EP2AGZ300FH29C4G - Arria II GZ FPGA 300K LE FBGA-780 | Intel
Référence : EP2AGZ300FH29C4G ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $2150 | $2 150,00 |
| 10 | $2050 | $20 500,00 |
| 50 | $1920 | $96 000,00 |
| 100 | $1820 | $182 000,00 |
| 500 | $1700 | $850 000,00 |
EP2AGZ300FH29C4G Présentation
An FPGA is a programmable logic device that allows engineers to implement custom digital circuits, signal processing functions, and complex state machines through hardware description languages such as Verilog or VHDL. Within the broader semiconductor hierarchy, FPGAs sit between fixed-function ASICs and general-purpose processors: they deliver ASIC-like performance and parallelism while retaining the flexibility of software-configurable logic, making them ideal for prototyping, low-volume production, and applications requiring frequent hardware updates.
Key features of the EP2AGZ300FH29C4G include embedded 18x18 multipliers for DSP workloads, dedicated high-speed transceivers supporting multi-gigabit serial protocols, embedded memory blocks (M9K/M144K), and high-performance LVDS and DDR external memory interfaces. The device also integrates PLL and transceiver clocking infrastructure suitable for high-bandwidth system designs.
The architecture leverages a 40 nm low-power process combined with hard IP blocks to provide deterministic, low-latency data-path acceleration. Hardened PCIe, memory controllers, and embedded transceivers free up programmable fabric, allowing more application logic to be implemented within the 300K logic-element budget while keeping dynamic power consumption manageable.
Typical applications include high-definition video processing and bridging, wireless baseband signal processing, test and measurement instrumentation, image processing pipelines, military and aerospace signal processing, and high-speed serial protocol bridging. Designers also deploy Arria II GZ devices in network interface cards and software-defined radio platforms.
When designing with this part, ensure PCB layout supports high-speed transceiver routing with controlled impedance and length matching. Use the Quartus II design suite (or Quartus Prime for newer toolchains) for synthesis, place-and-route, and timing closure; verify pin assignments against the FBGA-780 ball map and the package thermal management plan.
This page synthesizes distributor pricing, lifecycle status, FBGA-780 package pinout, and drop-in alternatives within the Arria II GZ family that are not assembled in a single place on the manufacturer datasheet.
Alternatives de remplacement direct pour EP2AGZ300FH29C4G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2AGZ300FH29C4G (même facteur de forme et même empreinte) — différant par Package, Transceivers, Speed Grade, Logic Elements (LE), Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2AGZ300FH29C3G
✅ Remplacement direct✓ En stock
$1545 / unité
Voir la fiche technique →EP2AGZ300FH29C3N
✅ Remplacement direct✓ En stock
$1925 / unité
Voir la fiche technique →EP2AGZ300FH29C4N
✅ Remplacement direct✓ En stock
$1395 / unité
Voir la fiche technique →EP2AGZ300FH29I4G
✅ Remplacement direct✓ En stock
$1350 / unité
Voir la fiche technique →EP2AGZ300FH29I4N
✅ Remplacement direct✓ En stock
$1380 / unité
Voir la fiche technique →EP2AGZ300FH29I3G
✅ Remplacement direct✓ En stock
$1340 / unité
Voir la fiche technique →EP2AGZ300FH29C4G Valeurs maximales et caractéristiques électriques
| Series | Arria II GZ |
| Logic Elements | 300,000 (approx.) |
| Température de fonctionnement | 0C to +85C (commercial grade, suffix C) |
| Grade | C4 (commercial, speed grade 4) |
| Type de montage | Surface Mount |
| Boîtier / Format | 780-BGA (Fine-pitch BGA, FH29) |
| Statut RoHS | Compliant |
| Process Technology | 40 nm |
| Lead-Free | Yes |
| Manufacturer | Intel (formerly Altera) |
Guide de configuration des broches du EP2AGZ300FH29C4G 780-bga (fine-pitch bga, fh29)
Configuration des broches du EP2AGZ300FH29C4G (boîtier 780-bga (fine-pitch bga, fh29)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2AGZ300FH29C4G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2AGZ300FH29C4G convient pour 7 applications: High-Definition Video Bridging and Processing, Wireless Baseband Signal Processing, Test and Measurement Instrumentation, Image Processing Pipelines, Network Interface Cards and Protocol Bridging, Software-Defined Radio Platforms, Aerospace and Defense Signal Processing.
High-Definition Video Bridging and Processing
The EP2AGZ300FH29C4G fits HD video bridge designs because its 300K logic elements, embedded 18x18 multipliers, and high-speed transceivers provide the throughput required for SDI, HDMI, and DisplayPort bridging. Placed on a video I/O card with DDR3 memory, the device can perform real-time scaling, color-space conversion, and frame-rate conversion while maintaining deterministic latency for broadcast workflows. Compared with smaller Arria II GZ variants, the 300K LE budget allows multiple video pipelines to be instantiated concurrently. Designers should pair the device with proper impedance-controlled PCB layers for the transceivers to achieve the multi-gigabit data rates specified in the Arria II GZ datasheet.
Recommandé
Wireless Baseband Signal Processing
The EP2AGZ300FH29C4G suits wireless baseband processing because its 300K logic elements and embedded DSP blocks deliver the multiply-accumulate throughput required for LTE, WiMAX, and proprietary OFDM waveforms. Used as the baseband accelerator on a base-station card, it interfaces with ADC/DAC converters via LVDS or serial LVDS and with the host processor via PCIe. The 40 nm process keeps dynamic power manageable in fan-cooled base-station enclosures. According to Intel's Arria II GZ documentation, the device's hard IP blocks free up programmable fabric for algorithm-specific acceleration. Designers should validate timing closure for the target modulation scheme within Quartus II before tape-out.
Recommandé
Test and Measurement Instrumentation
The EP2AGZ300FH29C4G fits high-end test and measurement instruments because its logic density supports complex stimulus-response patterns, on-chip protocol decoding, and real-time DSP analysis. Placed on a modular instrument PXI/AXIe card, it acts as the protocol engine behind an oscilloscope, logic analyzer, or BERT. Embedded transceivers handle multi-gigabit serial protocol triggering at rates that would overwhelm smaller FPGAs. According to the Arria II GZ datasheet, the device's PLL infrastructure supports flexible clocking required by instrument-grade timing accuracy. Designers should use the device's JTAG interface for in-system debug and the Quartus II SignalTap logic analyzer for internal node capture.
Recommandé
Image Processing Pipelines
The EP2AGZ300FH29C4G fits industrial and medical image-processing pipelines because its 300K logic elements and DSP throughput allow real-time filtering, edge detection, and pattern recognition. Deployed in an FPGA-based vision processing card, it accepts Camera Link or CoaXPress inputs and produces processed pixel streams for downstream analysis. Compared with software-only pipelines, the FPGA delivers deterministic latency at multi-megapixel resolutions. According to Intel's Arria II GZ documentation, the embedded memory blocks (M9K/M144K) line-buffer storage for line-scan algorithms. Designers should plan thermal dissipation carefully because continuous DSP workload can raise junction temperature under the FBGA-780 thermal envelope.
Recommandé
Network Interface Cards and Protocol Bridging
The EP2AGZ300FH29C4G is well-suited for high-performance network interface cards because its embedded multi-gigabit transceivers and hard PCIe IP simplify 10G/40G Ethernet, SATA, and PCIe Gen2 bridging. Used as the bridge chip on a NIC, it offloads protocol processing from the host CPU and provides low-latency DMA into host memory. The 300K logic-element budget allows custom offload engines alongside the standard protocol stack. According to the Arria II GZ datasheet, hard PCIe and memory controller IP free up programmable fabric for value-added features. Designers should verify PCIe link training and equalization settings within Quartus II before production release.
Recommandé
Software-Defined Radio Platforms
The EP2AGZ300FH29C4G is a strong fit for software-defined radio (SDR) platforms because its transceivers and DSP fabric support multi-channel baseband processing with sample rates well above 100 MSPS. Deployed on a modular SDR card, it interfaces with wideband RF tuners and performs channelization, demodulation, and protocol decoding in real time. The 40 nm low-power geometry keeps total board power within typical SDR chassis budgets. Compared with smaller FPGAs, the 300K LE budget accommodates multi-band concurrent processing. According to Intel's Arria II GZ documentation, designers should pair the FPGA with high-precision clock distribution and shielded power rails to maintain ADC/DAC signal integrity.
Recommandé
Aerospace and Defense Signal Processing
The EP2AGZ300FH29C4G suits aerospace and defense signal-processing applications because its 300K logic elements and DSP throughput handle radar, electronic-warfare, and secure-communication workloads. Used on conduction-cooled VPX or VME boards, it processes wide-bandwidth IF samples and implements crypto or FFT engines. The C4 commercial temperature grade suits pilot-instrument and ground-station environments; designers targeting airborne or rugged deployments should select the I4G industrial variant (EP2AGZ300FH29I4G) on the same FH29 footprint. According to Intel's Arria II GZ datasheet, the device's deterministic fabric and embedded transceivers simplify secure link implementations. Designers should apply conformal coating and follow IPC-A-610 acceptance criteria for aerospace assembly.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2AGZ300FH29C4G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2AGZ300FH29C3G | EP2AGZ300FH29C3N | EP2AGZ300FH29C4N | EP2AGZ300FH29I4G |
|---|---|---|---|---|---|
| Package | 780-BGA (FH29, FBGA-780) | 780-BGA (FH29, FBGA-780) - same | 780-BGA (FH29, FBGA-780) - same | 780-BGA (FH29, FBGA-780) - same | 780-BGA (FH29, FBGA-780) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Speed Grade | C4 (commercial) | C3 (commercial, faster) | C3 (commercial, faster) | C4 (commercial, identical speed) | I4 (industrial) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) |
| Logic Elements | ~300,000 | ~300,000 (identical) | ~300,000 (identical) | ~300,000 (identical) | ~300,000 (identical) |
| Lead-Free / RoHS | Yes (G suffix = lead-free) | Yes (G suffix) | No (N suffix = leaded/legacy) | No (N suffix = leaded/legacy) | Yes (G suffix) |
| Approx. Unit Price (qty 1, USD) | 2150 | ~2350 (C3 commands premium) | ~2200 (N suffix premium for legacy leaded) | ~2050 (leaded/legacy discount) | ~2400 (industrial grade premium) |
Principaux différenciateurs
- Highest-density Arria II GZ device in the FH29 FBGA-780 footprint (vs EP2AGZ225HF40C4G (HF40 FBGA-1152, 225K LE))
- Drop-in speed grade upgrade path to C3 within the same FH29 footprint (vs EP2AGZ300FH29C3G)
- Industrial-grade drop-in alternative on the same FH29 footprint (vs EP2AGZ300FH29I4G)
- Hardened transceiver and PCIe IP versus soft implementation (vs Lower-density Cyclone IV (e.g. EP4CE40F29C8N))
Notes de conception
Estimated: At typical Arria II GZ power consumption around 5-8 W in active DSP use, the 780-ball FBGA package relies on a PCB thermal pad and copper pour for heat removal. Designers should provide at least 25 cm^2 of 4-layer 1 oz copper under the device with thermal vias (0.3 mm pitch, 12+ vias under the die). For sealed enclosures, derate ambient temperature by 10-15 C to maintain junction temperature below 100 C. The commercial-grade C4 suffix limits ambient to 85 C, so for higher-ambient use the I4G variant is recommended.
The 780-ball fine-pitch BGA requires a PCB stack-up with matched trace impedance for transceivers (100 ohm differential for serial links, 50 ohm single-ended for clock/control). Use microstrip or stripline routing on layers 3 or 4 with continuous reference planes; avoid routing signals across split power planes. According to Intel's Arria II GZ handbook, all high-speed transceiver traces should be length-matched within 0.127 mm (5 mil) and routed with controlled impedance. Add AC-coupling capacitors adjacent to each high-speed serial pin and follow JTAG chain layout recommendations for in-system programming.
Do not confuse the Arria II GZ (EP2AGZ) device family with the Arria II GX (EP2AGX) family: both share the Arria II brand but differ in transceiver count, DSP count, and pinout. The EP2AGZ300FH29C4G specifically targets transceiver-rich and DSP-rich designs. Power-sequencing mistakes (incorrect ramp order for VCCINT, VCCA, VCCD_PLL, and VCCIO) can cause POR failure; follow Intel's power-up sequencing guidelines in the device handbook. Also ensure all unused I/O banks are powered to a defined voltage, never left floating.
Estimated: BGA-780 land pattern requires 1.0 mm pitch ball-to-ball; PCB pads typically 0.5 mm diameter with solder mask defined (SMD) or non-solder mask defined (NSMD) per IPC-7351. Use ENIG or OSP surface finish for consistent BGA soldering. Use 1.6 mm minimum PCB thickness to avoid warpage during reflow; thinner boards may require carriers. Via-in-pad design is recommended for BGA escape routing under the device. Apply bottom-side rework profiles no higher than 245 C peak to preserve BGA solder joint integrity.
Informations de conformité
G suffix denotes lead-free / RoHS compliant per Intel product numbering convention. AEC-Q100 does not apply to FPGAs; commercial-grade (C4) and industrial-grade (I4G) variants available in the same FH29 package. Halogen-free status not verified in provided data; recommend confirming with Intel product declaration.
