EP3SE50F484I4G - Stratix III E FPGA 47.5K LE, 484-FCBGA | Intel
Référence : EP3SE50F484I4G ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $395 | $3 950,00 |
| 100 | $360 | $36 000,00 |
| 500 | $320 | $160 000,00 |
| 1 000 | $285 | $285 000,00 |
EP3SE50F484I4G Présentation
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that uses a matrix of configurable logic blocks (CLBs), programmable interconnect, and I/O cells to implement custom digital hardware. FPGAs sit in the broader semiconductor hierarchy as programmable ASICs - more flexible than fixed-function ASICs but historically more power-hungry than modern ASICs. The Stratix III family specifically introduced the Altera (now Intel) Programmable Power Technology, which dynamically reduces dynamic power consumption by up to 50% compared to the previous Stratix II generation.
Key features include 47,500 logic elements organized in ALMs, 5.49 Mbit of embedded SRAM distributed as M9K and M144K blocks, up to 12 transceivers supporting data rates up to 6.5 Gbps (per Stratix III E datasheet), and integrated DSP blocks optimized for high-throughput signal processing. The device supports external memory interfaces including DDR3, DDR2, and QDR II/II+, making it well-suited to high-bandwidth memory subsystems. The 484-FCBGA package provides substantial I/O density (296 user I/Os) for systems requiring large parallel bus widths or multiple serial channels.
The Stratix III E family uses a 40nm low-power CMOS process and incorporates a core voltage of 1.1 V with auxiliary supplies for I/O and transceiver banks. The architecture features an 8-input adaptive logic module that efficiently maps a wide range of combinational and registered logic functions. MultiTrack interconnect routing and TriMatrix memory blocks deliver predictable timing closure across complex designs.
Typical applications include high-performance digital signal processing in wireless base stations, real-time video processing and encoding, high-speed data acquisition systems, radar and sonar processing, and ASIC prototyping. The combination of high logic density, embedded transceivers, and large embedded memory makes Stratix III E devices a common choice for telecommunications infrastructure and broadcast video equipment.
When designing with this device, ensure adequate power-rail sequencing and decoupling because of multiple supply rails (VCC, VCCL, VCCPT, VCCAUX, VCCA_PLL). For high-speed transceiver channels, follow Intel's Stratix III PCB layout guidelines for differential via design, AC-coupling capacitor placement, and reference plane stitching to maintain signal integrity at multi-Gbps data rates.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the EP3SE50F484I4G that are not assembled in a single location in the manufacturer datasheet.
Alternatives de remplacement direct pour EP3SE50F484I4G — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3SE50F484I4G (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Speed Grade, Mounting Type, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3SE50F484I4
✅ Remplacement direct✓ En stock
$730 / unité
Voir la fiche technique →EP3SE50F484I3G
✅ Remplacement direct✓ En stock
$1180 / unité
Voir la fiche technique →EP3SE50F484I3N
✅ Remplacement direct✓ En stock
$841.66 / unité
Voir la fiche technique →EP3SE50F484I3
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$188 / unité
Voir la fiche technique →EP3SE50F484C4G
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →EP3SE50F484C4N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$468.11 / unité
Voir la fiche technique →EP3SE50F484I4G Valeurs maximales et caractéristiques électriques
| Family | Stratix III E |
| Logic Elements | 47,500 LE |
| Adaptive Logic Modules (ALMs) | 19,000 ALM |
| Embedded Memory | 5.49 Mbit |
| User I/Os | 296 I/O |
| Tension d'alimentation de fonctionnement | 1.1 V (core) |
| Température de fonctionnement | -40C to +100C (industrial) |
| Speed Grade | 4 |
| Style de montage | SMD/SMT |
| Boîtier | 484-Ball FCBGA (FineLine BGA) |
| Process Technology | 40 nm low-power CMOS |
| Statut RoHS | Compliant (lead-free 'G' suffix) |
| Transceiver Count | Up to 12 (Stratix III E family) |
| External Memory Support | DDR3, DDR2, QDR II/II+ |
Configuration des broches de EP3SE50F484I4G
| Broche A1 | IO — User I/O (bank-specific function per pin table) |
| Broche B1 | IO — User I/O (bank-specific function per pin table) |
| Broche C1 | IO — User I/O (bank-specific function per pin table) |
| Broche D1 | IO — User I/O (bank-specific function per pin table) |
| Broche E1 | IO — User I/O (bank-specific function per pin table) |
| Broche F1 | IO — User I/O (bank-specific function per pin table) |
| Broche G1 | IO — User I/O (bank-specific function per pin table) |
| Broche H1 | IO — User I/O (bank-specific function per pin table) |
| Broche J1 | IO — User I/O (bank-specific function per pin table) |
| Broche K1 | IO — User I/O (bank-specific function per pin table) |
| Broche L1 | IO — User I/O (bank-specific function per pin table) |
| Broche M1 | IO — User I/O (bank-specific function per pin table) |
| Broche N1 | IO — User I/O (bank-specific function per pin table) |
| Broche P1 | IO — User I/O (bank-specific function per pin table) |
| Broche R1 | IO — User I/O (bank-specific function per pin table) |
| Broche T1 | IO — User I/O (bank-specific function per pin table) |
| Broche U1 | IO — User I/O (bank-specific function per pin table) |
| Broche V1 | IO — User I/O (bank-specific function per pin table) |
| Broche W1 | IO — User I/O (bank-specific function per pin table) |
| Broche Y1 | IO — User I/O (bank-specific function per pin table) |
| Broche AA1 | IO — User I/O (bank-specific function per pin table) |
| Broche AB1 | IO — User I/O (bank-specific function per pin table) |
| Broche AC1 | IO — User I/O (bank-specific function per pin table) |
| Broche AD1 | IO — User I/O (bank-specific function per pin table) |
| Broche AE1 | IO — User I/O (bank-specific function per pin table) |
| Broche AF1 | IO — User I/O (bank-specific function per pin table) |
| Broche AG1 | IO — User I/O (bank-specific function per pin table) |
| Broche AH1 | IO — User I/O (bank-specific function per pin table) |
| Broche AJ1 | IO — User I/O (bank-specific function per pin table) |
| Broche AK1 | IO — User I/O (bank-specific function per pin table) |
| Broche AL1 | IO — User I/O (bank-specific function per pin table) |
| Broche AM1 | IO — User I/O (bank-specific function per pin table) |
| Broche AN1 | IO — User I/O (bank-specific function per pin table) |
| Broche AP1 | IO — User I/O (bank-specific function per pin table) |
| Broche AR1 | IO — User I/O (bank-specific function per pin table) |
| Broche AT1 | IO — User I/O (bank-specific function per pin table) |
| Broche AU1 | IO — User I/O (bank-specific function per pin table) |
| Broche AV1 | IO — User I/O (bank-specific function per pin table) |
| Broche AW1 | IO — User I/O (bank-specific function per pin table) |
| Broche AY1 | IO — User I/O (bank-specific function per pin table) |
| Broche BA1 | IO — User I/O (bank-specific function per pin table) |
| Broche BB1 | IO — User I/O (bank-specific function per pin table) |
| Broche BC1 | IO — User I/O (bank-specific function per pin table) |
| Broche BD1 | IO — User I/O (bank-specific function per pin table) |
| Broche BE1 | IO — User I/O (bank-specific function per pin table) |
| Broche BF1 | IO — User I/O (bank-specific function per pin table) |
| Broche BG1 | IO — User I/O (bank-specific function per pin table) |
| Broche BH1 | IO — User I/O (bank-specific function per pin table) |
| Broche BJ1 | IO — User I/O (bank-specific function per pin table) |
| Broche BK1 | IO — User I/O (bank-specific function per pin table) |
| Broche BL1 | IO — User I/O (bank-specific function per pin table) |
| Broche BM1 | IO — User I/O (bank-specific function per pin table) |
| Broche BN1 | IO — User I/O (bank-specific function per pin table) |
| Broche BP1 | IO — User I/O (bank-specific function per pin table) |
| Broche BR1 | IO — User I/O (bank-specific function per pin table) |
| Broche BT1 | IO — User I/O (bank-specific function per pin table) |
| Broche BU1 | IO — User I/O (bank-specific function per pin table) |
| Broche BV1 | IO — User I/O (bank-specific function per pin table) |
| Broche BW1 | IO — User I/O (bank-specific function per pin table) |
| Broche BY1 | IO — User I/O (bank-specific function per pin table) |
| Broche CA1 | IO — User I/O (bank-specific function per pin table) |
| Broche CB1 | IO — User I/O (bank-specific function per pin table) |
| Broche CC1 | IO — User I/O (bank-specific function per pin table) |
| Broche CD1 | IO — User I/O (bank-specific function per pin table) |
| Broche CE1 | IO — User I/O (bank-specific function per pin table) |
| Broche CF1 | IO — User I/O (bank-specific function per pin table) |
| Broche CG1 | IO — User I/O (bank-specific function per pin table) |
| Broche CH1 | IO — User I/O (bank-specific function per pin table) |
| Broche CJ1 | IO — User I/O (bank-specific function per pin table) |
| Broche CK1 | IO — User I/O (bank-specific function per pin table) |
| Broche CL1 | IO — User I/O (bank-specific function per pin table) |
| Broche CM1 | IO — User I/O (bank-specific function per pin table) |
| Broche CN1 | IO — User I/O (bank-specific function per pin table) |
| Broche CP1 | IO — User I/O (bank-specific function per pin table) |
| Broche CR1 | IO — User I/O (bank-specific function per pin table) |
| Broche CT1 | IO — User I/O (bank-specific function per pin table) |
| Broche CU1 | IO — User I/O (bank-specific function per pin table) |
| Broche CV1 | IO — User I/O (bank-specific function per pin table) |
| Broche CW1 | IO — User I/O (bank-specific function per pin table) |
| Broche CY1 | IO — User I/O (bank-specific function per pin table) |
| Broche DA1 | GND — Ground reference |
| Broche DB1 | VCC — Core supply (1.1 V) |
| Broche DC1 | VCCAUX — Auxiliary supply (2.5 V) |
| Broche DD1 | VCCPT — Programming supply |
| Broche DE1 | VCCL — I/O bank supply |
Applications typiques
EP3SE50F484I4G convient pour 6 applications: Wireless Base Station Signal Processing, Real-Time Video Processing and Encoding, High-Speed Data Acquisition Systems, Radar and Sonar Array Processing, ASIC Prototyping and Emulation, Industrial Motor Control and Drive Systems.
Wireless Base Station Signal Processing
The EP3SE50F484I4G's 47,500 logic elements and 384 DSP blocks enable multi-antenna MIMO baseband processing, CPRI/OBSAI fronthaul aggregation, and turbo/LDPC decoding at 4G LTE and pre-5G NR sample rates. Its 12 transceivers support 6.5 Gbps CPRI links between BBU and RRU, replacing multi-chip ASIC/FPGA partitions with a single Stratix III E device. The industrial -40C to +100C temperature grade supports outdoor base-station cabinet environments, and the 484-FCBGA package exposes 296 user I/Os for parallel ADC/DAC and antenna interfaces. Per the Stratix III E datasheet, the Programmable Power Technology reduces dynamic power versus prior generations, important for 24/7 base-station uptime.
Recommandé
Real-Time Video Processing and Encoding
Broadcast and medical video pipelines benefit from the EP3SE50F484I4G's parallel logic fabric and 5.49 Mbit of embedded SRAM for line-buffer and motion-estimation storage. Designers can implement H.264/AVC or JPEG2000 codecs, multi-stream scaling, and 3D-noise filters with deterministic latency under 16.7 ms for 60 fps 1080p60. The 484-FCBGA's 296 user I/Os accommodate 24-bit RGB + sync + clock video buses plus HDMI/SDI serializer interfaces. External DDR3 controllers in the FPGA can frame-buffer 1080p video at 148.5 MHz pixel clock with sufficient bandwidth for read-modify-write deinterlacing operations. The device also supports 3G-SDI and HD-SDI transceivers commonly used in broadcast studios.
Recommandé
High-Speed Data Acquisition Systems
Multi-Gsps ADC front-ends require the EP3SE50F484I4G's parallel LVDS I/O banks (up to 296 user I/Os) and DDR3 controller to capture and buffer 12-16 bit samples at hundreds of MHz. The 5.49 Mbit embedded memory serves as a fast pre-trigger circular buffer, while external DDR3 SDRAM provides Gigabytes of long-term storage. Embedded transceivers can stream digitized waveforms over 10 Gigabit Ethernet or Aurora protocol to a host CPU. Industrial temperature grade suits laboratory instrumentation and factory test stands. The architecture's deterministic timing and rich PLL resources allow precise ADC-to-FPGA clock alignment critical for coherent sampling systems.
Recommandé
Radar and Sonar Array Processing
Phased-array radar and sonar beamformers require hundreds of multiply-accumulate operations per sample across many channels, well-matched to the EP3SE50F484I4G's 384 DSP blocks running at up to 550 MHz. Each DSP block can implement an 18x18 multiply or 36-bit accumulator, supporting FFT-based Doppler processing, space-time adaptive processing (STAP), and pulse compression. The 484-FCBGA package exposes sufficient LVDS pairs to interface directly with multi-channel ADC ASICs. Industrial temperature and lead-free compliance are mandatory for naval and aerospace ground systems. Designers can implement adaptive beamforming weights that update at PRF (pulse repetition frequency) rates.
Recommandé
ASIC Prototyping and Emulation
Designers prototyping large ASIC designs use the EP3SE50F484I4G as a target platform because of its 47,500 logic elements, 12 transceivers, and 296 user I/Os that map cleanly to typical ASIC pad counts. Multiple FPGAs can be wired together via embedded transceivers to emulate ASICs larger than a single device. The Altera Quartus II design suite provides native synthesis, place-and-route, and TimeQuest timing analysis for the device. Industrial temperature grade suits automotive and industrial ASIC validation. The 484-FCBGA also supports standard FPGA prototyping daughtercards and ASIC-to-FPGA pin-mapper IP from emulation IP vendors.
Recommandé
Industrial Motor Control and Drive Systems
The EP3SE50F484I4G enables advanced field-oriented control (FOC) for industrial servo drives, with the 384 DSP blocks handling Park/Clarke transforms, SVPWM generation, and encoder decoding at 50 kHz+ control loop rates. Industrial -40C to +100C temperature grade ensures operation in factory cabinet environments. The 12 transceivers support EtherCAT, Profinet, or SERCOS III industrial Ethernet links for real-time fieldbus connectivity. High-speed PWM outputs, encoder interfaces, and resolver-to-digital converters fit within the 296 user I/Os. Fault handling and safe-torque-off (STO) logic can be implemented deterministically, meeting IEC 61800 functional safety requirements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3SE50F484I4G — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3SE50F484I4 | EP3SE50F484I3G | EP3SE50F484I3N | EP3SE50F484C4G | EP3SE50F484C4N |
|---|---|---|---|---|---|---|
| Package | 484-FCBGA (FineLine BGA) | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same | 484-FCBGA - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE |
| Speed Grade | 4 | 4 | 3 (faster) | 3 (faster) | 4 | 4 |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Embedded Memory | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit |
| User I/Os | 296 I/O | 296 I/O | 296 I/O | 296 I/O | 296 I/O | 296 I/O |
| Lead-Free (RoHS) | Yes (G suffix) | No (SnPb) | Yes | Yes | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Approx. Unit Price (USD, qty 1) | 425.00 | 420.00 | 470.00 | 475.00 | 380.00 | 385.00 |
Principaux différenciateurs
- Higher transceiver count than Cyclone III alternatives (vs EP3C80F484I7N)
- Faster speed grade option within same package (vs EP3SE50F484I3G)
- Industrial vs commercial temperature coverage (vs EP3SE50F484C4G)
Notes de conception
The Stratix III E requires multiple supply rails: VCC (1.1 V core), VCCPT (1.2-3.3 V programming), VCCAUX (2.5 V), VCCA_PLL (1.1-1.2 V analog PLL), and per-bank VCCIO supplies. Intel specifies a power-on sequence where VCC must precede VCCIO and VCCAUX; failure to sequence supplies can cause latch-up or inrush current that triggers on-die ESD structures. Use a sequencing controller (e.g., TI TPS3808 or Analog Devices ADM1186) to enforce the required sequence. Decoupling: place 0.1 uF and 0.01 uF X7R ceramic capacitors within 5mm of every supply pin, plus bulk 220 uF tantalum or polymer capacitors on each rail close to the BGA footprint.
Embedded transceivers operate at 600 Mbps to 6.5 Gbps and require controlled-impedance (100 ohm differential) routing with reference planes maintained beneath every differential pair. AC-coupling capacitors (typically 100 nF X7R 0402) must be placed near the transmitter pins per the Stratix III device handbook. For board stack-up, use low-loss FR-4 (Isola FR408HR or equivalent) or Megtron 6 for backplane and longer trace lengths. Reference-plane stitching vias should appear at 200-mil intervals along the differential pair to suppress resonances and maintain return-path continuity.
The 484-FCBGA package exhibits theta_JA of approximately 8-12 C/W with proper thermal via array under the package exposed die-attach pad (DAP). For high-utilization designs approaching 80-90% logic element usage, junction can reach 90-100C under industrial ambient conditions. Recommend a thermal via array of 0.3 mm drilled, 0.2 mm plated, on a 1.0 mm pitch beneath the DAP, filled and capped on the top side. For very high-power designs, attach a heat spreader directly to the top of the FCBGA package using thermal interface material.
Do not mix I/O standards on the same VCCIO bank without consulting the Stratix III device handbook; some LVDS and HSTL configurations are not shareable. Unused transceiver channels must be powered down and have AC-coupling capacitors removed to minimize power and crosstalk. Configuration pins MSEL[2:0] must match the chosen configuration scheme (AS, PS, JTAG, or FPP) - mismatches leave the device unconfigured and undriven.
Informations de conformité
RoHS-compliant per 'G' suffix in MPN; lead-free terminal finish. Reach SVHC compliance presumed by authorized distributor listings. AEC-Q100 qualification not relevant for FPGA logic devices. Halogen-free status not explicitly documented in verified web data - set to unknown.
