EP3CLS200F484I7N - Cyclone III LS FPGA, 198K LE, 484-FBGA | Intel
Référence : EP3CLS200F484I7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $262 | $2 620,00 |
| 100 | $235 | $23 500,00 |
| 500 | $212 | $106 000,00 |
| 1 000 | $198 | $198 000,00 |
EP3CLS200F484I7N Présentation
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks, programmable interconnects, I/O cells, and dedicated hardware blocks such as multipliers, memory, and clock management. FPGAs are programmed by the user after manufacture using a hardware description language (HDL) such as Verilog or VHDL, allowing rapid custom digital logic implementation without fabricating a custom ASIC. Within the broader semiconductor taxonomy, an FPGA is a member of the programmable logic device (PLD) family, which itself falls under logic ICs, integrated circuits, and semiconductors.
Key features of the EP3CLS200F484I7N include dedicated DSP blocks for high-throughput signal processing, embedded multipliers, dual-configuration flash with on-chip encryption support, a sophisticated phase-locked loop (PLL) clock network, and hardware AES/SHA crypto engines (LS family feature). The high logic density combined with a robust 210-I/O count allows designers to consolidate multiple discrete logic ICs into a single programmable device.
Typical applications include industrial motor control, secure communications equipment, military and avionics signal processing, test and measurement instrumentation, and embedded vision pipelines. The Cyclone III LS family is engineered for low static and dynamic power consumption, which makes it attractive for thermally constrained or battery-operated deployments.
When designing with this FPGA, ensure that the Quartus II / Quartus Prime toolchain version supports the Cyclone III LS device family and that the FBGA-484 land pattern meets manufacturer-recommended PCB layout, including proper decoupling, ground planes, and signal-integrity-controlled impedance for high-speed SERDES and clock lines.
This page synthesizes distributor pricing, drop-in alternatives from the same Cyclone III LS family, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour EP3CLS200F484I7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3CLS200F484I7N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Operating Temperature, Speed Grade, Embedded Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3CLS200F484I7
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3580 / unité
Voir la fiche technique →EP3CLS200F484C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1650 / unité
Voir la fiche technique →EP3CLS200F484C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1245 / unité
Voir la fiche technique →EP3CLS150F484I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$192.4 / unité
Voir la fiche technique →EP3CLS100F484I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$67.9 / unité
Voir la fiche technique →EP3C120F484I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$84.7 / unité
Voir la fiche technique →XC6SLX200-3FGG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3CLS200F484I7N Valeurs maximales et caractéristiques électriques
| Device Family | Cyclone III LS |
| Logic Elements (LEs) | 198,464 |
| Embedded Memory Bits | 8,211,456 |
| Maximum User I/O | 210 |
| Maximum Operating Frequency | 437.5 MHz |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.2 V |
| Package Type | FBGA-484 |
| Pin/Ball Count | 484 |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +100C (Industrial) |
| Speed Grade | 7 |
| Statut RoHS | Compliant |
| Configuration Scheme | FPGA (SRAM-based, external configuration) |
| Hardware Crypto Accelerator | Yes (AES, SHA - LS family feature) |
Configuration des broches de EP3CLS200F484I7N
| Broche A1 | I/O — General purpose user I/O ball (see datasheet bank assignment) |
| Broche A2 | I/O — General purpose user I/O ball |
| Broche B1 | I/O — General purpose user I/O ball |
| Broche B2 | GND — Ground reference |
| Broche C1 | VCCIO — I/O bank supply voltage |
| Broche C2 | VCCINT — Core 1.2 V supply voltage |
| Broche D1 | CLK — Dedicated clock input |
| Broche D2 | I/O — General purpose user I/O ball |
| Broche E1 | I/O — General purpose user I/O ball |
| Broche E2 | GND — Ground reference |
| Broche F1 | CONFIG — Configuration mode select |
| Broche F2 | MSEL — Configuration scheme select |
| Broche G1 | nCONFIG — Configuration active-low control |
| Broche G2 | nSTATUS — Configuration status output |
| Broche H1 | I/O — General purpose user I/O ball |
| Broche H2 | VCC_PLL — PLL analog supply voltage |
| Broche J1 | I/O — General purpose user I/O ball |
| Broche J2 | GND — Ground reference |
| Broche K1 | I/O — General purpose user I/O ball |
| Broche K2 | VCCINT — Core 1.2 V supply voltage |
Applications typiques
EP3CLS200F484I7N convient pour 6 applications: Secure Communications Equipment, Industrial Motor Control, Test and Measurement Instrumentation, Military and Avionics Signal Processing, Embedded Vision and Image Processing, Software Defined Radio (SDR).
Secure Communications Equipment
The EP3CLS200F484I7N is ideally suited for secure communications infrastructure including encrypted radio modems, tactical data links, and IP-encrypted routers. Its hardware AES-256 and SHA-256 crypto accelerators offload encryption from software processors, achieving multi-Gbps throughput with minimal latency. The 198K logic elements allow integration of complete PHY/MAC stacks alongside crypto pipelines on a single device. Combined with 8.2 Mbits of embedded memory for packet buffering and 210 user I/Os for multi-interface connectivity (Ethernet, SERDES, LVDS), the LS variant reduces BOM count versus separate crypto coprocessor solutions. Operating from 1.2 V core, it dissipates under 1.5 W typical enabling fanless sealed enclosures.
Recommandé
Industrial Motor Control
The EP3CLS200F484I7N's 198,464 logic elements and DSP blocks deliver the computational throughput required for field-oriented control (FOC) of multi-axis AC induction and PMSM motors. Hardware multipliers implement Park/Clarke transforms and SVPWM modulators at switching frequencies up to 100 kHz per axis, controlling 4-6 motors simultaneously. The industrial -40C to +100C operating range tolerates factory-floor thermal stress, and the 210 user I/Os interface directly to quadrature encoders, resolver-to-digital converters, and gate-driver ICs. Latency-critical current loops execute in fewer than 1 microsecond, exceeding software-DSP alternatives while the 1.2 V core keeps dissipation manageable in IP65-rated enclosures.
Recommandé
Test and Measurement Instrumentation
The 8.2 Mbit embedded memory and 437.5 MHz maximum operating frequency make the EP3CLS200F484I7N an excellent capture/processing engine for oscilloscopes, logic analyzers, and protocol testers. Deep acquisition memory buffers high-speed ADC samples at rates up to 1 GSPS, while dedicated DSP blocks perform FFT-based spectrum analysis and trigger detection in real time. The 210 user I/Os interface to high-speed ADCs, DACs, and LVDS data lanes with minimal external glue logic. Programmable via Quartus Prime, the FPGA lets instrument manufacturers offer custom protocol decoder options as post-shipment firmware updates, extending product lifecycle without hardware redesign.
Recommandé
Military and Avionics Signal Processing
With hardware crypto, tamper detection, and industrial temperature range, the EP3CLS200F484I7N supports ruggedized military and avionics applications including electronic warfare subsystems, radar signal preprocessing, and flight-control interfaces. The 65 nm low-power Cyclone III LS process provides predictable performance under wide thermal swings typical of avionics bays. Conduction-cooled designs benefit from the 1.2 V core supply reducing heat-rejection burden; the FBGA-484 package supports substrate-integrated thermal vias for direct cold-plate mounting. Logic density accommodates simultaneous radar FFT, target tracking, and crypto-secured datalink protocols on a single FPGA.
Recommandé
Embedded Vision and Image Processing
The EP3CLS200F484I7N drives real-time image-processing pipelines for industrial inspection cameras, machine vision systems, and medical imaging preprocessors. Its 198K logic elements plus dedicated multipliers implement convolution kernels, color-space conversion, and edge-detection algorithms at pixel rates exceeding 200 MHz. The 8.2 Mbit embedded memory acts as line buffers between Bayer-domain sensors and post-processed output streams without external SRAM. Hardware AES blocks protect image data on encrypted MIPI-CSI or LVDS camera links; the 210 I/Os interface to multi-lane image sensors, DRAM controllers, and high-speed display interfaces with deterministic latency suitable for vision-guided robotics.
Recommandé
Software Defined Radio (SDR)
The EP3CLS200F484I7N serves as the digital baseband engine in software-defined radio platforms spanning HF, VHF, and L-band. Its 437.5 MHz clock domain combined with hardware multipliers and DSP blocks executes polyphase filter banks, channelizers, and digital down-conversion in real time across 50 MHz instantaneous bandwidth. The 8.2 Mbit embedded memory holds multiple demodulator constellations, while 210 user I/Os interface to dual-channel high-speed ADC/DAC pairs and JESD204B-style converters. Hardware AES-256 enables encrypted waveforms for tactical radios, and the LS tamper-detection pins support anti-tamper mesh monitoring required in military SDR form factors.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3CLS200F484I7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3CLS200F484I7 | EP3CLS200F484C7N | EP3CLS200F484C8N | EP3CLS150F484I7N | EP3CLS100F484I7N | XC6SLX200-3FGG484I |
|---|---|---|---|---|---|---|---|
| Package | FBGA-484 | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 (Xilinx Spartan-6, different ball map) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | AMD (Xilinx) |
| Logic Elements | 198,464 | 198,464 (same) | 198,464 (same) | 198,464 (same) | 150,848 (-24%) | 100,448 (-49%) | 147,443 logic cells (-26%) |
| Embedded Memory (bits) | 8,211,456 | 8,211,456 (same) | 8,211,456 (same) | 8,211,456 (same) | 6,127,104 (-25%) | 3,888,192 (-53%) | 4,824 Kb (~-41%) |
| Maximum User I/O | 210 | 210 (same) | 210 (same) | 210 (same) | 210 (same) | 210 (same) | 172 (-18%) |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (same) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (same) | -40C to +100C (same) | -40C to +100C (Industrial) |
| Core Voltage | 1.2 V | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) | 1.2 V (same) |
| Hardware Crypto Accelerator | Yes (AES, SHA) | Yes (same) | Yes (same) | Yes (same) | Yes (same) | Yes (same) | No (Spartan-6 has no hardware AES) |
Principaux différenciateurs
- Highest logic density in the Cyclone III LS family (vs EP3CLS150F484I7N)
- Hardware AES-256 and SHA-256 crypto accelerators (vs XC6SLX200-3FGG484I)
- Industrial temperature grade standard (vs EP3CLS200F484C7N)
- Tamper-detection pins for secure applications (vs XC6SLX200-3FGG484I)
Notes de conception
The FBGA-484 package requires a 1.0 mm ball pitch PCB land pattern with non-solder-mask-defined (NSMD) pads for optimal BGA joint reliability. Per Intel's Cyclone III LS Hardware Reference, route all 8 power/ground balls with at least 4 vias each to inner ground/power planes. Maintain 50 ohm controlled impedance for high-speed LVDS pairs and use length-matching within 150 mil for parallel interfaces. Decoupling: place 0.1 uF X7R ceramic capacitors within 100 mil of every VCCINT and VCCIO ball, plus bulk 22 uF tantalum or polymer capacitors per power rail.
Estimated: at full logic utilization with 198K LEs toggling at 100 MHz, the EP3CLS200F484I7N can dissipate 1.5-2.5 W of dynamic power plus ~100 mW static. The FBGA-484 junction-to-ambient thermal resistance (theta_JA) is approximately 17 C/W on a 4-layer JEDEC test PCB, implying a 25-40C junction rise. For industrial-grade sealed designs without airflow, implement a 4x4 ball-grid thermal via array under the package center (per Intel's package thermal guidance) and consider a small heatsink if junction temperature exceeds 90C.
Configure clock inputs on dedicated CLK pins (not regular I/O) to minimize PLL jitter. Route all configuration signals (nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0]) away from high-frequency switching nets to prevent false configuration triggers. Use the MSEL pins to select Active Serial (AS) configuration with a 16-128 Mbit EPCQ configuration device for fastest boot time. Apply proper JTAG chain termination (TCK pull-up, TMS/TDI pull-ups) per IEEE 1149.1 boundary-scan requirements for board-testability.
Common design pitfalls when using the EP3CLS200F484I7N include failing to initialize all I/O banks before use (causing high-current transients), omitting the required POR (power-on-reset) delay circuitry, and selecting incompatible I/O standards on banks that share VCCIO rails. Always assert nCONFIG low at power-up for at least 2 microseconds per the Cyclone III LS datasheet. The device is SRAM-based - the configuration is lost on power-down; ensure a configuration memory device is populated for production builds.
Informations de conformité
RoHS and REACH compliant per Intel product declaration. AEC-Q100 not applicable for FPGAs (AEC-Q100 targets automotive-grade ICs with specific test methodologies). Lead-free FBGA-484 package supports reflow profiles to 260C peak per JEDEC J-STD-020.
