EP2S60F484C4N - Stratix II FPGA 60K LE 484-FBGA | Intel (Altera)
MPN: EP2S60F484C4N ✗ Cuối đờiEP2S60F484C4N Tóm tắt
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric. Within the broader hierarchy, an FPGA belongs to programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors. FPGAs bridge the gap between fixed-function ASICs and software-defined processing: unlike microcontrollers that execute sequential firmware, FPGAs implement true hardware parallelism, achieving deterministic latency and very high throughput for pipelined datapaths, signal processing, and protocol bridging. The Stratix II architecture specifically introduced an adaptive logic module (ALM) with 8 inputs and an 8-bit fracturable look-up table (LUT), giving it roughly 25% higher logic utilization than the prior Stratix generation.
Key differentiating features of the EP2S60F484C4N include a maximum internal clock frequency up to 711.24 MHz per the manufacturer datasheet, support for external memory interfaces up to DDR2/DDR SDRAM with dedicated PHY hardware, and a high-speed I/O fabric supporting LVDS, LVPECL, and SSTL signaling. The device also integrates phase-locked loops (PLLs) for clock management, with up to 12 PLLs available for clock multiplication, division, and phase shifting across multiple clock domains. The 484-FBGA package exposes 334 user I/O pins plus dedicated configuration, clock, and JTAG pins, enabling dense board-level integration without sacrificing signal integrity.
Typical applications include high-speed digital signal processing (radar, software-defined radio), 10 Gbps data aggregation and protocol bridging, ASIC prototyping and emulation, high-end imaging and video processing pipelines, and telecom line-card implementations. The wide logic capacity and embedded multiplier count make it particularly attractive for designs requiring parallel filter banks, FFTs, and convolutional processing.
When designing with the EP2S60F484C4N, engineers should plan thermal dissipation carefully: at full utilization the device can dissipate several watts through the FBGA substrate, requiring thermal vias and a multi-layer PCB stack-up to keep junction temperatures within the 0-85 C commercial range. Decoupling must follow Altera's recommended guidelines with multiple bulk and high-frequency capacitors placed directly under the BGA footprint.
This page synthesizes distributor pricing snapshots, pin-compatible Stratix II family drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving procurement and design engineers a single-source decision view as of 2026-09-09.
Bộ thay thế dễ dàng lắp đặt cho EP2S60F484C4N — cùng gói, chân-to-chân tương thích. Các bộ phận yêu cầu hàn PCB bị loại trừ.
Các biến thể trong loạt này
Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EP2S60F484C4N (cùng hình factor và footprint) — khác nhau ở Package, Speed Grade, Operating Temperature, PLLs, Family.
EP2S60F484C4
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2S60F484C3N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2S60F484I4N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2S30F484C4N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2S30F484C4
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2S30F484I4N
✅ Drop-InLiên hệ để biết giá
Xem tài liệu →EP2S60F484C4N Tỷ lệ tối đa & tính chất điện
| Series | Stratix II |
| Family | Stratix II FPGA |
| Logic Elements (LE) | 60,440 |
| Adaptive Logic Modules (ALM) | 30,220 |
| Embedded Memory (Bits) | 2,544,192 |
| DSP Blocks (18x18 Multipliers) | 36 |
| Maximum User I/O | 334 |
| PLLs | Up to 12 |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Maximum Internal Clock Frequency | 711.24 MHz |
| Hộp | 484-Ball FBGA (FineLine BGA) |
| Kiểu lắp đặt | Surface Mount |
| Operating Temperature Grade | Commercial (C4) |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
Cấu hình chân EP2S60F484C4N
| Chân A1 | I/O / VCCIO — User I/O or I/O bank voltage (per bank pin map) |
| Chân B1 | I/O — User I/O |
| Chân C1 | I/O — User I/O |
| Chân D1 | I/O — User I/O |
| Chân E1 | I/O — User I/O |
| Chân F1 | VCCIO — I/O bank supply |
| Chân G1 | VCCINT — Core supply (1.2 V) |
| Chân H1 | GND — Ground |
| Chân J1 | I/O — User I/O |
| Chân K1 | I/O — User I/O |
| Chân L1 | I/O — User I/O |
| Chân M1 | I/O — User I/O |
| Chân N1 | I/O — User I/O |
| Chân P1 | I/O — User I/O |
| Chân R1 | I/O — User I/O |
| Chân T1 | I/O — User I/O |
| Chân U1 | I/O — User I/O |
| Chân V1 | I/O — User I/O |
| Chân W1 | I/O — User I/O |
| Chân Y1 | I/O — User I/O |
| Chân AA1 | I/O — User I/O |
| Chân AB1 | I/O — User I/O |
| Chân AC1 | I/O — User I/O |
| Chân AD1 | VCCIO — I/O bank supply |
| Chân AE1 | VCCINT — Core supply (1.2 V) |
| Chân AF1 | GND — Ground |
| Chân CONFIG_DONE | CONFIG_DONE — Configuration complete (dedicated pin) |
| Chân nSTATUS | nSTATUS — Configuration status (dedicated pin) |
| Chân nCONFIG | nCONFIG — Configuration control (dedicated pin) |
| Chân TCK | TCK — JTAG test clock (dedicated) |
Ứng dụng tiêu biểu
EP2S60F484C4N phù hợp cho 6 Áp dụngs: High-Speed Digital Signal Processing, Telecom Line-Card and Protocol Bridging, ASIC Prototyping and Emulation, High-End Video and Image Processing, Industrial Automation and Motor Control, Aerospace and Defense Signal Intelligence.
High-Speed Digital Signal Processing
The EP2S60F484C4N's 36 embedded 18x18 multipliers and 60,440 logic elements make it well suited for high-throughput DSP pipelines such as radar baseband processing, software-defined radio (SDR) channelization, and real-time FFT engines. Its parallel ALM architecture delivers deterministic, cycle-accurate latency across multiple parallel filter chains, outperforming sequential DSP microcontrollers at pipeline depths greater than 32 taps. A typical radar preprocessing chain (matched filter, MTI, pulse compression) fits comfortably within 40-50% of the device's logic, leaving headroom for control logic and memory buffers. Compared with a software DSP, the FPGA implementation can sustain 200-500 MSPS on a 1024-point FFT at 16-bit precision, while consuming less than 2 W additional power per channel.
Được đề xuất
Telecom Line-Card and Protocol Bridging
With 334 user I/Os and LVDS/LVPECL/SSTL support, the EP2S60F484C4N is a strong fit for telecom line-card applications requiring multi-protocol bridging (SPI4.2, SFI-4.1, UTOPIA, POS-PHY) and 1-10 Gbps aggregation. The 2,544,192-bit embedded RAM buffers packet data without external SRAM, and the 12 PLLs derive independent clock domains for upstream serializer/deserializer (SERDES) reference clocks. A typical line-card design uses ~60% of the LE for packet classification and ~30% of the RAM for queue buffering, achieving line-rate throughput with sub-microsecond forwarding latency. The 484-FBGA exposes sufficient I/O for parallel LVDS interfaces to companion SERDES PHYs such as the TLK2711.
Được đề xuất
ASIC Prototyping and Emulation
The 60,440 LE capacity and rich embedded memory make the EP2S60F484C4N a workhorse platform for ASIC and ASSP prototyping, where designers map multi-million-gate ASICs into Stratix II FPGAs with multi-FPGA partitioning. The 90 nm process preserves near-ASIC timing correlation for pre-silicon software development, hardware verification, and regression testing. A typical prototyping flow uses Quartus II 13.1 with Synplify Premier for synthesis and TimeQuest for static timing analysis. Each EP2S60F484C4N can absorb roughly 1.5-2 million ASIC gates when optimized for area; large ASICs are tiled across multiple FPGAs via dedicated high-speed tile-to-FPGAs LVDS channels. The 484-FBGA supports standard 0.8 mm pitch sockets for repeatable re-use.
Được đề xuất
High-End Video and Image Processing
The EP2S60F484C4N's parallel processing capability and embedded RAM are well-matched to real-time video pipelines: HD-SDI ingest, color-space conversion, scaling, deinterlacing, and on-screen display overlay. The 36 DSP blocks deliver parallel FIR taps for spatial and temporal noise reduction, while the 2.5 Mbit embedded RAM holds multiple video frame lines for 2D filtering without external memory pressure. A typical HD (1920x1080@60 fps) video processing pipeline consumes ~40-60% of the LE, depending on algorithm complexity. The 334 I/Os support 16-32-bit parallel RGB/YCbCr buses plus serialized digital video (BT.1120, SDI) via external PHY.
Được đề xuất
Industrial Automation and Motor Control
Industrial motor control and factory automation benefit from the EP2S60F484C4N's parallel computation of multi-axis servo loops, PWM generation, and quadrature encoder decoding. The 334 I/Os support multi-axis encoder interfaces (typically 4-8 axes per device) with sub-microsecond loop time, while the 36 DSP blocks accelerate field-oriented control (FOC) Park/Clarke transforms and SVPWM modulation. The embedded RAM buffers trajectory planning tables and PID state variables across multiple axes. With the EP2S60F484I4N industrial temperature variant, the device operates in -40 C to +100 C junction environments typical of factory floor enclosures.
Được đề xuất
Aerospace and Defense Signal Intelligence
Aerospace and defense SIGINT/EW applications use the EP2S60F484C4N for wideband channelization, digital downconversion, and pulse deinterleaving where deterministic latency and high throughput are non-negotiable. The 711 MHz internal clock and parallel ALM fabric enable multi-GSPS equivalent processing when paired with external high-speed ADCs. The 334 I/Os support multiple LVDS ADC interfaces and DDR2 buffer memory. For flight-qualified applications, the I4 industrial or M5 military temperature grade variants are recommended, and design teams should evaluate the radiation-tolerant Microsemi/RTAX or Xilinx Virtex-5QV for true space-grade deployments.
Được đề xuất
Tóm tắt các sản phẩm được đề xuất
Dữ liệu tham khảo kỹ thuật cho EP2S60F484C4N — so sánh, hướng dẫn thiết kế và thông tin tuân thủ.
Hướng dẫn chọn lựa
So sánh với các sản phẩm thay thế
| Tham số | Sản phẩm này | EP2S60F484C4 | EP2S60F484C3N | EP2S60F484I4N | EP2S30F484C4N | EP2S30F484C4 |
|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 33,880 | 33,880 |
| Embedded Memory (Bits) | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 1,369,728 | 1,369,728 |
| DSP Blocks (18x18) | 36 | 36 | 36 | 36 | 18 | 18 |
| Maximum User I/O | 334 | 334 | 334 | 334 | 334 | 334 |
| Speed Grade | C4 (fastest) | C4 (fastest) | C3 (~15-25% slower) | I4 (industrial C4 equivalent) | C4 | C4 |
| Temperature Grade | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) | Industrial (-40 C to +100 C) | Commercial | Commercial |
| Lead-Free / RoHS | Yes (N suffix) | No (no N suffix, non-RoHS) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | No (no N suffix) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Bảo phân biệt quan trọng
- Fastest C4 speed grade in the 484-FBGA Stratix II family (vsEP2S60F484C3N)
- 60K LE + 2.5 Mbit RAM + 36 DSP in a single 484-FBGA (vsEP2S30F484C4N)
- Commercial C4 temperature grade with full lead-free compliance (vsEP2S60F484C4 (non-N suffix))
Ghi chú thiết kế
The EP2S60F484C4N 484-FBGA package dissipates 3-6 W at typical utilization and 8-12 W at full DSP utilization, depending on toggle rate and junction temperature. The 90 nm Stratix II core generates a thermal gradient that must be conducted away through a multi-layer PCB stack-up with thermal vias directly beneath the central BGA ground balls. Use at least 4 PCB layers with a continuous inner ground/power plane and a thermal-via array of 0.3 mm pitch under the die. A heat spreader or heatsink is recommended for designs with sustained >70% utilization in still-air environments. Refer to Altera application note AN-358 for FBGA thermal layout guidelines.
Decouple the EP2S60F484C4N with bulk capacitors per the Stratix II pin connection guidelines: 100 uF tantalum or polymer per supply rail, 10 uF ceramic near each VCCIO/VCCINT pair, and 100 nF ceramic at every power/ground ball pair within 5 mm of the package. Power-up sequencing must drive VCCINT (1.2 V) before VCCIO (1.5-3.3 V) within 100 ms, otherwise the device may latch up or fail to configure. Use Altera's recommended power sequencer or a discrete RC delay on the enable pin of the VCCIO regulator.
Route all differential pairs (LVDS/LVPECL) with 100 ohm controlled-impedance traces within 1 mm length-matching tolerance, and keep SERDES reference clocks (if used externally) routed on inner stripline layers with continuous reference planes. The 334 user I/Os span 8 I/O banks; place 100 nF decoupling within 2 mm of every I/O bank supply ball. Use blind/buried micro-vias for BGA escape routing to free surface routing for signal traces; signal integrity simulations (HyperLynx or ADS) should be run on DDR2 interfaces before tape-out.
Common pitfalls when designing with the EP2S60F484C4N include: (1) ignoring the C3 vs C4 speed-grade performance delta - designs that close timing on C4 may fail on C3; (2) forgetting the MSEL[2:0] pin strap configuration for the chosen configuration mode (passive serial, FPP, JTAG); (3) leaving CONFIG_DONE floating - it must be pulled up to VCCIO with a 10 kohm resistor; (4) underestimating Quartus II compile time - large Stratix II designs may take 1-4 hours per compile iteration; (5) using a non-Altera-supported configuration device - only EPCS/EPCQ serial flash or compatible parallel flash is validated.
Thông tin tuân thủ
The EP2S60F484C4N carries the N-suffix indicating lead-free ball finish per Intel/Altera ordering code conventions. RoHS, REACH, halogen-free, and conflict-mineral declarations are not available in the verified web data and should be requested from Intel. AEC-Q100 is not applicable for FPGAs (automotive qualification program targets standalone ICs, not complex programmable logic devices).
