EP2AGZ350FH29I4N - Arria II GZ FPGA, 348500 LE, 780-BGA | Intel
부품 번호: EP2AGZ350FH29I4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3200 | $3,200.00 |
| 10 | $3050 | $30,500.00 |
| 100 | $2890 | $289,000.00 |
| 500 | $2745 | $1,372,500.00 |
| 1,000 | $2620 | $2,620,000.00 |
EP2AGZ350FH29I4N 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), embedded memory, DSP slices, and programmable interconnect that can be rewired in-circuit to implement arbitrary digital functions. FPGAs sit in the broader taxonomy of programmable logic devices (PLD) -> complex programmable logic devices (CPLD) -> field-programmable gate arrays (FPGA) -> semiconductor ICs, and are commonly used as glue logic, co-processors, or full SoC replacements where ASIC NRE is not justified.
Key features of the EP2AGZ350FH29I4N include 13940 LABs/CLBs, embedded transceiver support for protocols such as PCI Express Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI, embedded multipliers and DSP blocks, and dedicated PLL and global clock networks. The 0.9 V core voltage (per datasheet header summary) and 40 nm process technology reduce dynamic power versus prior Arria generations while maintaining timing margin.
The Arria II GZ architecture combines a logic fabric with hard IP for memory controllers (DDR3 with ECC), high-speed transceivers, and PCI Express Gen2 x8 endpoints. Designers use Quartus II design software for synthesis, place-and-route, and timing closure; the same toolchain supports all Arria II GZ speed grades and package variants.
Typical applications for this device include high-definition video broadcast equipment, wireless baseband processing, military radar preprocessing, medical imaging pipelines, and high-performance test and measurement backplanes. The 780-ball FCBGA provides dense I/O for memory interfaces and parallel digital buses.
When designing in the EP2AGZ350FH29I4N, verify PCB stackup and decoupling per the Arria II GZ hardware reference manual, and confirm software version compatibility in Quartus II. Designers should also check the I4 speed grade against timing closure targets.
This page synthesizes distributor pricing, same-brand drop-in alternatives within the Arria II GZ family, and FPGA design notes that complement the manufacturer datasheet to support both procurement and engineering decisions.
드롭인 대체품: EP2AGZ350FH29I4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP2AGZ350FH29I4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Mounting Type, RoHS Status, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP2AGZ350FH29I3N
✅ 드롭인✓ 재고 있음
$3550 / 개
데이터시트 보기 →EP2AGZ350FH29I4G
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP2AGZ350FH29C4N
✅ 드롭인✓ 재고 있음
$1245 / 개
데이터시트 보기 →EP2AGZ350FH29C4G
✅ 드롭인✓ 재고 있음
$2205 / 개
데이터시트 보기 →EP2AGZ350FH29I3G
✅ 드롭인✓ 재고 있음
$1450 / 개
데이터시트 보기 →EP2AGZ350FH29I4N 최대 정격 & 전기적 특성
| Family | Arria II GZ |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements / Cells | 348500 |
| LABs / CLBs | 13940 |
| Total RAM Bits | 21270528 |
| Number of I/O | 281 |
| 패키지 | 780-BBGA, FCBGA (29x29 mm) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +100C (Industrial) |
| Core Voltage | 0.9 V |
| Process Technology | 40 nm |
| Speed Grade | I4 |
| RoHS 상태 | Compliant |
| Lead Free | Yes |
| 핀 수 | 780 |
EP2AGZ350FH29I4N 780-bbga, fcbga (29x29 mm) 핀 구성 가이드
EP2AGZ350FH29I4N(780-bbga, fcbga (29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP2AGZ350FH29I4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP2AGZ350FH29I4N 적합 용도: 6 애플리케이션s: High-Speed Serial Backplane Aggregation, Video Broadcast Processing and Format Conversion, Military and Aerospace Radar Preprocessing, Industrial Test and Measurement Instrumentation, Wireless Baseband Digital Front-End, Medical Imaging Pipeline Acceleration.
High-Speed Serial Backplane Aggregation
The EP2AGZ350FH29I4N's integrated transceivers up to 6.375 Gbps and 281 user I/O make it ideal for backplane aggregation in telecom and datacom switches. It can implement multi-lane CPRI, Serial RapidIO, or Gigabit Ethernet aggregation while the 348500 logic elements provide headroom for protocol bridging, statistics counters, and fabric header parsing. With 21270528 bits of embedded memory it handles deep cell queues at line rate. Per the Arria II GZ datasheet, hard IP for PCI Express Gen2 x8 endpoints reduces soft-logic footprint and BOM cost compared with competitor soft-IP implementations.
추천
Video Broadcast Processing and Format Conversion
Broadcast equipment such as SDI routers, format converters, and 4K video processing engines require high logic density and abundant DSP resources. The EP2AGZ350FH29I4N's 348500 logic elements and dedicated DSP blocks support multi-channel HEVC/H.264 encode acceleration, chroma upsampling, and frame-rate conversion. The 281 user I/O accommodate parallel video buses, while embedded memory (21270528 bits) buffers line/field data without external SRAM. Industrial temperature rating ensures deployment in outdoor encoder cabinets and broadcast truck installations, per the Arria II GZ datasheet industrial spec.
추천
Military and Aerospace Radar Preprocessing
Phased-array radar and electronic warfare subsystems require FPGA density for FFT pipelines, pulse compression, and digital beamforming. The EP2AGZ350FH29I4N's 348500 logic elements and DSP blocks deliver the throughput needed for multi-channel IF sampling, while its industrial temperature rating (-40C to +100C) covers most ground-mobile and shipboard deployments. Per the Arria II GZ datasheet, the part supports SEU mitigation via scrubbing and CRC-based configuration memory checking, valuable for radiation-prone environments. Note that the I4N variant is NOT MIL-PRF-38535 qualified; for fully military-grade, use a dedicated MIL-spec part.
추천
Industrial Test and Measurement Instrumentation
Automated Test Equipment (ATE), protocol analyzers, and oscilloscope front-ends demand logic density for state machines, timing engines, and on-board DSP. The EP2AGZ350FH29I4N's 21270528 bits of embedded RAM buffer deep acquisition captures, while 281 I/O support parallel ADC/DAC buses. The 780-ball FCBGA package is suitable for high-layer-count PCBs typical of high-speed instrumentation. Per the datasheet, integrated transceivers drive external serial standards (LVDS, PCIe Gen2) for backhaul to host processors, eliminating companion bridge chips.
추천
Wireless Baseband Digital Front-End
Small-cell and macro baseband cards benefit from the EP2AGZ350FH29I4N's high logic count for LTE/NR physical-layer signal processing, channel coding, and crest-factor reduction. The integrated transceivers handle CPRI and OBSAI fronthaul links up to 6.375 Gbps per lane, per the Arria II GZ datasheet. With 13940 LABs/CLBs, the device can run multi-antenna MIMO processing at subframe boundaries. Industrial -40C to +100C operation covers outdoor RRH head enclosures and central baseband chassis with passive cooling.
추천
Medical Imaging Pipeline Acceleration
CT, MRI, and ultrasound imaging pipelines require real-time DSP for backprojection, beamforming, and image reconstruction. The EP2AGZ350FH29I4N's 348500 logic elements and DSP blocks deliver the MAC throughput for multi-slice CT reconstruction at clinically relevant frame rates. The 281 user I/O accommodate multi-channel ADC input buses from analog front-ends, and embedded memory (21270528 bits) holds sinogram data and intermediate projections. Per the family datasheet, industrial temperature rating supports operating-room and mobile-cart deployments where ambient temperature is not tightly controlled.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP2AGZ350FH29I4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP2AGZ350FH29I3N | EP2AGZ350FH29I4G | EP2AGZ350FH29C4N | EP2AGZ350FH29C4G | EP2AGZ350FH29I3G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-BBGA, FCBGA (FH29, 29x29 mm) | 780-BBGA, FCBGA (FH29) - same | 780-BBGA, FCBGA (FH29) - same | 780-BBGA, FCBGA (FH29) - same | 780-BBGA, FCBGA (FH29) - same | 780-BBGA, FCBGA (FH29) - same |
| Logic Elements | 348500 | 348500 | 348500 | 348500 | 348500 | 348500 |
| Total RAM Bits | 21270528 | 21270528 | 21270528 | 21270528 | 21270528 | 21270528 |
| User I/O | 281 | 281 | 281 | 281 | 281 | 281 |
| Speed Grade | I4 | I3 (~10-15% faster) | I4 (same) | C4 (commercial temp mapping) | C4 (commercial temp) | I3 (~10-15% faster) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| RoHS / Lead-Free | RoHS / Lead-Free (-N suffix) | RoHS / Lead-Free | RoHS (-G variant) | RoHS / Lead-Free | RoHS (-G variant) | RoHS (-G variant) |
주요 차별점
- Pin-compatible I3 speed grade upgrade path (vs EP2AGZ350FH29I3N)
- RoHS variant available without hardware change (vs EP2AGZ350FH29I4G)
- Lower-density same-package fallback (vs EP2AGZ300FH29I4N)
- Industrial temperature over commercial variant (vs EP2AGZ350FH29C4N)
설계 노트
The 780-ball FCBGA FH29 package requires a high-layer-count PCB (typically 12+ layers) with matched impedance routing for the high-speed transceivers and DDR3 interfaces. Use the Intel Arria II GZ Hardware Reference Design PCB stackup recommendations as a starting point, with continuous ground planes adjacent to all signal layers. Per BGA design rules, via-in-pad with copper-filled and planarized vias is recommended for the breakout region to fan out from the 1.0 mm ball pitch.
The Arria II GZ core runs at 0.9 V and the device integrates multiple power rails (VCC, VCCPT, VCCPGM, VCCA_FPLL, and transceiver PLLs). Use the Quartus II Early Power Estimator to size each rail before schematic capture. Decoupling capacitors (a mix of 0.1 uF, 0.01 uF, and bulk 22-47 uF polymer) must be placed within 100 mils of the BGA balls per the device datasheet, and a power-on sequencing controller should be considered if multiple rails must ramp in a defined order.
Estimated: at full logic utilization (348500 LE, ~85% toggle rate) the EP2AGZ350FH29I4N dissipates up to 8-12 W depending on transceiver activity. The 780-ball FCBGA package is designed for forced-air cooling or heatsink attachment - confirm Theta_JA from the package thermal model in the Arria II GZ datasheet. For conduction-cooled or sealed enclosures, derate the design or specify a heatsink with sufficient thermal mass.
Do not confuse the FH29 package with the FF35 package: they have different ball maps and require different PCB footprints. Do not confuse the I4 speed grade with C4 - they are speed-grade-to-temperature mappings, not timing-speed equivalents across all paths. Do not ignore configuration mode selection: Arria II GZ supports AS, PS, JTAG, and FPP configuration schemes and the wrong mode causes the device to appear dead on the bench.
High-speed transceiver channels (up to 6.375 Gbps) require matched-length routing within a few mils per the Arria II GZ datasheet. Use AC-coupled coupling capacitors (0.1 uF) between transceiver channels and external connectors, and maintain a continuous reference ground plane under the entire transceiver region. Differential pairs should be routed with intra-pair skew under 1 ps.
규정 준수 정보
RoHS compliant and lead-free per Altera/Intel product declaration and Components-Store listing. Not AEC-Q100 qualified - Arria II GZ FPGAs are industrial/commercial grade only, not automotive qualified. Refer to Intel PSG materials declaration for full REACH and conflict minerals statement.