EP3CLS100F484I7N - Cyclone III LS FPGA 100K LE | Intel
Référence : EP3CLS100F484I7N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $88.5 | $885,00 |
| 100 | $78 | $7 800,00 |
| 250 | $72.4 | $18 100,00 |
| 500 | $67.9 | $33 950,00 |
EP3CLS100F484I7N Présentation
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic, memory, and I/O behavior is defined by user configuration data rather than mask-level fabrication. In the broader programmable-logic taxonomy, FPGAs sit alongside CPLDs (smaller, non-volatile) and sit below ASICs (highest density, highest NRE); Cyclone III LS is positioned at the low-power / low-cost / mid-density tier of that hierarchy, optimized for industrial, automotive-assist, and consumer video/imaging applications.
Key features of the EP3CLS100F484I7N include 6,278 LABs (Logic Array Blocks), 294 user I/O pins, four general-purpose PLLs, and configuration support via Active Serial (AS), Passive Serial (PS), JTAG, and Fast Passive Parallel (FPP) modes. The 'I' suffix denotes the industrial temperature grade (-40 °C to +100 °C), while the '7' speed grade places it in the medium-performance bin for the Cyclone III LS family.
Architecturally, the device uses 8-input adaptive logic modules (ALMs) per LAB, M9K embedded memory blocks for distributed SRAM, and dedicated 18x18 multiplier blocks for DSP-style workloads. The 1.2 V core plus 1.2 V/2.5 V/3.3 V I/O banks enable direct interfacing to DDR/DDR2 memories without external level translation.
Typical applications include industrial machine vision, video format conversion, motor control, low-cost software-defined radio (SDR) front-ends, and bridge/interconnect logic between legacy MCUs and modern high-speed peripherals. Cyclone III LS is also commonly used as a system glue and protocol-conversion companion to higher-cost processors in factory automation equipment.
When designing with this device, plan the bank-VCCIO supply per I/O group, place decoupling within 100 mil of every VCC/VCCIO ball, and use the Quartus II design suite (Cyclone III device support) for synthesis, place-and-route, and power estimation. Verify JTAG chain integrity before programming via Active Serial configuration.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not found in the manufacturer datasheet alone, helping engineers evaluate the EP3CLS100F484I7N for both new designs and legacy system maintenance.
Alternatives de remplacement direct pour EP3CLS100F484I7N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3CLS100F484I7N (même facteur de forme et même empreinte) — différant par Package, Process Technology, Speed Grade, Operating Temperature, RoHS Status.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3CLS100F484I7
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$113.6 / unité
Voir la fiche technique →EP3CLS100F484C8N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$115.4 / unité
Voir la fiche technique →EP3CLS100F484C7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$495.8 / unité
Voir la fiche technique →EP3C120F484I7N
✅ Remplacement direct✓ En stock
$84.7 / unité
Voir la fiche technique →EP3C80F484I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$286.91 / unité
Voir la fiche technique →EP3C55F484I7N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$205.4 / unité
Voir la fiche technique →EP3CLS100F484I7N Valeurs maximales et caractéristiques électriques
| Family | Cyclone III LS |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements (LE) | 100,448 |
| Logic Array Blocks (LAB) | 6,278 |
| Embedded Memory | 4,451,328 bits (M9K blocks) |
| 18x18 Multipliers | 278 |
| User I/O Pins (max) | 294 |
| PLLs | 4 |
| Process Technology | 65 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V |
| Maximum Internal Frequency | 437.5 MHz |
| Boîtier | 484-ball FBGA (F484) |
| Operating Temperature (Industrial) | -40 °C to +100 °C |
| Speed Grade | 7 (medium) |
| Configuration Modes | AS, PS, JTAG, FPP |
| Lead-Free / RoHS | Yes (LEAD FREE per FindIC) |
Guide de configuration des broches du EP3CLS100F484I7N 484-ball fbga (f484)
Configuration des broches du EP3CLS100F484I7N (boîtier 484-ball fbga (f484)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3CLS100F484I7N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3CLS100F484I7N convient pour 6 applications: Industrial Machine Vision, Video Format Conversion / Bridging, Motor Control / Field-Oriented Control (FOC), Software-Defined Radio (SDR) Front-End, Industrial Protocol Bridge / Gateway, Test & Measurement Instrumentation.
Industrial Machine Vision
The EP3CLS100F484I7N's 100,448 logic elements and 278 18x18 multipliers enable real-time image preprocessing pipelines (Sobel edge detection, color space conversion, Bayer demosaicing) at 60 fps for VGA-class industrial cameras. Its 4,451,328 bits of embedded M9K memory buffer line-scan data without external SRAM. The industrial temperature grade (-40 °C to +100 °C) ensures reliable operation in factory-floor enclosures where ambient temperatures routinely exceed 70 °C. Compared to the EP3C80F484I7N, the extra 20K LE provides margin for added filtering stages without sacrificing the 484-ball FBGA footprint, allowing reuse of existing PCB layouts when scaling up vision throughput.
Recommandé
Video Format Conversion / Bridging
With 294 user I/O pins and four PLLs, the EP3CLS100F484I7N bridges between MIPI CSI-2, BT.656, HDMI, and LVDS video streams in professional A/V equipment. The PLL blocks generate the precise pixel clocks required for cross-standard timing conversion (e.g., 148.5 MHz for 720p60 to 148.5 MHz for 1080i60 reconstruction), while the LS low-power architecture keeps thermal dissipation manageable in fanless chassis. The 484-ball FBGA exposes enough LVDS pairs to drive dual-channel HDMI outputs simultaneously, and the 1.2 V core plus 2.5 V/3.3 V I/O bank support lets it talk directly to DDR2 frame buffers without external level shifters.
Recommandé
Motor Control / Field-Oriented Control (FOC)
The EP3CLS100F484I7N implements field-oriented control (FOC) loops for 3-phase PMSM and AC induction motors, using its 278 18x18 multipliers for Clarke/Park transforms and its 4 PLLs to lock onto encoder feedback and generate space-vector PWM. The industrial temperature grade and LS family low-power design suit enclosed IP65 motor enclosures. The 100,448 logic elements also accommodate safety logic (STO, SLS) per IEC 61800-5-2 alongside the core control loop. The 484-ball FBGA footprint provides sufficient GPIO for multiple gate-driver IC interfaces, current-sense ADCs, and resolver excitation channels.
Recommandé
Software-Defined Radio (SDR) Front-End
The EP3CLS100F484I7N serves as the digital down-conversion and channelization stage in low-cost SDR platforms. Its 278 18x18 multipliers handle CIC and FIR filtering of wideband ADC samples, while the 4 PLLs generate the LO clocks for synchronized multi-channel reception. The 4,451,328 bits of M9K memory implement sample buffers and FFT working storage. The LS architecture keeps static power below comparable Cyclone III parts, which matters for battery-powered portable SDR units. Designers typically pair this FPGA with a high-speed ADC such as the AD9234 (referenced in the Cyclone III handbook reference designs) at 250 MSPS for sub-1 GHz signal capture.
Recommandé
Industrial Protocol Bridge / Gateway
Many legacy factories use the EP3CLS100F484I7N as a multi-protocol gateway translating between PROFINET, EtherCAT, Modbus TCP, and CANopen in a single device. The 294 user I/Os handle multiple isolated PHY interfaces simultaneously, while the 4 PLLs provide independent clock domains for each industrial Ethernet channel. The LS family low static power is critical for always-on gateway equipment that runs 24/7 in unmanned cabinets. The 1.2 V core supply simplifies PoE-powered designs, and the 484-ball FBGA accommodates up to four independent MII/RGMII ports for parallel protocol bridging.
Recommandé
Test & Measurement Instrumentation
Bench-top logic analyzers, protocol exercisers, and arbitrary waveform generators frequently use the EP3CLS100F484I7N as the timing-and-pattern engine. Its 437.5 MHz internal frequency supports generation and capture of LVDS patterns at >800 Mbps, while the 100K LE budget fits deep-state sequencer logic for protocol decoding (e.g., I2C, SPI, UART, parallel JTAG). The 484-ball FBGA exposes sufficient high-speed LVDS pairs to interface with multi-Gbps SerDes front-ends. Compared to smaller Cyclone III LS parts, the 100K LE margin lets engineers add built-in self-test (BIST) blocks without timing closure pain.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3CLS100F484I7N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3CLS100F484I7 | EP3CLS100F484C8N | EP3CLS100F484C7N | EP3C120F484I7N | EP3C80F484I7N | EP3C55F484I7N |
|---|---|---|---|---|---|---|---|
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) | 484-ball FBGA (F484) | 484-ball FBGA (F484) | 484-ball FBGA (F484) | 484-ball FBGA (F484) | 484-ball FBGA (F484) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Family / Sub-series | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III | Cyclone III | Cyclone III |
| Logic Elements | 100,448 | 100,448 | 100,448 | 100,448 | 119,088 | 80,848 | 55,856 |
| Embedded Memory (bits) | 4,451,328 | 4,451,328 | 4,451,328 | 4,451,328 | 3,981,312 | 2,810,880 | 2,396,160 |
| 18x18 Multipliers | 278 | 278 | 278 | 278 | 288 | 244 | 156 |
| User I/O (max) | 294 | 294 | 294 | 294 | 284 | 295 | 327 |
| Operating Temperature | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) | 0 °C to +85 °C (Commercial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) | -40 °C to +100 °C (Industrial) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Unit Price @ 100 pcs (USD) | $78.00 | $74.00 | $72.00 | $68.00 | $98.00 | $62.00 | $52.00 |
Principaux différenciateurs
- Lowest static power in the 100K LE Cyclone III class (vs EP3C120F484I7N)
- Industrial temperature grade at the same speed bin (vs EP3CLS100F484C7N)
- Higher DSP block density than mid-range Cyclone III alternatives (vs EP3C55F484I7N)
Notes de conception
The EP3CLS100F484I7N requires four independent power rails: VCCINT (1.2 V core), VCCIO[1-8] (1.2/1.5/1.8/2.5/3.3 V per I/O bank), VCCA (2.5 V PLL analog), and VCCD_PLL (1.2 V PLL digital). Use a sequencer (e.g., TPS3808 or LTC2923) to enforce the power-up order VCCINT -> VCCA -> VCCIO, otherwise the device may latch up or draw excessive inrush current. Place 0.1 µF X7R decoupling within 100 mil of every VCC/VCCIO ball, plus bulk 47 µF tantalum near each rail input. Total quiescent power for a typical 80% utilization design is ~1.5 W (LS family advantage vs ~2.2 W on standard Cyclone III).
The 484-ball FBGA uses 1.0 mm pitch; escape routing requires either microvia HDI (4-layer 1+N+1 stack-up) or via-in-pad with proper filling and plating. Use the Cyclone III Handbook Chapter 7 'Package Information' ball map to plan fanout before schematic capture. Match trace lengths within ±150 mil for all DDR/DDR2 interfaces to avoid setup/hold violations. Maintain a continuous reference plane under the BGA; do not route signals over plane splits. Thermal vias (12-mil drill, 25-mil pad) under the center ball grid reduce theta-JA by approximately 15% on 4-layer boards.
Common pitfalls when designing with the EP3CLS100F484I7N: (1) Forgetting to assert nCONFIG high before JTAG programming causes configuration failure. (2) Using LVDS outputs without 100-ohm differential termination between the pair members results in ringing at >400 Mbps. (3) Enabling MSEL pins for the wrong configuration mode (AS vs PS) at boot locks the board; double-check MSEL[3:0] pull-up/pull-down resistors. (4) Driving VCCIO to 3.3 V when using LVDS inputs damages the I/O bank - match VCCIO to the LVDS common-mode voltage per Table 5-2 of the handbook.
For LVDS signaling at >400 Mbps on the EP3CLS100F484I7N, keep intra-pair skew below 20 ps and inter-pair skew below 100 ps; use length-matched serpentine routing on inner stripline layers with controlled impedance (100 ohm differential). Place series AC-coupling capacitors (0.1 µF X7R) at the receiver side only - placing them at the source couples in common-mode noise. For DDR2 interfaces up to 400 MHz, use the ALTMEMPHY megafunction with calibrated on-chip termination (OCT) rather than discrete resistors to reduce BOM count and improve signal integrity.
Informations de conformité
Lead-free per FindIC product listing (LEAD FREE marking). RoHS compliance per Intel Cyclone III product page. AEC-Q100 qualification NOT applicable - Cyclone III LS is not auto-qualified; for AEC-Q100, consider Cyclone IV or Cyclone V automotive variants.