) |
| Temperature Grade | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial |
| Logic Elements | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 | 42,959 |
| Embedded RAM Bits | 3,517,440 | 3,517,440 | 3,517,440 | 3,517,440 | 3,517,440 | 3,517,440 |
| User I/Os | 364 | 364 | 364 | 364 | 364 | 364 |
| Lifecycle Status | EOL | EOL | EOL | EOL | EOL | EOL |
| RoHS / Lead-Free Suffix | N suffix (lead-free) | G suffix (RoHS lead-free) | N suffix (lead-free) | N suffix (lead-free) | N suffix (lead-free) | N suffix (lead-free) |
Principaux différenciateurs
- Industry-standard -5 speed grade with full transceiver feature set (vs EP2AGX45DF29C6N)
- Industrial temperature option available in same footprint (vs EP2AGX45DF29I5N)
- Hardened PCIe Gen2 IP at 5 Gbps (vs EP2AGX45DF29C4N)
Notes de conception
The 780-ball FC-FBGA package at 1 mm ball pitch requires 4-6 layer PCB stackup with microvia or via-in-pad technology for breakout. Plan power decoupling early: place 0.1 uF X7R capacitors within 100 mil of every VCC/VCCA/VCCPT/VCCP pin pair. Use a continuous ground plane on layer 2 and a power plane on layer 3 to minimize inductance for the 0.9 V core rail, which can draw 3-5 A under full utilization.
Estimated: under typical workload (50% LE utilization, 8 active transceivers at 3.125 Gbps), the EP2AGX45DF29C5N dissipates approximately 4-6 W. The FC-FBGA-780 theta_JA of about 12 C/W (with proper thermal via array under the exposed die) requires a thermal via farm of at least 25 thermal vias to inner ground/power planes. Industrial variants (EP2AGX45DF29I5N) need a heatsink or chassis thermal coupling to stay below 100 C junction at +85 C ambient.
Do not confuse the EP2AGX45DF29C5N (FC-FBGA-780) with the EP2AGX45DF25C5N (FBGA-572); the smaller package removes I/Os and may break pinout. Also verify Quartus II device support is installed for the Arria II GX family - older Quartus versions do not support this device. EOL status means design teams should plan a migration path to Cyclone V or Arria 10 for new designs.
Informations de conformité
RoHS and lead-free status confirmed by Intel/Altera product page. EOL lifecycle status noted as of 2026-09-08; halogen-free and conflict-minerals status not explicitly stated in retrieved web data.