EP3C40U484I7 - 40K LE Cyclone III FPGA, 484-FBGA | Intel / Altera
Référence : EP3C40U484I7 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $71.2 | $712,00 |
| 100 | $63.85 | $6 385,00 |
| 500 | $57.4 | $28 700,00 |
| 1 000 | $52.1 | $52 100,00 |
EP3C40U484I7 Présentation
A Cyclone III FPGA is a low-power, low-cost SRAM-based programmable logic device built on TSMC's 65 nm low-power process. It sits in the broader programmable-logic taxonomy above generic logic ICs and below ASICs, providing hardware-configurable parallel processing, flexible I/O, and on-chip memory blocks without the NRE cost of custom silicon. The 'U' in the part number denotes the UBGA (Ultra FineLine BGA) package, and 'I7' marks the industrial temperature grade combined with speed grade 7 internal timing.
Key features include 39,600 logic elements (LEs), 113 M9K embedded memory blocks (1,161,216 total RAM bits), four general-purpose PLLs, 56 embedded 18x18 multipliers (suitable for DSP functions), and 8 clock networks per device quadrant. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across 8 I/O banks, with per-pin dynamic slew-rate and programmable drive strength.
Architecturally, Cyclone III FPGAs use a 4-input lookup table (LUT) logic element with an associated register, true-dual-port M9K memory blocks, and dedicated multiplier/adder blocks for DSP. The 65 nm process and on-chip decoupling deliver low static and dynamic power, while configuration is stored in external serial or parallel flash (active serial, active parallel, passive serial, or JTAG modes).
Typical applications include industrial motor control, video processing pipelines, software-defined radio front-ends, low-cost ASIC prototyping, and embedded vision systems. The combination of plentiful multipliers, abundant block RAM, and high I/O count also suits test-and-measurement and communications infrastructure designs.
When designing with this part, pay close attention to the 484-FBGA breakout - it requires a 1.0 mm ball pitch PCB with HDI (microvia) stack-up. Power-decoupling requires multiple bulk + 0.1 uF + 0.01 uF caps per VCCINT/VCCIO region, and JTAG chain length must accommodate the configuration controller's TCK setup time.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes - including U484 vs F484 footprint trade-offs - that are not consolidated on any single manufacturer or distributor page.
Alternatives de remplacement direct pour EP3C40U484I7 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C40U484I7 (même facteur de forme et même empreinte) — différant par Package, Family, Process Technology, Speed Grade, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3C40U484I7N
✅ Remplacement direct✓ En stock
$118.8 / unité
Voir la fiche technique →EP3C40U484C8N
✅ Remplacement direct✓ En stock
$71.04 / unité
Voir la fiche technique →EP3C40U484C7N
✅ Remplacement direct✓ En stock
$119.4 / unité
Voir la fiche technique →EP3C40U484C7
✅ Remplacement direct✓ En stock
$56.2 / unité
Voir la fiche technique →EP3C40U484C6N
✅ Remplacement direct✓ En stock
$50.2 / unité
Voir la fiche technique →EP3C40U484I7 Valeurs maximales et caractéristiques électriques
| Series | Cyclone® III |
| Logic Elements (LEs) | 39,600 |
| Embedded Memory (RAM bits) | 1,161,216 (113 x M9K) |
| Embedded Multipliers (18x18) | 56 |
| User I/Os | 331 (max) |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Boîtier | 484-FBGA (UBGA, U484) |
| Ball Pitch | 1.0 mm |
| Package Dimensions | 19x19 mm |
| Process Node | 65 nm TSMC low-power |
| Speed Grade | 7 (fastest in U484) |
| Temperature Grade | Industrial (-40C to +100C Tj) |
| Supply Voltage VCCINT | 1.2 V (core) |
| Supply Voltage VCCIO | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Configuration Modes | Active Serial, Active Parallel, Passive Serial, JTAG |
| Type de montage | Surface Mount (BGA) |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
Guide de configuration des broches du EP3C40U484I7 19x19 mm
Configuration des broches du EP3C40U484I7 (boîtier 19x19 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3C40U484I7.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3C40U484I7 convient pour 6 applications: Industrial Motor Control, Video Processing & Display Pipelines, Software-Defined Radio Front-End, ASIC Prototyping & Emulation, Test & Measurement Instrumentation, Embedded Machine Vision.
Industrial Motor Control
The EP3C40U484I7 is well suited for multi-axis industrial motor control (BLDC, PMSM, stepper, ACIM) where the 56 embedded 18x18 multipliers execute field-oriented-control (FOC) and space-vector PWM transforms at low latency. The 39,600 LEs host the controller state machine, encoder interface (QEP / SSI), and protection logic, while the 1,161,216 RAM bits buffer current/voltage sample streams and lookup tables. Operating at VCCINT = 1.2 V and VCCIO = 3.3 V with industrial -40C to +100C junction support, the device survives factory-floor temperature swings without thermal derating. Place a 4-layer PCB with 1.0 mm microvia stack-up and bulk + 0.1 uF decoupling per PLL/M9K cluster; a 50 MHz external oscillator feeds an enhanced PLL to derive the PWM and ADC sample clocks.
Recommandé
Video Processing & Display Pipelines
The EP3C40U484I7 supports real-time video processing pipelines (deinterlacing, color-space conversion, scaling, alpha blending) at common resolutions up to 1080p60 because its 4-input LUTs and dedicated multiplier/adder blocks implement per-pixel arithmetic in parallel. The 331 user I/Os comfortably absorb 24-bit RGB buses, sync/blanking signals, and BT.656/1120 control channels; LVDS pairs drive large TFT panels over FPD-Link-style interfaces. The 1,161,216 M9K-RAM bits line-buffer a full 1920x1080 frame with 16-bit precision; 4 PLLs generate pixel, memory, and SDRAM clocks from a single 27 MHz crystal. Industrial temperature grade allows deployment in outdoor kiosk and automotive infotainment units where ambient exceeds 70C.
Recommandé
Software-Defined Radio Front-End
The EP3C40U484I7 fits baseband SDR designs where its 56 18x18 multipliers handle DDC/DUC, FFT, and channelization filters for sub-50 MHz bandwidth signals, and its M9K blocks implement matched filters and symbol-rate FIFOs. The 4 enhanced PLLs synthesize independent LO/sampling clocks from a single TCXO, while LVDS pairs accept high-speed ADC data at >500 MSPS. With VCCINT = 1.2 V and TSMC 65 nm low-power process, the device draws roughly half the power of an equivalent Cyclone II design - critical for battery-powered man-pack radios. Industrial -40C to +100C Tj rating supports outdoor tactical and field-deployment use; mount on a 4-layer PCB with impedance-controlled 50 ohm microstrip for ADC interfaces.
Recommandé
ASIC Prototyping & Emulation
The EP3C40U484I7 serves as a low-cost ASIC/ASSP prototyping vehicle for designs up to 39,600 LEs - covering many industrial microcontroller-class SoCs. The 1,161,216 M9K bits emulate SRAM and cache, while the 331 user I/Os map to the prototype ASIC's peripheral pads through header connectors. The Quartus Prime software provides logic-lock regions so multiple designers can partition the die without conflicting, and AS-mode boot from EPCS flash enables standalone prototype demos without a host PC. Industrial temperature grade means the prototype can be exercised under realistic thermal conditions; BGA break-out requires 1.0 mm microvia PCB stack-up - HDI is mandatory for this package.
Recommandé
Test & Measurement Instrumentation
The EP3C40U484I7 integrates protocol engines, capture buffers, and stimulus generation for bench-top instruments such as protocol analyzers, custom logic analyzers, and arbitrary waveform generators. The 39,600 LEs implement decoding for I2C/SPI/UART/CAN/JTAG, while M9K blocks buffer trace records; LVDS pairs drive high-speed ADC/DAC interfaces up to 1 Gbps. The industrial -40C to +100C operating range allows lab-to-field deployments without component changes, and the UBGA U484 package's 1.0 mm pitch provides excellent thermal dissipation through the inner balls. Power decoupling: place 10 uF bulk + 0.1 uF + 0.01 uF ceramic per VCCINT region, and route all PLL analog supplies through ferrite beads.
Recommandé
Embedded Machine Vision
The EP3C40U484I7 enables cost-optimized embedded machine-vision designs (defect inspection, barcode reading, traffic enforcement) where the 56 18x18 multipliers accelerate convolution kernels and the M9K blocks act as line buffers for sliding-window operations. LVDS pairs accept MIPI-CSI-2 bridge outputs from inexpensive image sensors at sub-Gbps data rates, and the 331 user I/Os expose Ethernet PHYs, LCDs, and motor drivers directly. Industrial -40C to +100C temperature rating supports outdoor deployments such as ANPR cameras and roadside units; the U484 UBGA's 1.0 mm ball pitch enables compact 4-layer PCB designs under 50x50 mm. Boot from EPCS16 via AS mode and reconfigure over JTAG for firmware updates.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3C40U484I7 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C40U484I7N | EP3C40U484C8N | EP3C40U484C7N | EP3C40U484C7 | EP3C40U484C6N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (U484 UBGA) | 484-FBGA (U484 UBGA) - same | 484-FBGA (U484 UBGA) - same | 484-FBGA (U484 UBGA) - same | 484-FBGA (U484 UBGA) - same | 484-FBGA (U484 UBGA) - same |
| Logic Elements (LEs) | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 |
| Embedded RAM (bits) | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 |
| Embedded 18x18 Multipliers | 56 | 56 | 56 | 56 | 56 | 56 |
| User I/Os (max) | 331 | 331 | 331 | 331 | 331 | 331 |
| Temperature Grade | Industrial (-40C to +100C Tj) | Industrial (-40C to +100C Tj) | Commercial (0C to +85C Tj) | Commercial (0C to +85C Tj) | Commercial (0C to +85C Tj) | Commercial (0C to +85C Tj) |
| Speed Grade | 7 (fastest) | 7 | 8 (slower) | 7 | 7 | 6 (slower) |
| Lead-Free Finish | No (original Altera finish) | Yes (Pb-free, RoHS) | Yes (Pb-free, RoHS) | Yes (Pb-free, RoHS) | No | Yes (Pb-free, RoHS) |
| 1k-unit price (USD, approx) | $52.10 | $54.50 | $48.20 | $46.10 | $42.80 | $40.40 |
Principaux différenciateurs
- Industrial temperature grade in identical U484 footprint (vs EP3C40U484C8N)
- Faster speed grade than C8/C6 alternatives (vs EP3C40U484C8N)
- Lead-free RoHS finish over original Altera finish (vs EP3C40U484I7N)
- High user-I/O count in UBGA package (vs EP3C40F484I7N)
Notes de conception
The EP3C40U484I7 ships in a 484-ball UBGA with 1.0 mm pitch, requiring HDI (microvia) PCB stack-up. Use a 4-layer stack-up: top signal / GND / PWR / bottom signal; escape each BGA ball with a 0.4 mm microvia to the GND layer, and route signal traces on the bottom layer through buried vias. Standard 0.2 mm pad-to-pad clearance is achievable with 4-mil traces; for 3-mil escape, switch to 6-layer stack-up. Always flood the inner layers under the BGA with a continuous GND pour for return-current integrity.
Power the EP3C40U484I7 from a low-noise source: VCCINT = 1.2 V with +/-5% tolerance, and VCCIO bank-dependent (1.2/1.5/1.8/2.5/3.3 V). Place one 10 uF bulk + one 0.1 uF + one 0.01 uF ceramic cap per VCCINT region per Quartus pin connection guidelines, and route each PLL analog supply (VCCA, VCCD_PLL) through a ferrite bead from a quiet analog plane. Estimated core current at 100% utilization is 1.0-1.5 A; budget for a 2 A LDO or DC-DC regulator.
Differential-pair length matching is mandatory for LVDS interfaces: keep intra-pair skew < 50 ps, inter-pair skew < 200 ps. Use the dedicated true-LVDS input pins only (Cyclone III does not support LVDS on regular LVDS-emulated pairs at >1 Gbps). Place 100 ohm differential termination resistors within 7 mm of the receiver pin, and route pairs over a continuous GND reference plane to control impedance at 100 ohm differential.
JTAG chain integrity matters on a 484-BGA with high pin density. Drive TCK with a 4.7 kohm pull-up to VCCIO_3V3 and add a 33 ohm series damping resistor at the FPGA TCK pin to suppress ringback. The TMS and TDI lines also need pull-ups; TDO should be left floating at the FPGA and pulled only if a single-device chain is used. Keep JTAG trace lengths under 6 inches and avoid stubs.
Do not confuse EP3C40U484I7 (UBGA U484) with EP3C40F484I7 (standard FBGA F484) - the U and F package suffixes denote different ball patterns and PCB land layouts, so they are NOT drop-in compatible at the PCB level despite sharing the same die. Also avoid specifying 'U484C7' for industrial designs - that is a commercial 0-85C grade part and will fail below 0C. For boot configuration, ensure the EPCS flash family supports the specific Cyclone III AS-mode protocol (EPCS1/4/16/64/128).
Informations de conformité
RoHS/REACH compliant per Intel product page. The EP3C40U484I7 is industrial temperature grade but is NOT AEC-Q100 qualified - for automotive applications choose the EP3C40U484I7N variant only after consulting Intel FAE. Original Altera ball finish is not lead-free; for lead-free RoHS assembly, choose the EP3C40U484I7N variant (same die/package).
