EP3CLS200F484I8N - Cyclone III LS FPGA 198K LE 484-FBGA | Intel
Référence : EP3CLS200F484I8N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $168.5 | $1 685,00 |
| 100 | $152 | $15 200,00 |
| 500 | $138.25 | $69 125,00 |
| 1 000 | $125 | $125 000,00 |
EP3CLS200F484I8N Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor device containing configurable logic blocks, programmable interconnect, and I/O cells that engineers can re-program after manufacture to implement custom digital logic, DSP pipelines, or interface bridges. Within the broader taxonomy, the EP3CLS200 belongs to the Cyclone III LS sub-family, which is positioned as a low-power variant of the Cyclone III family optimized for power-sensitive applications while still delivering high logic density and embedded memory resources.
Key features of the EP3CLS200 include up to 198,464 logic elements, 8,211,456 bits of embedded memory, 4 Mb of general-purpose SRAM, dedicated 18x18 hardware multipliers for DSP operations, and 4 phase-locked loops for clock management. The device also integrates high-speed transceivers-free general-purpose I/O supporting LVDS, LVCMOS, SSTL, and HSTL standards, providing flexibility for connecting to DDR/DDR2 memories, parallel buses, and standard serial interfaces.
The Cyclone III LS architecture combines a low-static-power core with efficient logic and routing fabrics to achieve low dynamic power consumption without sacrificing performance. The 484-FBGA package exposes 8 user I/O banks and supports configuration via passive serial, fast passive parallel, and JTAG modes, allowing flexible boot from EPCS configuration devices, processors, or JTAG programmers.
Typical applications include industrial motor control, video surveillance and image processing, automotive driver-assistance, portable medical imaging, and consumer video/display processing. The combination of low power, high logic density, and ample DSP blocks makes it especially attractive for embedded vision and real-time control systems.
When designing with this FPGA, ensure the Quartus II design software version supports Cyclone III LS, verify that all I/O bank voltages meet the requirements of connected peripherals, and follow the recommended decoupling network and PCB layout guidelines in the Altera Device Package Information Data Sheet to maintain signal integrity at high toggle rates.
This page synthesizes distributor pricing, drop-in Cyclone III LS alternatives, application references, and design notes that go beyond the manufacturer datasheet to help engineers select and source the EP3CLS200F484I8N with confidence.
Alternatives de remplacement direct pour EP3CLS200F484I8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3CLS200F484I8N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Speed Grade, Process Technology, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3CLS200F484I7N
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →EP3CLS200F484C8N
✅ Remplacement direct✓ En stock
$1245 / unité
Voir la fiche technique →EP3CLS200F484C7N
✅ Remplacement direct✓ En stock
$1650 / unité
Voir la fiche technique →EP3CLS150F484I7N
✅ Remplacement direct✓ En stock
$192.4 / unité
Voir la fiche technique →EP3C120F484I7N
✅ Remplacement direct✓ En stock
$84.7 / unité
Voir la fiche technique →EP3CLS200F484I8N Valeurs maximales et caractéristiques électriques
| Family | Cyclone III LS |
| Device Type | FPGA |
| Logic Elements | 198,464 |
| Embedded Memory Bits | 8,211,456 |
| Maximum User I/O Pins | 230 (typical, package-dependent) |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.2 V |
| Maximum Operating Frequency | 402 MHz |
| Température de fonctionnement | -40C to +100C (industrial) |
| Speed Grade | 8 |
| Boîtier | 484-ball FBGA (FineLine BGA) |
| Type de montage | Surface Mount |
| Number of PLLs | 4 |
| Number of Global Clock Networks | 20 |
| Statut RoHS | Compliant |
Guide de configuration des broches du EP3CLS200F484I8N 484-ball fbga (fineline bga)
Configuration des broches du EP3CLS200F484I8N (boîtier 484-ball fbga (fineline bga)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3CLS200F484I8N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3CLS200F484I8N convient pour 7 applications: Industrial Motor Control, Video Surveillance and Image Processing, Automotive Driver Assistance, Portable Medical Imaging, Industrial Networking Gateways, Display Controllers and Projection Systems, Aerospace and Defense Prototyping.
Industrial Motor Control
The EP3CLS200F484I8N fits industrial motor control because its 198,464 logic elements, 8,211,456 bits of embedded memory, and 4 PLLs deliver the parallel computation headroom required for field-oriented control (FOC), space-vector PWM, and encoder feedback processing. The low-power 65 nm core reduces thermal stress inside sealed motor-drive enclosures, while the industrial -40C to +100C temperature grade tolerates factory-floor conditions. Placed on the control board, the FPGA processes current/voltage ADC samples in real time, generates gating signals for the IGBT stage, and runs safety logic concurrently with the main control loop - something a microcontroller typically cannot do at multi-MHz update rates.
Recommandé
Video Surveillance and Image Processing
The EP3CLS200F484I8N is well matched to multi-channel video surveillance systems because its 198K logic elements can host parallel video pipelines - Bayer demosaicing, 2D noise reduction, scaling, and H.264 pre-processing - simultaneously without throughput loss. The 8 Mbits of embedded M9K memory buffers multiple video frames on-chip, eliminating the need for external SDRAM frame stores in cost-optimized designs. The 4 PLLs derive independent pixel clocks for each video input, while LVDS I/O support allows direct attachment to megapixel CMOS sensors. Compared with DSPs, the FPGA architecture delivers deterministic latency required for real-time analytics.
Recommandé
Automotive Driver Assistance
The EP3CLS200F484I8N supports ADAS prototypes including lane-departure warning, blind-spot detection, and surround-view systems, where deterministic low-latency image processing is critical. Its 198K logic elements implement simultaneous computer-vision pipelines (edge detection, optical flow, object classification), and the 18x18 hardware multipliers accelerate the DSP blocks needed for filtering and feature extraction. Although the EP3CLS200 is industrial-grade rather than AEC-Q100 qualified, it is widely used in ADAS development platforms before qualification onto automotive-grade Cyclone V or Cyclone 10 parts.
Recommandé
Portable Medical Imaging
The EP3CLS200F484I8N suits portable medical imaging devices such as handheld ultrasound and digital colposcopes because its low-power 65 nm Cyclone III LS core enables fan-less battery-powered operation while still providing the DSP bandwidth required for beamforming and image reconstruction. The 198K logic elements run parallel beamforming paths for up to 64 channels, and the 8 Mbit embedded memory holds scan-line buffers for real-time display. Industrial temperature tolerance ensures reliable operation across hospital and field environments where ambient conditions vary widely.
Recommandé
Industrial Networking Gateways
The EP3CLS200F484I8N serves as a high-throughput protocol-conversion gateway in industrial networking, where it can implement multiple Ethernet MACs, PROFINET or EtherCAT slave controllers, and fieldbus bridges in parallel. Its 4 PLLs and 20 global clock networks synchronize independent network domains, while 8 Mbit embedded memory buffers large industrial frames. The FPGA's deterministic latency outperforms software stacks on microcontrollers, making it suitable for hard real-time EtherCAT slave implementations on the factory floor.
Recommandé
Display Controllers and Projection Systems
The EP3CLS200F484I8N drives large-format LED walls, multi-projector display walls, and digital signage controllers where it performs real-time geometry correction, edge blending, and color-space conversion across multiple output channels. With 198K logic elements and 4 PLLs, it can scale input video streams to multiple independent display outputs while maintaining pixel-accurate synchronization. The LVDS and DDR2 interfaces connect directly to high-speed display drivers, and the low-power core simplifies thermal design in enclosed signage cabinets.
Recommandé
Aerospace and Defense Prototyping
The EP3CLS200F484I8N supports aerospace and defense prototyping where radiation-tolerant hardware is unnecessary but high logic density and reconfigurability are essential. Engineers use it to prototype radar front-end processing, secure communications modems, and avionics display controllers before migrating to qualified rad-hard or rad-tolerant parts. Its 198K logic elements and abundant DSP blocks allow complex baseband processing, while the industrial temperature grade and robust FBGA package meet many ruggedized platform requirements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3CLS200F484I8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3CLS200F484I7N | EP3CLS200F484C8N | EP3CLS200F484C7N | EP3CLS150F484I7N | EP3C120F484I7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 | FBGA-484 |
| Logic Elements | 198,464 | 198,464 | 198,464 | 198,464 | 150,848 | 119,088 |
| Embedded Memory (bits) | 8,211,456 | 8,211,456 | 8,211,456 | 8,211,456 | 6,213,120 | 3,981,312 |
| Family | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III |
| Speed Grade | 8 | 7 (faster) | 8 | 7 (faster) | 7 (faster) | 7 (faster) |
| Temperature Grade | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm | 65 nm |
Principaux différenciateurs
- Low-power 65 nm core with full 198K logic-element density (vs EP3C120F484I7N)
- Industrial temperature grade with speed-grade 8 for cost-sensitive industrial designs (vs EP3CLS200F484I7N)
- Highest-density Cyclone III LS option in FBGA-484 package (vs EP3CLS150F484I7N)
Notes de conception
Estimated: Cyclone III LS FPGAs require multiple power rails - 1.2 V VCCINT for the core, 2.5 V VCCAUX for PLLs and configuration, and per-bank VCCIO from 1.2 V to 3.3 V. A typical EP3CLS200 design with 50% utilization and 100 MHz operation draws approximately 0.5-1.0 W dynamic power plus leakage. Use the Altera PowerPlay Early Power Estimator (EPE) spreadsheet for accurate budgeting before PCB layout.
The 484-ball FBGA package requires a 1.0 mm or 0.8 mm ball pitch PCB footprint with microvia or via-in-pad technology for reliable manufacturing. Reference the Altera Device Package Information Data Sheet for exact land pattern, ball diameter, and solder mask recommendations. Place decoupling capacitors (0.1 uF and 10 uF) within 100 mils of every VCCINT and VCCIO pin to minimize power-rail noise.
Do not confuse EP3CLS200 (Cyclone III LS, low-power) with EP3C200 (standard Cyclone III, higher power). They share the same FBGA-484 footprint but have different thermal and power profiles - substituting the wrong one can cause thermal shutdown. Also verify that the Quartus II version used supports the Cyclone III LS device family; Quartus 13.0 or 13.1 is commonly the last version with full Cyclone III LS support.
Assign high-speed differential pairs (LVDS) and DDR/DDR2 interfaces first in the Quartus II Pin Planner to ensure adequate signal integrity margins. Keep clock traces length-matched and isolated from switching I/O. Use inner PCB layers as reference ground planes and avoid routing signals across split power planes to prevent return-path discontinuities.
Informations de conformité
RoHS and REACH compliant per Intel product page. Industrial temperature grade is not AEC-Q100 qualified - use automotive-qualified Cyclone V or Cyclone 10 devices for AEC-Q100 applications.