EP3C5M164C7N - Cyclone III FPGA 5K LEs 164-MBGA | Intel / Altera
부품 번호: EP3C5M164C7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $28.8 | $288.00 |
| 100 | $24.1 | $2,410.00 |
| 500 | $19.75 | $9,875.00 |
| 1,000 | $17.2 | $17,200.00 |
EP3C5M164C7N 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, embedded memory, and hardened I/O, all of which can be re-wired by the user after manufacturing. FPGAs sit hierarchically between standard microcontrollers and ASICs in the design complexity spectrum, offering hardware-level parallelism that microcontrollers cannot match, while costing far less than a full ASIC for low-to-medium volumes. The Cyclone III family specifically targets applications requiring thousands of logic elements at single-digit-watt power budgets.
Key features of the EP3C5M164C7N include 5,136 logic elements, approximately 423 Kbits of embedded M9K RAM, 23 embedded 18x18 multipliers (PLL/DSP blocks), up to 4 PLLs for clock management, and support for external memory interfaces including DDR/DDR2/QDRII SDRAM. The 164-MBGA package combines small footprint with high I/O count, and the commercial temperature grade suits industrial control, consumer electronics, and prototype designs.
Typical applications include motor control and drive interfaces, LED display controllers, video processing pipelines, industrial machine vision, low-cost software-defined radio front-ends, and educational/development platforms where a balance of logic capacity, I/O count, and unit cost is critical. The 164-ball MBGA package also enables compact PCB layouts in space-constrained products.
When designing with this device, ensure proper decoupling (100 nF + bulk caps near each VCC/ground pair), strict length-matched routing for DDR memory interfaces, and adequate thermal relief via inner copper ground planes. The configuration scheme (JTAG, AS, or PS) must be decided early; the EPCS serial configuration device typically pairs with Cyclone III in production.
드롭인 대체품: EP3C5M164C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3C5M164C7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Configuration Modes, Embedded Memory, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3C5M164I7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$23.4 / 개
데이터시트 보기 →EP3C10M164C7N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP3C5M164C8N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$14.5 / 개
데이터시트 보기 →EP3C5F256C7N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$14.2 / 개
데이터시트 보기 →EP3C5M164C7N 최대 정격 & 전기적 특성
| Family | Cyclone III |
| Device Logic Elements | 5,136 |
| Total Memory Bits | 423,936 bits |
| Embedded Memory | M9K blocks (RAM) |
| Embedded Multipliers (18x18) | 23 |
| User I/O Pins | 106 (max) |
| 패키지 | 164-ball MBGA (8x8 mm, 0.5 mm pitch) |
| Process Technology | 65 nm TSMC low-power |
| PLLs | 4 |
| 동작 온도 | 0C to +85C (commercial) |
| Speed Grade | 7 |
| Configuration Mode | JTAG / Active Serial (AS) / Passive Serial (PS) |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 |
| RoHS 상태 | Compliant |
EP3C5M164C7N 핀 구성
| 핀 A1 | I/O — User I/O - bank 1 |
| 핀 A13 | I/O — User I/O - bank 8 |
| 핀 M1 | GND — Ground |
| 핀 M13 | GND — Ground |
| 핀 N1 | I/O — User I/O - bank 4 |
| 핀 N13 | VCCIO — I/O supply bank 4 |
| 핀 F7 | VCCINT — Core supply 1.2V |
| 핀 G7 | VCCINT — Core supply 1.2V |
| 핀 D11 | CONFIG_DONE — Configuration done signal |
| 핀 E11 | nCONFIG — Configuration start (active low) |
일반적인 애플리케이션
EP3C5M164C7N 적합 용도: 6 애플리케이션s: Industrial Motor Control, LED Video Display Controllers, Industrial Machine Vision, Software-Defined Radio Front-End, Educational FPGA Development Platforms, Custom Industrial Protocol Bridges.
Industrial Motor Control
The EP3C5M164C7N fits single-axis and dual-axis BLDC / stepper motor controllers where logic capacity under 8K LEs is sufficient for PWM generation, encoder interface (QEP), and CAN/RS-485 comms. With 4 PLLs it can derive precise PWM carrier frequencies and quadrature clock domains from a single 50 MHz crystal; the 23 18x18 multipliers handle field-weakening math in sensorless FOC loops. Its 65 nm low-power process keeps total board power below 2W even with all 106 I/Os toggling - critical for enclosed industrial cabinets. The 164-MBGA package also enables compact inverter daughter-cards.
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LED Video Display Controllers
The EP3C5M164C7N's 106 user I/Os and 423 Kbits of M9K block RAM make it well suited for scan-based LED display drivers that multiplex 8-16 panels per FPGA. Designers can implement gamma correction LUTs in BRAM and run pixel-data refresh at 100+ MHz, supporting up to 1/16 scan RGB panels at 1920x1080. The 4 PLLs synchronize pixel clock and row/column shift clock domains, while 23 dedicated 18x18 multipliers accelerate colour-space conversion. Commercial 0-85C temperature range suits indoor/outdoor-cabinet designs with modest airflow.
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Industrial Machine Vision
The EP3C5M164C7N supports entry-level machine-vision pipelines (MIPI-CSI2, LVDS, parallel CMOS sensor ingest) at up to 720p resolution using its 23 multipliers for Sobel/median filters and 4 PLLs for pixel-clock generation. The 423 Kbits of M9K memory buffers line-scan images while embedded hardware multipliers accelerate edge detection without CPU offload. I/Os accommodate the LVDS pairs plus UART / Ethernet MII to a host processor. Low 65 nm power keeps thermals low inside sealed camera housings.
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Software-Defined Radio Front-End
The EP3C5M164C7N implements SDR baseband pre-processing (DDC/DUC, FIR filtering, NCO synthesis) up to ~50 MHz of baseband bandwidth thanks to its 23 18x18 multipliers and 4 PLLs for LO/sample-rate synthesis. M9K blocks hold FIR coefficients and window buffers. The 65 nm low-power process suits battery-powered portable SDR kits where total board power is capped near 3W. I/Os handle AD/DA data plus a serial configuration link from a host MCU.
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Educational FPGA Development Platforms
The EP3C5M164C7N's low unit cost (~$17 at qty 1000) and 5,136-LE logic capacity make it a frequent choice for university FPGA labs and low-cost developer kits that exercise the full Quartus Prime toolchain. Students can implement RISC-V soft cores (e.g., PicoRV32) plus peripherals, learning PLL configuration, M9K FIFO design, and JTAG debugging in commercial temperature-range labs. Its 164-MBGA package is small enough for credit-card-sized boards while exposing enough I/Os for breadboard-friendly PMOD expansion.
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Custom Industrial Protocol Bridges
The EP3C5M164C7N bridges legacy industrial protocols (RS-485 Modbus, Profibus, parallel fieldbus) to modern Ethernet/IP or OPC-UA via its flexible I/O bank structure and 4 PLLs that generate any necessary baud clock. With 106 user I/Os it can host several UART channels and an MII/RMII Ethernet MAC in parallel, plus a Nios II soft CPU for protocol stack handling. The commercial 0-85C temperature range suits control-panel environments without extended-temp requirements.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3C5M164C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3C5M164I7N | EP3C10M164C7N | EP3C5M164C8N |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 164-ball MBGA (M164) | 164-ball MBGA (M164) | 164-ball MBGA (M164) | 164-ball MBGA (M164) |
| Logic Elements | 5,136 | 5,136 | 10,320 | 5,136 |
| Embedded Memory (bits) | 423,936 | 423,936 | 423,936 | 423,936 |
| Embedded 18x18 Multipliers | 23 | 23 | 23 | 23 |
| User I/Os (max) | 106 | 106 | 106 | 106 |
| Speed Grade | 7 (commercial) | 7 (industrial) | 7 (commercial) | 8 (faster commercial) |
| Operating Temperature | 0C to +85C | -40C to +100C | 0C to +85C | 0C to +85C |
주요 차별점
- Lowest-density Cyclone III in 164-MBGA (vs EP3C10M164C7N)
- Same footprint enables temperature-grade migration (vs EP3C5M164I7N)
- Faster speed grade available in same package (vs EP3C5M164C8N)
설계 노트
The EP3C5M164C7N requires three rails: VCCINT 1.2V (core), VCCIO 1.5/1.8/2.5/3.3V (per I/O bank), and VCCAUX 2.5V (PLL/JTAG). Per the Cyclone III handbook, decouple each VCCINT ball with a 100 nF ceramic + 4.7 uF bulk cap placed within 5 mm; route power through a star topology from a common ferrite bead to suppress 65 nm core switching noise coupling into analog supplies.
Estimated: at typical 25% toggle rate and all 106 I/Os driving 8 mA loads, the EP3C5M164C7N dissipates approximately 1.5W. The 164-MBGA has theta_JA near 30 C/W on a 4-layer JEDEC test board, yielding a 45C junction rise above ambient - acceptable within the 0-85C commercial range without a heatsink, but for enclosed industrial cabinets add thermal vias to inner copper ground planes.
Use microvia-in-pad PCB technology for the 0.5 mm pitch MBGA to meet IPC-6012 Class 3 reliability. Per the Cyclone III handbook, route all differential pairs (LVDS, DDR DQS) with 100 ohm differential impedance and length-match within +/-10 mils; keep reference planes unbroken under the BGA to maintain supply integrity.
Do not leave JTAG TCK floating during power-up - it can place the FPGA into an undefined state. Pull nCONFIG high through a 1-10 kohm resistor to VCCAUX and tie MSEL[3:0] correctly for the desired configuration mode (AS=0101, PS=0000, JTAG=0000). Use the Quartus Pin Planner to assign CONFIG_DONE and nSTATUS to compatible I/O banks before compile.
규정 준수 정보
RoHS and lead-free per Altera/Intel product marking 'N' suffix. Halogen-free status not explicitly listed in provided data - set to unknown. AEC-Q100 not applicable for commercial-grade FPGA.
