EP3SL110F780C4N - 107.5K Logic Elements Stratix III FPGA | Intel
Référence : EP3SL110F780C4N ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1850 | $1 850,00 |
| 10 | $1700 | $17 000,00 |
| 100 | $1550 | $155 000,00 |
| 500 | $1420 | $710 000,00 |
| 1 000 | $1295 | $1 295 000,00 |
EP3SL110F780C4N Présentation
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows designers to configure digital logic, memory blocks, DSP slices, and high-speed transceivers after PCB fabrication. FPGAs sit in the broader hierarchy of digital semiconductors between ASICs and microcontrollers: they offer higher performance and parallelism than MCUs, yet retain the reprogrammability that distinguishes them from fixed-function ASICs. Stratix III devices specifically target high-end applications such as high-speed digital signal processing, high-bandwidth data path bridging, and ASIC prototyping where density, performance, and DSP throughput are paramount.
Key features of the EP3SL110F780C4N include a logic element density of 107.5K, embedded memory of approximately 4.99 Mbits distributed across M9K memory blocks, configurable I/O standards supporting LVDS, LVTTL, LVCMOS, and SSTL, up to 12 transceivers (varies by device option), dedicated DSP blocks for high-speed multiply-accumulate operations, and integrated PLLs for clock synthesis and management. The FineLine BGA-780 package uses a 1.0 mm ball pitch and supports multilayer PCB designs with controlled-impedance routing.
Architecturally, the Stratix III L family employs an adaptive logic module (ALM) topology, replacing the classical 4-input LUT architecture of prior generations. Each ALM packs eight inputs plus an embedded adder, giving 1.4x the effective logic capacity per LUT versus Stratix II. The 65 nm process with metal-layer optimization reduces dynamic power by up to 50 percent compared to the Stratix II generation, a key enabler for the Stratix III L sub-family.
Typical applications for the EP3SL110F780C4N include ASIC prototyping and emulation, high-performance digital signal processing in wireless baseband, high-speed data acquisition systems, video broadcast and imaging pipelines, military secure communications, and test and measurement instrumentation. The 488 I/Os combined with multi-gigabit transceivers make it well-suited for telecom line-card bridging between custom ASICs and backplane SERDES.
When designing with the EP3SL110F780C4N, ensure the PCB supports 1.0 mm BGA pitch fanout with microvia technology where appropriate. The 780-ball package demands 8- to 10-layer stack-up with continuous reference planes for power integrity. Use the Quartus II design software (version 13.1 or earlier; Intel provides a maintenance release path for legacy Stratix III) for place-and-route and timing closure; Altera device programming requires a JTAG or passive-serial configuration scheme.
This page synthesizes verified distributor pricing, drop-in same-family and cross-family Stratix III alternatives sharing the 780-BGA footprint, and practical FPGA design notes not consolidated in a single place by the manufacturer datasheet.
Alternatives de remplacement direct pour EP3SL110F780C4N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP3SL110F780C4N (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Operating Temperature, Process Node, Series.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP3SL110F780C2N
✅ Remplacement direct✓ En stock
$1395 / unité
Voir la fiche technique →EP3SL110F780I3N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3SL150F780C4N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
EP3SL110F780I4N
✅ Remplacement direct✓ En stock
$1145 / unité
Voir la fiche technique →EP3SL110F780C3N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP3SL110F780I4G
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
EP3SL110F780C4N Valeurs maximales et caractéristiques électriques
| Family | Stratix III L |
| Logic Elements | 107,500 |
| Logic Array Blocks (LABs) | 4,300 |
| Embedded Memory | 4,992,000 bits (4.99 Mbit) |
| User I/Os | 488 |
| Boîtier | 780-ball FCBGA (FineLine BGA) |
| Package Pitch | 1.0 mm |
| Process Node | 65 nm |
| Core Voltage | 1.1 V |
| Maximum Internal Clock Frequency | 450 MHz |
| Speed Grade | C4 (commercial, -4) |
| Operating Temperature (Commercial) | 0 °C to 85 °C |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Statut RoHS | EU RoHS Compliant with Exemption |
| Programming Interface | JTAG / Passive Serial (Quartus II) |
Guide de configuration des broches du EP3SL110F780C4N 1.0 mm
Configuration des broches du EP3SL110F780C4N (boîtier 1.0 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP3SL110F780C4N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP3SL110F780C4N convient pour 6 applications: ASIC Prototyping and Emulation, Wireless Baseband Signal Processing, High-Speed Data Acquisition Systems, Video Broadcast and Imaging Pipelines, Test and Measurement Instrumentation, Telecom Line-Card Bridging.
ASIC Prototyping and Emulation
The EP3SL110F780C4N fits ASIC prototyping because its 107,500 logic elements, 4,992 Kbits of embedded memory, and 488 user I/Os provide enough fabric to map mid-complexity ASICs (roughly 1-2 million gates) into a single device. The 780-ball FCBGA exposes dedicated configuration and JTAG pins for in-system reprogramming during iterative bring-up. Placed on a multi-FPGA prototyping board with high-speed LVDS interconnect, the C4 speed grade at 450 MHz supports realistic timing emulation. Compared to using several smaller FPGAs, a single EP3SL110 reduces partition overhead and shortens debug cycles for ASIC verification teams.
Recommandé
Wireless Baseband Signal Processing
The EP3SL110F780C4N fits wireless baseband DSP because its dedicated DSP blocks (up to 384 18x18 multipliers per the Stratix III handbook) accelerate the FIR/FFT operations at the heart of LTE and WCDMA physical-layer processing. At 450 MHz fabric speed with a C4 speed grade, real-time 20 MHz LTE uplink chains fit comfortably within the device's logic budget. The 4,992 Kbits of M9K memory provides line-buffer storage for channel estimation symbols. Power consumption is roughly 50 percent lower than the Stratix II predecessor thanks to 65 nm process tuning, making it usable in chassis-cooled base-station equipment.
Recommandé
High-Speed Data Acquisition Systems
The EP3SL110F780C4N fits high-speed data acquisition because its 488 user I/Os include LVDS pairs capable of gigabit-class serial capture from multi-channel ADCs, and the M9K memory blocks buffer acquisition bursts at line rate. At 4,992 Kbits total memory, the device can hold several milliseconds of data at 1 GSPS from a 10-bit ADC for offline post-processing. The C4 speed grade ensures setup/hold margin on source-synchronous LVDS buses. Engineers place the FPGA between the ADC and a downstream SERDES link, with a DDR2/DDR3 controller implemented in user logic for bulk capture.
Recommandé
Video Broadcast and Imaging Pipelines
The EP3SL110F780C4N fits broadcast video because its 4,992 Kbits of memory is sufficient for full-HD 1080p60 line buffers, and its 488 I/Os accept multi-channel SDI inputs (HD-SDI at 1.485 Gbps or 3G-SDI at 2.97 Gbps) with the transceiver-equipped package option. The DSP blocks accelerate color-space conversion and chroma resampling in real time. Combined with on-chip memory controllers, the FPGA bridges camera-side MIPI/Sub-LVDS to display-side HDMI, SDI, or DisplayPort. The C4 timing margin supports 148.5 MHz pixel clock operation without timing closure difficulties in most pipelines.
Recommandé
Test and Measurement Instrumentation
The EP3SL110F780C4N fits test and measurement because its 488 I/Os support wide parallel capture buses, its 4,992 Kbits memory buffers deep acquisition records, and its DSP blocks implement real-time FFTs for spectrum analysis. The C4 speed grade at 450 MHz is sufficient for 4 GSPS equivalent FFT throughput in pipelined architectures. Combined with an external high-speed ADC and DDR3 capture buffer, the FPGA becomes the heart of a digitizer, arbitrary waveform generator, or protocol analyzer. Quartus II's TimeQuest timing analyzer provides deterministic timing closure for production test sets.
Recommandé
Telecom Line-Card Bridging
The EP3SL110F780C4N fits telecom line cards because its 488 user I/Os include multi-gigabit transceiver channels that bridge between custom ASICs and the backplane SERDES fabric. The 4,992 Kbits of memory buffers packet payloads during protocol conversion (for example, Ethernet to OBSAI or CPRI). Industrial-temp variants like the EP3SL110F780I4N operate in central-office environments with -40 °C to +100 °C ranges. Combined with on-chip clock-data recovery and PLLs, the FPGA functions as a cost-effective glue layer between merchant silicon and proprietary backplane interfaces.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP3SL110F780C4N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP3SL110F780C2N | EP3SL110F780I3N | EP3SL110F780I4N | EP3SL150F780C4N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FCBGA (1.0 mm pitch) | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same | 780-ball FCBGA - same |
| Logic Elements | 107,500 | 107,500 | 107,500 | 107,500 | 149,500 |
| Embedded Memory | 4,992 Kbit | 4,992 Kbit | 4,992 Kbit | 4,992 Kbit | 6,480 Kbit |
| User I/Os | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | C4 (commercial, -4) | C2 (slower) | I3 (industrial) | I4 (industrial, C4 timing) | C4 |
| Operating Temperature | 0 °C to 85 °C (commercial) | 0 °C to 85 °C (commercial) | -40 °C to +100 °C (industrial) | -40 °C to +100 °C (industrial) | 0 °C to 85 °C (commercial) |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
Principaux différenciateurs
- Highest available speed grade in same 780-FCBGA footprint for EP3SL110 family (vs EP3SL110F780C2N)
- Higher logic density than all other EP3SL110 speed grades in same package (vs EP3SL150F780C4N)
- Commercial temperature grade matches the Stratix III L power-optimized family (vs EP3SL110F780I4N)
Notes de conception
The 780-ball FCBGA at 1.0 mm pitch requires an 8- to 10-layer PCB stack-up with microvia (laser-drilled) technology for fanout from inner balls. Per IPC-6012B Class 3 requirements for high-reliability designs, use 1-oz copper on outer layers with 0.5-oz on inner layers, and maintain continuous reference planes beneath the BGA field to control impedance for LVDS and SERDES signals. Decoupling: place 0402 0.1 µF X7R capacitors on every four VCCINT/VCCA pins with 0402 10 µF X5R bulk capacitors at the BGA perimeter; missing decoupling is a leading cause of Stratix III power-rail noise and JTAG configuration failure.
Estimated: at typical utilization (70 percent logic, 50 percent memory, 300 MHz fabric) the EP3SL110F780C4N dissipates approximately 4-7 W. The 780-FCBGA package has theta_JA around 12-15 °C/W with a 16-layer JEDEC test board (per Stratix III Device Handbook). At 7 W with theta_JA 13 °C/W, junction temperature rises 91 °C above ambient; commercial-grade parts (0-85 °C) need forced airflow at >700 LFM in sealed enclosures to maintain Tj below 100 °C. Industrial-grade EP3SL110F780I4N is the same package and can tolerate higher Tj in extended-temperature deployments.
Three common pitfalls when bringing up the EP3SL110F780C4N: (1) Configuring MSEL pins incorrectly for the desired configuration scheme (Fast Passive Parallel x8 vs x16 vs x32 differ in pull-up/pull-down settings per datasheet Table 9-4); (2) Failing to set the PORSEL pin for proper power-on reset delay causing configuration failure on slow-ramping supplies; (3) Using Quartus II versions newer than 13.1, which dropped Stratix III support - install the legacy 13.1 SP1 release from Intel's FPGA archive. Reference Altera application note AN-580 (Stratix III Configuration) for full configuration schemes. Lifecycle status is NRND; plan a migration path to Stratix V or Cyclone V for new designs.
Informations de conformité
EU RoHS compliant with exemption per Arrow/Intel product listing. AEC-Q100 not applicable - FPGAs are not automotive-qualified discrete parts; industrial temp grade (EP3SL110F780I4N) is the ruggedized option. Conflict-mineral and REACH compliance status not stated in distributor listings.