EP3SL70F780C3G - Stratix III L FPGA, 67.5K LE, 488 I/O | Intel
Référence : EP3SL70F780C3G ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $262.5 | $2 625,00 |
| 100 | $235 | $23 500,00 |
| 500 | $210 | $105 000,00 |
| 1 000 | $185 | $185 000,00 |
EP3SL70F780C3G Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated silicon features such as block RAM, DSP slices, and high-speed transceivers. Stratix III L FPGAs extend the Stratix III architecture into lower-static-power variants, placing them in the taxonomy of programmable logic -> FPGA -> high-performance FPGA -> low-power Stratix series. The 'L' (low-power) variants reduce static power consumption by approximately 50% versus standard Stratix III devices while maintaining comparable performance.
Key features include 67,500 logic elements, 2,699,264 embedded memory bits organized into M9K and M144K blocks, 384 (18x18) multipliers for DSP operations, and support for multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device also integrates up to 4 PLL blocks and 12 global clock networks for advanced clock management.
The Stratix III L architecture employs adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs), allowing efficient mapping of combinational and registered logic. The 40nm process enables high core frequencies while the low-power variant reduces leakage, making EP3SL70F780C3G suitable for both performance-critical and power-constrained designs.
Typical applications include high-performance digital signal processing, telecommunications infrastructure, broadcast video processing, high-speed serial protocol bridging, and ASIC prototyping. The 488 user I/Os support board-level integration with external memory, high-speed data converters, and backplane interfaces.
When designing with the EP3SL70F780C3G, ensure proper power supply sequencing (2.5V VCCBAT, 0.9V VCC, 1.1V VCCPT) and adequate thermal management via PCB thermal vias beneath the FBGA. Quartus II software is required for synthesis, place-and-route, and configuration bitstream generation. Use JTAG or active serial configuration for in-system programming.
This page synthesizes distributor pricing, FPGA family drop-in alternatives, and Stratix III L design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP3SL70F780C3G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3SL70F780C3G (même facteur de forme et même empreinte) — différant par Speed Grade, Package, Mounting Type, Family, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3SL70F780C3
✅ Remplacement direct✓ En stock
$780 / unité
Voir la fiche technique →EP3SL70F780C2G
✅ Remplacement direct✓ En stock
$1185 / unité
Voir la fiche technique →EP3SL70F780C4G
✅ Remplacement direct✓ En stock
$835 / unité
Voir la fiche technique →EP3SL50F780C3G
✅ Remplacement direct✓ En stock
$625 / unité
Voir la fiche technique →EP3SE50F780C3G
✅ Remplacement direct✓ En stock
$1030 / unité
Voir la fiche technique →EP3SL70F780C3G Valeurs maximales et caractéristiques électriques
| Family | Stratix® III L |
| Series | EP3SL70 |
| Logic Elements | 67,500 |
| Embedded Memory | 2,699,264 bits |
| Number of I/O | 488 |
| Boîtier | 780-BBGA, FCBGA (29x29 mm) |
| Speed Grade | -3 |
| Temperature Grade | Commercial (0C to +85C) |
| Process Technology | 40 nm |
| Voltage - Supply | 0.9 V, 1.1 V, 2.5 V |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (168 hours) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
| DSP Multipliers (18x18) | 384 |
| PLL Count | 4 |
| Global Clock Networks | 12 |
| Configuration Method | JTAG, Active Serial, Passive Serial |
Guide de configuration des broches du EP3SL70F780C3G 780-bbga, fcbga (29x29 mm)
Configuration des broches du EP3SL70F780C3G (boîtier 780-bbga, fcbga (29x29 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3SL70F780C3G.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3SL70F780C3G convient pour 6 applications: Telecommunications Infrastructure, High-Performance DSP Signal Processing, Broadcast Video Processing, ASIC Prototyping, Industrial Control and Automation, Test and Measurement Instrumentation.
Telecommunications Infrastructure
The EP3SL70F780C3G fits telecom infrastructure applications requiring high logic density and multiple high-speed serial interfaces. The 67,500 logic elements and 488 user I/Os enable packet processing, framing, and protocol bridging functions in baseband and backhaul equipment. Its 384 (18x18) DSP multipliers support channelization and modulation/demodulation for multi-carrier systems. The Stratix III L low-power architecture reduces thermal load in sealed outdoor enclosures, while the 780-ball FCBGA package supports dense board layouts required by line cards and ATCA blades. Designers typically pair the FPGA with external DDR3 memory and SFP+ transceiver modules for 10G Ethernet or CPRI links, leveraging the device's LVDS I/O capability for chip-to-chip interconnect.
Recommandé
High-Performance DSP Signal Processing
The EP3SL70F780C3G suits high-performance DSP applications with its 384 embedded (18x18) multipliers delivering up to ~200 GMACs throughput. Engineers deploy this FPGA in radar signal processing, software-defined radio baseband, and medical imaging systems where parallel multiply-accumulate operations must execute at line rate. The 2,699,264 bits of embedded memory (organized as M9K + M144K blocks) provide local data buffering to sustain DSP pipeline throughput without external memory stalls. Its -3 speed grade supports moderate clock rates up to ~300 MHz on DSP paths, while the Stratix III L architecture reduces dynamic power versus standard Stratix III. Typical designs include FFT engines, FIR filter banks, and beamforming matrices that benefit from the device's parallel processing fabric.
Recommandé
Broadcast Video Processing
The EP3SL70F780C3G addresses broadcast video processing workloads requiring high pixel-rate throughput and real-time format conversion. Its 488 user I/Os accommodate multiple video ports for SDI, HDMI, or DisplayPort interfacing, while the 67,500 logic elements support color-space conversion, scaling, and deinterlacing in real time. Designers integrate the FPGA in production switchers, video walls, and contribution encoders. The Stratix III L device supports DDR2/DDR3 external memory interfaces for frame buffering at 1080p60 and 4K resolutions. Quartus II Video IP cores provide ready-to-use building blocks for SMPTE 424M/425M SDI and HEVC encoding assist functions.
Recommandé
ASIC Prototyping
The EP3SL70F780C3G serves as an ASIC prototyping platform where engineers validate RTL designs before committing to mask costs. The 67,500 logic elements, 2.7 Mbits of embedded memory, and 488 I/Os allow partitioning and verification of mid-complexity ASIC subsystems. Designers map ASIC blocks into FPGA logic while utilizing the device's memory and DSP resources as functional equivalents. The 780-ball FCBGA package with 1.0 mm pitch supports high-speed signal access for logic analyzers and oscilloscope probes during bring-up. Quartus II design partitioning and incremental compilation flows shorten iteration cycles, making this device a productive vehicle for pre-silicon verification.
Recommandé
Industrial Control and Automation
The EP3SL70F780C3G supports industrial control applications requiring deterministic real-time response and multiple communication interfaces. Its 488 user I/Os connect to industrial sensors, motor encoders, and actuator drivers via LVTTL, LVCMOS, or RS-485 transceivers. The 67,500 logic elements implement PID controllers, state machines, and EtherCAT/CAN protocol stacks. The Stratix III L low-power design reduces cooling requirements in sealed control cabinets, while the -3 speed grade provides sufficient timing margin for closed-loop control loops running at kHz-MHz rates. Designers deploy this FPGA in PLCs, motion controllers, and SCADA systems where programmable logic flexibility accelerates customization.
Recommandé
Test and Measurement Instrumentation
The EP3SL70F780C3G fits test and measurement instruments requiring high-speed data acquisition and real-time signal analysis. Its 488 user I/Os interface with high-speed ADCs and DACs for arbitrary waveform generators, oscilloscopes, and protocol analyzers. The 384 DSP multipliers accelerate FFT computation for spectrum analysis, while the 2.7 Mbits of embedded memory buffer acquisition samples. The Stratix III L low-power variant reduces heat dissipation in fan-cooled benchtop instruments. Quartus II DSP Builder and Simulink integration accelerate model-based design for filter and modulation analysis algorithms used in vector signal analyzers and bit-error-rate testers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3SL70F780C3G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3SL70F780C3 | EP3SL70F780C2G | EP3SL70F780C4G | EP3SL50F780C3G | EP3SE50F780C3G |
|---|---|---|---|---|---|---|
| Package | 780-FBGA (29x29 mm) | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same | 780-FBGA (29x29 mm) - same |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Family | Stratix III L (Low Power) | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E (Enhanced) |
| Logic Elements | 67,500 | 67,500 (same) | 67,500 (same) | 67,500 (same) | 49,500 (-26.7%) | 49,500 (-26.7%) |
| Embedded Memory | 2,699,264 bits | 2,699,264 bits (same) | 2,699,264 bits (same) | 2,699,264 bits (same) | 2,293,760 bits (-15%) | 4,153,344 bits (+54%) |
| Speed Grade | -3 | -3 (same) | -2 (slower) | -4 (faster) | -3 (same) | -3 (same) |
| Number of I/O | 488 | 488 (same) | 488 (same) | 488 (same) | 488 (same) | 488 (same) |
| Static Power | Low Power (L variant) | Low Power (same) | Low Power (same) | Low Power (same) | Low Power (same) | Standard (higher) |
Principaux différenciateurs
- Drop-in compatible with other Stratix III L 780-FBGA variants (vs EP3SL70F780C2G)
- Higher logic density than EP3SL50F780C3G in same package (vs EP3SL50F780C3G)
- Low-power L variant vs standard E variant (vs EP3SE50F780C3G)
Notes de conception
The EP3SL70F780C3G requires three independent supply rails: VCCINT (0.9V core), VCCPT (1.1V analog/PLL), and VCCBAT (2.5V battery backup for configuration RAM). According to Intel Stratix III power guidelines, VCCINT sequencing should follow a controlled ramp to prevent latch-up. Use TI or Maxim power management ICs designed for Stratix III power (e.g., TI UCD9222 + UCD7242 digital controllers). Decoupling requires at least 24 low-ESL ceramic capacitors (0402 or 0201) placed adjacent to the FBGA balls with short, wide PCB traces to minimize inductance.
Estimated: With 67,500 LE at typical utilization (50%) and -3 speed grade, the EP3SL70F780C3G dissipates approximately 3-5W under dynamic load. The 780-ball FCBGA package has a theta_JA of approximately 12-15 C/W with a properly designed thermal via array (at least 36 vias in a 6x6 grid beneath the package center, connected to internal ground planes). Without thermal vias, junction temperatures can exceed 100C in still air. Use Intel's Stratix III Thermal Modeling Tool to validate thermal design before layout freeze.
Route all Stratix III I/O signals with controlled impedance (50 ohm single-ended, 100 ohm differential for LVDS). Maintain 1.0 mm ball pitch routing with 0.10 mm trace/space design rules; use microvia stackups (4-6-4 or higher layer counts) for BGA breakout. Match clock-pair lengths within 0.5 mm to preserve LVDS setup/hold margins. Route global clock networks with 50 ohm controlled impedance and avoid routing signals under the FBGA package shadow. Decoupling capacitors must be placed on the opposite PCB side immediately beneath the package balls with vias directly to internal ground planes.
Common mistakes: (1) Exceeding VCCIO bank voltage limits (verify each I/O bank's VCCIO matches the standard being used); (2) Missing VCCPD (I/O pre-driver) supply for configuration pins; (3) Inadequate MSOP-level board assembly profile causing BGA solder joint defects - follow JEDEC J-STD-020 MSL3 handling procedures; (4) Forgetting nCONFIG and nSTATUS pull-up resistors required by passive serial configuration mode; (5) Using non-Intel EPCS configuration devices without validating compatibility. Always verify configuration interface connections against the Stratix III pin connection guidelines document.
Informations de conformité
RoHS compliant per Intel/Altera product page. Lead-free (Pb-free) package marked by 'G' suffix in part number. AEC-Q100 not applicable - this is a commercial-grade FPGA. For industrial temperature grade, use 'I' suffix variants such as EP3SL70F780I3G.