EP2AGZ350FH29I4N - Arria II GZ FPGA, 348500 LE, 780-BGA | Intel
Référence : EP2AGZ350FH29I4N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3200 | $3 200,00 |
| 10 | $3050 | $30 500,00 |
| 100 | $2890 | $289 000,00 |
| 500 | $2745 | $1 372 500,00 |
| 1 000 | $2620 | $2 620 000,00 |
EP2AGZ350FH29I4N Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect that can be rewired in-circuit to implement arbitrary digital functions. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> complex programmable logic devices (CPLD) -> field-programmable gate arrays (FPGA) -> semiconductor ICs, and are commonly used as glue logic, co-processors, or full SoC replacements where ASIC NRE is not justified.
Key features of the EP2AGZ350FH29I4N include 13940 LABs/CLBs, embedded transceiver support for protocols such as PCI Express Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI, embedded multipliers and DSP blocks, and dedicated PLL and global clock networks. The 0.9 V core voltage (per datasheet header summary) and 40 nm process technology reduce dynamic power versus prior Arria generations while maintaining timing margin.
The Arria II GZ architecture combines a logic fabric with hard IP for memory controllers (DDR3 with ECC), high-speed transceivers, and PCI Express Gen2 x8 endpoints. Designers use Quartus II design software for synthesis, place-and-route, and timing closure; the same toolchain supports all Arria II GZ speed grades and package variants.
Typical applications for this device include high-definition video broadcast equipment, wireless baseband processing, military radar preprocessing, medical imaging pipelines, and high-performance test and measurement backplanes. The 780-ball FCBGA provides dense I/O for memory interfaces and parallel digital buses.
When designing in the EP2AGZ350FH29I4N, verify PCB stackup and decoupling per the Arria II GZ hardware reference manual, and confirm software version compatibility in Quartus II. Designers should also check the I4 speed grade against timing closure targets.
This page synthesizes distributor pricing, same-brand drop-in alternatives within the Arria II GZ family, and FPGA design notes that complement the manufacturer datasheet to support both procurement and engineering decisions.
Alternatives de remplacement direct pour EP2AGZ350FH29I4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP2AGZ350FH29I4N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Mounting Type, RoHS Status, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP2AGZ350FH29I3N
✅ Remplacement direct✓ En stock
$3550 / unité
Voir la fiche technique →EP2AGZ350FH29I4G
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP2AGZ350FH29C4N
✅ Remplacement direct✓ En stock
$1245 / unité
Voir la fiche technique →EP2AGZ350FH29C4G
✅ Remplacement direct✓ En stock
$2205 / unité
Voir la fiche technique →EP2AGZ350FH29I3G
✅ Remplacement direct✓ En stock
$1450 / unité
Voir la fiche technique →EP2AGZ350FH29I4N Valeurs maximales et caractéristiques électriques
| Family | Arria II GZ |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements / Cells | 348500 |
| LABs / CLBs | 13940 |
| Total RAM Bits | 21270528 |
| Number of I/O | 281 |
| Boîtier | 780-BBGA, FCBGA (29x29 mm) |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Speed Grade | I4 |
| Statut RoHS | Compliant |
| Lead Free | Yes |
| Nombre de broches | 780 |
Guide de configuration des broches du EP2AGZ350FH29I4N 780-bbga, fcbga (29x29 mm)
Configuration des broches du EP2AGZ350FH29I4N (boîtier 780-bbga, fcbga (29x29 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP2AGZ350FH29I4N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP2AGZ350FH29I4N convient pour 6 applications: High-Speed Serial Backplane Aggregation, Video Broadcast Processing and Format Conversion, Military and Aerospace Radar Preprocessing, Industrial Test and Measurement Instrumentation, Wireless Baseband Digital Front-End, Medical Imaging Pipeline Acceleration.
High-Speed Serial Backplane Aggregation
The EP2AGZ350FH29I4N's integrated transceivers up to 6.375 Gbps and 281 user I/O make it ideal for backplane aggregation in telecom and datacom switches. It can implement multi-lane CPRI, Serial RapidIO, or Gigabit Ethernet aggregation while the 348500 logic elements provide headroom for protocol bridging, statistics counters, and fabric header parsing. With 21270528 bits of embedded memory it handles deep cell queues at line rate. Per the Arria II GZ datasheet, hard IP for PCI Express Gen2 x8 endpoints reduces soft-logic footprint and BOM cost compared with competitor soft-IP implementations.
Recommandé
Video Broadcast Processing and Format Conversion
Broadcast equipment such as SDI routers, format converters, and 4K video processing engines require high logic density and abundant DSP resources. The EP2AGZ350FH29I4N's 348500 logic elements and dedicated DSP blocks support multi-channel HEVC/H.264 encode acceleration, chroma upsampling, and frame-rate conversion. The 281 user I/O accommodate parallel video buses, while embedded memory (21270528 bits) buffers line/field data without external SRAM. Industrial temperature rating ensures deployment in outdoor encoder cabinets and broadcast truck installations, per the Arria II GZ datasheet industrial spec.
Recommandé
Military and Aerospace Radar Preprocessing
Phased-array radar and electronic warfare subsystems require FPGA density for FFT pipelines, pulse compression, and digital beamforming. The EP2AGZ350FH29I4N's 348500 logic elements and DSP blocks deliver the throughput needed for multi-channel IF sampling, while its industrial temperature rating (-40C to +100C) covers most ground-mobile and shipboard deployments. Per the Arria II GZ datasheet, the part supports SEU mitigation via scrubbing and CRC-based configuration memory checking, valuable for radiation-prone environments. Note that the I4N variant is NOT MIL-PRF-38535 qualified; for fully military-grade, use a dedicated MIL-spec part.
Recommandé
Industrial Test and Measurement Instrumentation
Automated Test Equipment (ATE), protocol analyzers, and oscilloscope front-ends demand logic density for state machines, timing engines, and on-board DSP. The EP2AGZ350FH29I4N's 21270528 bits of embedded RAM buffer deep acquisition captures, while 281 I/O support parallel ADC/DAC buses. The 780-ball FCBGA package is suitable for high-layer-count PCBs typical of high-speed instrumentation. Per the datasheet, integrated transceivers drive external serial standards (LVDS, PCIe Gen2) for backhaul to host processors, eliminating companion bridge chips.
Recommandé
Wireless Baseband Digital Front-End
Small-cell and macro baseband cards benefit from the EP2AGZ350FH29I4N's high logic count for LTE/NR physical-layer signal processing, channel coding, and crest-factor reduction. The integrated transceivers handle CPRI and OBSAI fronthaul links up to 6.375 Gbps per lane, per the Arria II GZ datasheet. With 13940 LABs/CLBs, the device can run multi-antenna MIMO processing at subframe boundaries. Industrial -40C to +100C operation covers outdoor RRH head enclosures and central baseband chassis with passive cooling.
Recommandé
Medical Imaging Pipeline Acceleration
CT, MRI, and ultrasound imaging pipelines require real-time DSP for backprojection, beamforming, and image reconstruction. The EP2AGZ350FH29I4N's 348500 logic elements and DSP blocks deliver the MAC throughput for multi-slice CT reconstruction at clinically relevant frame rates. The 281 user I/O accommodate multi-channel ADC input buses from analog front-ends, and embedded memory (21270528 bits) holds sinogram data and intermediate projections. Per the family datasheet, industrial temperature rating supports operating-room and mobile-cart deployments where ambient temperature is not tightly controlled.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP2AGZ350FH29I4N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP2AGZ350FH29I3N | EP2AGZ350FH29I4G | EP2AGZ350FH29C4N | EP2AGZ350FH29C4G | EP2AGZ350FH29I3G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-BBGA, FCBGA (FH29, 29x29 mm) | 780-BBGA, FCBGA (FH29) - same | 780-BBGA, FCBGA (FH29) - same | 780-BBGA, FCBGA (FH29) - same | 780-BBGA, FCBGA (FH29) - same | 780-BBGA, FCBGA (FH29) - same |
| Logic Elements | 348500 | 348500 | 348500 | 348500 | 348500 | 348500 |
| Total RAM Bits | 21270528 | 21270528 | 21270528 | 21270528 | 21270528 | 21270528 |
| User I/O | 281 | 281 | 281 | 281 | 281 | 281 |
| Speed Grade | I4 | I3 (~10-15% faster) | I4 (same) | C4 (commercial temp mapping) | C4 (commercial temp) | I3 (~10-15% faster) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| RoHS / Lead-Free | RoHS / Lead-Free (-N suffix) | RoHS / Lead-Free | RoHS (-G variant) | RoHS / Lead-Free | RoHS (-G variant) | RoHS (-G variant) |
Principaux différenciateurs
- Pin-compatible I3 speed grade upgrade path (vs EP2AGZ350FH29I3N)
- RoHS variant available without hardware change (vs EP2AGZ350FH29I4G)
- Lower-density same-package fallback (vs EP2AGZ300FH29I4N)
- Industrial temperature over commercial variant (vs EP2AGZ350FH29C4N)
Notes de conception
The 780-ball FCBGA FH29 package requires a high-layer-count PCB (typically 12+ layers) with matched impedance routing for the high-speed transceivers and DDR3 interfaces. Use the Intel Arria II GZ Hardware Reference Design PCB stackup recommendations as a starting point, with continuous ground planes adjacent to all signal layers. Per BGA design rules, via-in-pad with copper-filled and planarized vias is recommended for the breakout region to fan out from the 1.0 mm ball pitch.
The Arria II GZ core runs at 0.9 V and the device integrates multiple power rails (VCC, VCCPT, VCCPGM, VCCA_FPLL, and transceiver PLLs). Use the Quartus II Early Power Estimator to size each rail before schematic capture. Decoupling capacitors (a mix of 0.1 uF, 0.01 uF, and bulk 22-47 uF polymer) must be placed within 100 mils of the BGA balls per the device datasheet, and a power-on sequencing controller should be considered if multiple rails must ramp in a defined order.
Estimated: at full logic utilization (348500 LE, ~85% toggle rate) the EP2AGZ350FH29I4N dissipates up to 8-12 W depending on transceiver activity. The 780-ball FCBGA package is designed for forced-air cooling or heatsink attachment - confirm Theta_JA from the package thermal model in the Arria II GZ datasheet. For conduction-cooled or sealed enclosures, derate the design or specify a heatsink with sufficient thermal mass.
Do not confuse the FH29 package with the FF35 package: they have different ball maps and require different PCB footprints. Do not confuse the I4 speed grade with C4 - they are speed-grade-to-temperature mappings, not timing-speed equivalents across all paths. Do not ignore configuration mode selection: Arria II GZ supports AS, PS, JTAG, and FPP configuration schemes and the wrong mode causes the device to appear dead on the bench.
High-speed transceiver channels (up to 6.375 Gbps) require matched-length routing within a few mils per the Arria II GZ datasheet. Use AC-coupled coupling capacitors (0.1 uF) between transceiver channels and external connectors, and maintain a continuous reference ground plane under the entire transceiver region. Differential pairs should be routed with intra-pair skew under 1 ps.
Informations de conformité
RoHS compliant and lead-free per Altera/Intel product declaration and Components-Store listing. Not AEC-Q100 qualified - Arria II GZ FPGAs are industrial/commercial grade only, not automotive qualified. Refer to Intel PSG materials declaration for full REACH and conflict minerals statement.