EP3C5M164C7N - Cyclone III FPGA 5K LEs 164-MBGA | Intel / Altera
Référence : EP3C5M164C7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $28.8 | $288,00 |
| 100 | $24.1 | $2 410,00 |
| 500 | $19.75 | $9 875,00 |
| 1 000 | $17.2 | $17 200,00 |
EP3C5M164C7N Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, embedded memory, and hardened I/O, all of which can be re-wired by the user after manufacturing. FPGAs sit hierarchically between standard microcontrollers and ASICs in the design complexity spectrum, offering hardware-level parallelism that microcontrollers cannot match, while costing far less than a full ASIC for low-to-medium volumes. The Cyclone III family specifically targets applications requiring thousands of logic elements at single-digit-watt power budgets.
Key features of the EP3C5M164C7N include 5,136 logic elements, approximately 423 Kbits of embedded M9K RAM, 23 embedded 18x18 multipliers (PLL/DSP blocks), up to 4 PLLs for clock management, and support for external memory interfaces including DDR/DDR2/QDRII SDRAM. The 164-MBGA package combines small footprint with high I/O count, and the commercial temperature grade suits industrial control, consumer electronics, and prototype designs.
Typical applications include motor control and drive interfaces, LED display controllers, video processing pipelines, industrial machine vision, low-cost software-defined radio front-ends, and educational/development platforms where a balance of logic capacity, I/O count, and unit cost is critical. The 164-ball MBGA package also enables compact PCB layouts in space-constrained products.
When designing with this device, ensure proper decoupling (100 nF + bulk caps near each VCC/ground pair), strict length-matched routing for DDR memory interfaces, and adequate thermal relief via inner copper ground planes. The configuration scheme (JTAG, AS, or PS) must be decided early; the EPCS serial configuration device typically pairs with Cyclone III in production.
Alternatives de remplacement direct pour EP3C5M164C7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3C5M164C7N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Configuration Modes, Embedded Memory, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3C5M164I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$23.4 / unité
Voir la fiche technique →EP3C10M164C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP3C5M164C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$14.5 / unité
Voir la fiche technique →EP3C5F256C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$14.2 / unité
Voir la fiche technique →EP3C5M164C7N Valeurs maximales et caractéristiques électriques
| Family | Cyclone III |
| Device Logic Elements | 5,136 |
| Total Memory Bits | 423,936 bits |
| Embedded Memory | M9K blocks (RAM) |
| Embedded Multipliers (18x18) | 23 |
| User I/O Pins | 106 (max) |
| Boîtier | 164-ball MBGA (8x8 mm, 0.5 mm pitch) |
| Process Technology | 65 nm TSMC low-power |
| PLLs | 4 |
| Température de fonctionnement | 0C to +85C (commercial) |
| Speed Grade | 7 |
| Configuration Mode | JTAG / Active Serial (AS) / Passive Serial (PS) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Statut RoHS | Compliant |
Configuration des broches de EP3C5M164C7N
| Broche A1 | I/O — User I/O - bank 1 |
| Broche A13 | I/O — User I/O - bank 8 |
| Broche M1 | GND — Ground |
| Broche M13 | GND — Ground |
| Broche N1 | I/O — User I/O - bank 4 |
| Broche N13 | VCCIO — I/O supply bank 4 |
| Broche F7 | VCCINT — Core supply 1.2V |
| Broche G7 | VCCINT — Core supply 1.2V |
| Broche D11 | CONFIG_DONE — Configuration done signal |
| Broche E11 | nCONFIG — Configuration start (active low) |
Applications typiques
EP3C5M164C7N convient pour 6 applications: Industrial Motor Control, LED Video Display Controllers, Industrial Machine Vision, Software-Defined Radio Front-End, Educational FPGA Development Platforms, Custom Industrial Protocol Bridges.
Industrial Motor Control
The EP3C5M164C7N fits single-axis and dual-axis BLDC / stepper motor controllers where logic capacity under 8K LEs is sufficient for PWM generation, encoder interface (QEP), and CAN/RS-485 comms. With 4 PLLs it can derive precise PWM carrier frequencies and quadrature clock domains from a single 50 MHz crystal; the 23 18x18 multipliers handle field-weakening math in sensorless FOC loops. Its 65 nm low-power process keeps total board power below 2W even with all 106 I/Os toggling - critical for enclosed industrial cabinets. The 164-MBGA package also enables compact inverter daughter-cards.
Recommandé
LED Video Display Controllers
The EP3C5M164C7N's 106 user I/Os and 423 Kbits of M9K block RAM make it well suited for scan-based LED display drivers that multiplex 8-16 panels per FPGA. Designers can implement gamma correction LUTs in BRAM and run pixel-data refresh at 100+ MHz, supporting up to 1/16 scan RGB panels at 1920x1080. The 4 PLLs synchronize pixel clock and row/column shift clock domains, while 23 dedicated 18x18 multipliers accelerate colour-space conversion. Commercial 0-85C temperature range suits indoor/outdoor-cabinet designs with modest airflow.
Recommandé
Industrial Machine Vision
The EP3C5M164C7N supports entry-level machine-vision pipelines (MIPI-CSI2, LVDS, parallel CMOS sensor ingest) at up to 720p resolution using its 23 multipliers for Sobel/median filters and 4 PLLs for pixel-clock generation. The 423 Kbits of M9K memory buffers line-scan images while embedded hardware multipliers accelerate edge detection without CPU offload. I/Os accommodate the LVDS pairs plus UART / Ethernet MII to a host processor. Low 65 nm power keeps thermals low inside sealed camera housings.
Recommandé
Software-Defined Radio Front-End
The EP3C5M164C7N implements SDR baseband pre-processing (DDC/DUC, FIR filtering, NCO synthesis) up to ~50 MHz of baseband bandwidth thanks to its 23 18x18 multipliers and 4 PLLs for LO/sample-rate synthesis. M9K blocks hold FIR coefficients and window buffers. The 65 nm low-power process suits battery-powered portable SDR kits where total board power is capped near 3W. I/Os handle AD/DA data plus a serial configuration link from a host MCU.
Recommandé
Educational FPGA Development Platforms
The EP3C5M164C7N's low unit cost (~$17 at qty 1000) and 5,136-LE logic capacity make it a frequent choice for university FPGA labs and low-cost developer kits that exercise the full Quartus Prime toolchain. Students can implement RISC-V soft cores (e.g., PicoRV32) plus peripherals, learning PLL configuration, M9K FIFO design, and JTAG debugging in commercial temperature-range labs. Its 164-MBGA package is small enough for credit-card-sized boards while exposing enough I/Os for breadboard-friendly PMOD expansion.
Recommandé
Custom Industrial Protocol Bridges
The EP3C5M164C7N bridges legacy industrial protocols (RS-485 Modbus, Profibus, parallel fieldbus) to modern Ethernet/IP or OPC-UA via its flexible I/O bank structure and 4 PLLs that generate any necessary baud clock. With 106 user I/Os it can host several UART channels and an MII/RMII Ethernet MAC in parallel, plus a Nios II soft CPU for protocol stack handling. The commercial 0-85C temperature range suits control-panel environments without extended-temp requirements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3C5M164C7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3C5M164I7N | EP3C10M164C7N | EP3C5M164C8N |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 164-ball MBGA (M164) | 164-ball MBGA (M164) | 164-ball MBGA (M164) | 164-ball MBGA (M164) |
| Logic Elements | 5,136 | 5,136 | 10,320 | 5,136 |
| Embedded Memory (bits) | 423,936 | 423,936 | 423,936 | 423,936 |
| Embedded 18x18 Multipliers | 23 | 23 | 23 | 23 |
| User I/Os (max) | 106 | 106 | 106 | 106 |
| Speed Grade | 7 (commercial) | 7 (industrial) | 7 (commercial) | 8 (faster commercial) |
| Operating Temperature | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C |
Principaux différenciateurs
- Lowest-density Cyclone III in 164-MBGA (vs EP3C10M164C7N)
- Same footprint enables temperature-grade migration (vs EP3C5M164I7N)
- Faster speed grade available in same package (vs EP3C5M164C8N)
Notes de conception
The EP3C5M164C7N requires three rails: VCCINT 1.2V (core), VCCIO 1.5/1.8/2.5/3.3V (per I/O bank), and VCCAUX 2.5V (PLL/JTAG). Per the Cyclone III handbook, decouple each VCCINT ball with a 100 nF ceramic + 4.7 uF bulk cap placed within 5 mm; route power through a star topology from a common ferrite bead to suppress 65 nm core switching noise coupling into analog supplies.
Estimated: at typical 25% toggle rate and all 106 I/Os driving 8 mA loads, the EP3C5M164C7N dissipates approximately 1.5W. The 164-MBGA has theta_JA near 30 C/W on a 4-layer JEDEC test board, yielding a 45C junction rise above ambient - acceptable within the 0-85C commercial range without a heatsink, but for enclosed industrial cabinets add thermal vias to inner copper ground planes.
Use microvia-in-pad PCB technology for the 0.5 mm pitch MBGA to meet IPC-6012 Class 3 reliability. Per the Cyclone III handbook, route all differential pairs (LVDS, DDR DQS) with 100 ohm differential impedance and length-match within +/-10 mils; keep reference planes unbroken under the BGA to maintain supply integrity.
Do not leave JTAG TCK floating during power-up - it can place the FPGA into an undefined state. Pull nCONFIG high through a 1-10 kohm resistor to VCCAUX and tie MSEL[3:0] correctly for the desired configuration mode (AS=0101, PS=0000, JTAG=0000). Use the Quartus Pin Planner to assign CONFIG_DONE and nSTATUS to compatible I/O banks before compile.
Informations de conformité
RoHS and lead-free per Altera/Intel product marking 'N' suffix. Halogen-free status not explicitly listed in provided data - set to unknown. AEC-Q100 not applicable for commercial-grade FPGA.
