EP2AGZ300FH29C3N - Arria II GZ FPGA, 298K LE, 780-FCBGA | Intel
Référence : EP2AGZ300FH29C3N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2850 | $2 850,00 |
| 10 | $2680 | $26 800,00 |
| 100 | $2410 | $241 000,00 |
| 500 | $2150 | $1 075 000,00 |
| 1 000 | $1925 | $1 925 000,00 |
EP2AGZ300FH29C3N Présentation
An FPGA (Field Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric, block RAM, DSP blocks, and I/O serdes can be programmed by the designer after manufacture. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and fixed-function ASICs: more flexible than an ASIC, but more deterministic and parallel than a CPU. The Arria II GZ family is Intel's mid-range, transceiver-rich family optimized for applications that need 6.375 Gbps transceivers, moderate logic density, and hardened memory/DSP blocks without paying Stratix-class cost.
Key features include 11,920 Logic Array Blocks (LABs), up to 16 global clock networks, 8 PLLs, 736 embedded multipliers (18x18), and 12 transceiver channels capable of up to 6.375 Gbps data rate. The device also provides partial reconfiguration support and a hard PCI Express Gen2 IP block, simplifying high-bandwidth serial interface integration. The 780-pin FCBGA package offers an exposed die pad for thermal dissipation, supporting industrial-grade thermal envelopes.
Architecturally, the EP2AGZ300FH29C3N is implemented in a 40 nm CMOS process with embedded SRAM, hard PCML transceivers, and dedicated memory interface circuitry for DDR3 SDRAM. The -3 speed grade denotes the fastest available timing closure for this device, and the 'C' suffix indicates the commercial temperature range (0 C to +85 C), while 'N' denotes lead-free / RoHS compliance. The 'I' temperature grade (-40 C to +100 C) and 'I4' / 'I3' speed options are also available in the same 780-FCBGA footprint, enabling system designers to migrate performance tiers without re-spinning the PCB.
Typical applications include high-speed serial interface bridging (PCIe Gen2, SATA, SRIO), broadcast and professional video processing, radar and electronic warfare baseband, software-defined radio (SDR) front-end preprocessing, and ASIC prototyping. The combination of high logic density, embedded transceivers up to 6.375 Gbps, and DDR3 memory controller hard IP makes the EP2AGZ300FH29C3N well-suited for data aggregation and protocol conversion cards in telecom and industrial imaging systems.
When designing with this device, ensure the PCB land pattern follows Intel's 780-FCBGA (29 mm x 29 mm, 1.0 mm ball pitch) footprint and that the transceiver reference clock jitter meets the data-rate requirement. Power estimation should be done with the Intel Early Power Estimator (EPE) tool, because at full transceiver utilization the core and IO rails together can draw tens of watts. JTAG, AS, and PS configuration schemes are all supported; choose configuration mode based on board boot-time targets.
This page synthesizes distributor pricing, package-level drop-in alternatives within the Arria II GZ family, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP2AGZ300FH29C3N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2AGZ300FH29C3N (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Logic Elements (LE), Operating Temperature, Transceivers.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2AGZ300FH29C3G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1545 / unité
Voir la fiche technique →EP2AGZ300FH29I3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1380 / unité
Voir la fiche technique →EP2AGZ350FH29C4N
✅ Remplacement direct✓ En stock
$1245 / unité
Voir la fiche technique →EP2AGZ300FH29C3N Valeurs maximales et caractéristiques électriques
| Family | Arria II GZ |
| Logic Elements (LE) | 298000 |
| Logic Array Blocks (LABs) | 11920 |
| Embedded Memory Bits | 18854912 |
| User I/O Pins | 281 |
| Boîtier | 780-BBGA, FCBGA |
| Process Technology | 40 nm CMOS |
| Core Voltage | 0.9 V |
| Speed Grade | -3 |
| Temperature Grade | Commercial (0 C to +85 C) |
| Transceivers | 12 channels up to 6.375 Gbps |
| Embedded Multipliers (18x18) | 736 |
| PLLs | 8 |
| Global Clock Networks | 16 |
| PCIe Hard IP | PCI Express Gen2 (x1/x4/x8) |
| Memory Controller Hard IP | DDR3 SDRAM |
| Statut RoHS | Compliant |
| Lead-Free | Yes (N suffix) |
| Type de montage | Surface Mount (BGA) |
| Configuration Modes | AS, PS, JTAG |
Guide de configuration des broches du EP2AGZ300FH29C3N 780-bbga, fcbga
Configuration des broches du EP2AGZ300FH29C3N (boîtier 780-bbga, fcbga). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2AGZ300FH29C3N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2AGZ300FH29C3N convient pour 6 applications: PCIe Gen2 Card and Protocol Bridge, High-Speed Serial Interface Aggregation, Software-Defined Radio (SDR) Baseband, Broadcast and Professional Video Processing, ASIC Prototyping Platform, Industrial Imaging and Machine Vision.
PCIe Gen2 Card and Protocol Bridge
The EP2AGZ300FH29C3N integrates a hard PCI Express Gen2 IP block (x1/x4/x8) and 12 transceivers up to 6.375 Gbps, enabling single-chip PCIe-to-Serial-RapidIO or PCIe-to-SATA bridge cards without external PHY. In a typical PCIe adapter design, the FPGA sits between the system root complex and downstream protocol logic, handling link training at 5 Gbps line rate. The 298,000 logic elements and 18.85 Mbit embedded memory are sufficient to implement a full TL/ML/DL layer state machine plus protocol adaptation. Compared to an ASIC-based bridge, this part is reprogrammable for multiple downstream protocols, reducing NRE cost across product variants.
Recommandé
High-Speed Serial Interface Aggregation
With 12 transceivers operating up to 6.375 Gbps each, the EP2AGZ300FH29C3N aggregates multiple SRIO, XAUI, SATA, or Aurora serial links into a single high-bandwidth pipeline. Each transceiver is independently programmable for its protocol and data rate, so a single FPGA can run 4x XAUI plus 4x SRIO plus 4x SATA simultaneously. The hard PCS and PMA in each channel deliver sub-100 mW per 6.375 Gbps lane, which is competitive with external PHY chips. The 281 user I/Os provide enough GPIO for board-level status LEDs, I2C management, and reset sequencing alongside the serial links.
Recommandé
Software-Defined Radio (SDR) Baseband
The combination of 736 18x18 multipliers, 18.85 Mbit block RAM, and 12 transceivers makes the EP2AGZ300FH29C3N a strong fit for SDR baseband preprocessing, where it can run multi-channel DDC/DUC, channelization, and FFT/iFFT engines in parallel. At a 300 MHz DSP block clock, the device sustains 73.6 GMAC/s of 18x18 multiply-accumulate throughput, which is enough for 4 simultaneous 100 MHz-wide LTE channelizers. The hard memory controller offloads DDR3 read/write arbitration, freeing logic for DSP. Industrial-grade EP2AGZ300FH29I3N is the recommended variant for outdoor base-station deployments.
Recommandé
Broadcast and Professional Video Processing
The EP2AGZ300FH29C3N's 18.85 Mbit embedded memory and 281 user I/Os make it a good platform for multi-stream video processing, including 3G-SDI/HD-SDI aggregation, frame-rate conversion, and chroma keying. The 12 transceivers can carry up to 12 simultaneous 3G-SDI streams at 2.97 Gbps each, while the logic fabric handles scaling, blending, and overlay operations in real time. The 736 embedded 18x18 multipliers accelerate 2D filter kernels for deinterlacing and noise reduction. This is the same family Intel has used in reference designs for production switchers and video walls.
Recommandé
ASIC Prototyping Platform
With 298,000 logic elements, the EP2AGZ300FH29C3N provides enough capacity to prototype medium-scale ASIC RTL blocks (typically 1-2 million gates after FPGA mapping). Designers can partition an ASIC across two or three Arria II GZ devices on a multi-FPGA prototyping board, with the on-chip transceivers providing 6.375 Gbps chip-to-chip interconnect. The -3 speed grade offers the fastest timing closure in this family, which is critical for ASIC functional validation. The commercial temperature range and lead-free package are suitable for desktop and lab prototyping environments.
Recommandé
Industrial Imaging and Machine Vision
The EP2AGZ300FH29C3N suits high-speed industrial camera and machine vision systems where it preprocesses image data from CoaXPress, Camera Link, or GigE Vision streams before forwarding to a host processor. The 12 transceivers support 4x CoaXPress links at 6.25 Gbps each, while 736 18x18 multipliers accelerate 2D convolution kernels for edge detection and feature extraction. With 281 user I/Os, the FPGA can interface to multiple image sensors, motor encoders, and trigger lines in parallel. The industrial variant EP2AGZ300FH29I3N extends operation to -40 C for harsh factory environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2AGZ300FH29C3N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2AGZ300FH29C3G | EP2AGZ300FH29I3N | EP2AGZ350FH29C4N |
|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 780-FCBGA (FH29) | 780-FCBGA (FH29) - same | 780-FCBGA (FH29) - same | 780-FCBGA (FH29) - same |
| Logic Elements | 298000 | 298000 (same) | 298000 (same) | 350000 (+17%) |
| LABs | 11920 | 11920 (same) | 11920 (same) | 13940 (+17%) |
| Embedded Memory | 18,854,912 bits | 18,854,912 bits (same) | 18,854,912 bits (same) | 20,557,056 bits |
| User I/Os | 281 | 281 (same) | 281 (same) | 281 (same) |
| Speed Grade | -3 | -3 (same) | -3 (same) | -4 (slower) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (same) | Industrial (-40C to +100C) | Commercial (same) |
| Transceivers | 12 ch up to 6.375 Gbps | 12 ch (same) | 12 ch (same) | 12 ch (same) |
| RoHS Compliant | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Highest logic density in the Arria II GZ 780-FCBGA FH29 package (vs EP2AGZ225HF40C3N)
- Fastest -3 speed grade for timing closure (vs EP2AGZ350FH29C4N)
- Hard PCIe Gen2 IP block integrated (vs EP2AGX125EF29C6G)
Notes de conception
Estimated: at 85% logic utilization and 10 active transceivers at 6.375 Gbps, the EP2AGZ300FH29C3N dissipates approximately 12-15 W total (core + IO + transceiver). The 780-FCBGA package exposes a large die-up thermal pad; the PCB must provide a matched land pattern with at least 4 thermal vias (0.3 mm drill) per signal ball pitch row, filled or capped, to keep junction temperature below 100 C. Without a thermal pad soldered to a copper pour, the device will throttle or fail in commercial temperature environments.
The 780-FCBGA uses a 1.0 mm ball pitch. Use 0.45-0.5 mm solder mask-defined (SMD) pads with non-solder-mask-defined (NSMD) via-in-pad for signal break-out. Stack-up should be 12+ layers with a dedicated transceiver reference clock island and impedance-controlled 85-ohm differential traces for the 12 Gbps channels. Route all transceiver RX/TX pairs on the same layer with length matching to within 150 mil. JTAG, MSEL, and configuration pins must be pulled to known states per the configuration scheme (AS/PS/JTAG) selected.
Do not assume the -3 speed grade of the EP2AGZ300FH29C3N will work in designs migrated from -4 without re-running timing closure; faster Fmax requires tighter placement and routing constraints. Also, when migrating from the EP2AGZ225HF40 to the Z300, the 780-FCBGA FH29 package is NOT a drop-in for the 1517-ball HF40 - the ball maps and footprints differ, so a PCB redesign is required. Finally, the 'N' suffix in EP2AGZ300FH29C3N denotes lead-free, but earlier 'C3' or non-N date codes may use leaded balls - always confirm RoHS status by full MPN suffix when ordering.
The 12 transceivers at 6.375 Gbps each require a clean reference clock. Use a dedicated low-jitter clock generator (such as a SiLabs Si5338 or equivalent) with 100 ppm accuracy and 0.7 ps RMS jitter. Each transceiver pair should be AC-coupled to its connector with 0.1 uF capacitors, and the TX pre-emphasis / RX equalization should be tuned using the Quartus II Transceiver Toolkit for the specific channel loss profile.
Informations de conformité
The 'N' suffix in EP2AGZ300FH29C3N indicates lead-free / RoHS-compliant finish. Not AEC-Q100 qualified - this is a commercial-grade FPGA, not automotive.