EP4CGX75DF27I8N - Cyclone IV GX FPGA, 73,920 LEs, 672-FBGA | Intel
Référence : EP4CGX75DF27I8N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $132.5 | $1 325,00 |
| 100 | $118.75 | $11 875,00 |
| 500 | $102.4 | $51 200,00 |
| 1 000 | $89.95 | $89 950,00 |
EP4CGX75DF27I8N Présentation
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, configurable interconnect, and dedicated I/O, allowing designers to implement arbitrary digital logic after PCB fabrication. Within the broader taxonomy, an FPGA belongs to programmable logic devices (PLDs) -> logic ICs -> integrated circuits. The Cyclone IV GX family specifically adds high-speed serial transceivers, making it suitable for protocols such as PCI Express Gen1, Gigabit Ethernet, and serial RapidIO.
Key features include 3.125 Gbps transceivers, 8 transceiver channels, dedicated 18x18 multipliers for DSP, and a hard memory controller. The device supports a JTAG interface for boundary-scan and configuration via Altera/Intel Quartus Prime design software. Industrial temperature grade (-40C to +100C junction) and high I/O count support applications ranging from industrial motor control to wireless baseband processing.
The Cyclone IV GX architecture combines a logic fabric with embedded transceivers, providing up to 5,136 Kbits of RAM distributed as M9K blocks and 414 Kbits as M144K blocks. Hard IP blocks include the memory controller and PCIe interface, reducing soft logic utilization. The 672-FBGA package supports high I/O density for complex system designs.
Typical applications include industrial motor control, video processing, software-defined radio, wireline and wireless communication infrastructure, automotive driver assistance, and test and measurement equipment. The integrated transceivers and PCIe support make it ideal for protocol bridging and low-cost serial connectivity. Designers should consult the Quartus Prime toolchain for configuration bitstream generation. This page synthesizes distributor pricing, drop-in package-compatible variants, and practical design considerations not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour EP4CGX75DF27I8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CGX75DF27I8N (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Process Technology, Mounting Type, Configuration Method.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EP4CGX75DF27I7N
✅ Remplacement direct✓ En stock
$58.75 / unité
Voir la fiche technique →EP4CGX75DF27C8N
✅ Remplacement direct✓ En stock
$117.11 / unité
Voir la fiche technique →EP4CGX75DF27C7N
✅ Remplacement direct✓ En stock
$96.4 / unité
Voir la fiche technique →EP4CGX75CF23I8N
✅ Remplacement direct✓ En stock
$102.4 / unité
Voir la fiche technique →EP4CGX110DF27I7N
✅ Remplacement direct✓ En stock
$198 / unité
Voir la fiche technique →EP4CGX75DF27I8N Valeurs maximales et caractéristiques électriques
| Family | Cyclone IV GX |
| Logic Elements | 73,920 |
| Total Memory Bits | 4,257,792 |
| User I/O Pins | 310 |
| Transceiver Channels | 8 |
| Max Transceiver Data Rate | 3.125 Gbps |
| Process Technology | 60 nm low-power CMOS |
| Core Voltage | 1.2 V |
| Boîtier | 672-ball FBGA (F27) |
| Température de fonctionnement | -40C to +100C (Industrial, I-suffix) |
| Hard IP | PCIe Gen1, memory controller |
| Configuration Interface | JTAG, serial, passive parallel |
Guide de configuration des broches du EP4CGX75DF27I8N 672-ball fbga (f27)
Configuration des broches du EP4CGX75DF27I8N (boîtier 672-ball fbga (f27)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4CGX75DF27I8N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4CGX75DF27I8N convient pour 6 applications: Industrial Motor Control, Video Processing and Display Bridging, Software-Defined Radio Baseband, PCIe Endpoint Card Design, Wireline Telecom Bridge and Aggregation, Test and Measurement Instrumentation.
Industrial Motor Control
The EP4CGX75DF27I8N's 73,920 logic elements, integrated 8-channel 3.125 Gbps transceivers, and industrial -40C to +100C temperature range make it ideal for high-axis-count servo drives and AC inverter control. The device can implement multiple field-oriented control (FOC) loops, sigma-delta modulator interfaces for current sensing, and encoder feedback handling in parallel. Industrial motor control designs benefit from the dedicated 18x18 multipliers enabling fast Park/Clarke transforms. Place the FPGA between the host MCU/DSP and the power-stage gate drivers, using isolated SPI interfaces to manage IGBT/MOSFET timing-critical events. Compared with microcontroller-only solutions, the Cyclone IV GX offloads the real-time control loops, freeing the processor for supervisory tasks.
Recommandé
Video Processing and Display Bridging
With 310 user I/Os, 8 dedicated transceivers, and 4,257,792 bits of embedded memory, the EP4CGX75DF27I8N handles multi-stream video bridging between HDMI, DisplayPort, LVDS, and SDI interfaces. The device supports real-time color-space conversion, scaling, and overlay generation at 1080p60 or dual 720p streams. Memory is sufficient for line buffering in pipelined video architectures. The 3.125 Gbps transceivers deliver uncompressed SDI at HD rates; LVDS pairs (up to 155 on the package) handle parallel RGB/YCbCr buses. Place the FPGA between the video source ASIC and the display panel, with DDR2 memory connected via dedicated DQS pins for frame buffering. Hard memory controllers simplify external SDRAM interfacing.
Recommandé
Software-Defined Radio Baseband
The EP4CGX75DF27I8N's 8 integrated 3.125 Gbps transceivers and 73,920 LEs are well-matched to baseband processing for software-defined radio platforms targeting sub-6 GHz wireless protocols. The device can implement digital down/up-conversion, channelization filters, FFT engines, and MAC-layer processing in parallel. The industrial temperature grade supports outdoor small-cell and picocell deployments. The hard PCIe Gen1 IP enables direct connection to host baseband processors over PCIe x1. Compared with ASIC implementations, the Cyclone IV GX allows post-deployment protocol updates - critical for evolving cellular standards. Place the FPGA between the RF front-end ADC/DAC and the host CPU, with transceivers connected to JESD204B converters or direct RF sampling ADCs.
Recommandé
PCIe Endpoint Card Design
The EP4CGX75DF27I8N's hard PCIe Gen1 IP and integrated transceivers enable direct connection to a PCIe x1 or x4 host slot without external PHY chips. The device is well-suited to industrial I/O cards, data acquisition modules, and protocol analyzer endpoints. 73,920 LEs are sufficient for typical endpoint designs with DMA engines, scatter-gather logic, and user I/O handling. Industrial temperature grading allows use in uncontrolled chassis. Place the FPGA on a PCIe card with the device's PCIe hard IP connected to the slot edge fingers, and use remaining user I/Os for the application's external interfaces. Compared with PCIe bridge chips, the FPGA allows custom protocol implementation and register-level optimization.
Recommandé
Wireline Telecom Bridge and Aggregation
With 8 transceivers and abundant logic, the EP4CGX75DF27I8N implements multi-protocol wireline bridges including GbE, SGMII, serial RapidIO, and proprietary serial links. The device supports line-card aggregation, framer/mapper functions, and TDM-to-packet conversion in carrier-grade equipment. Hard memory controllers simplify connection to RLDRAM or DDR2 for packet buffering. The industrial temperature grade and high I/O count make it appropriate for central-office line cards. Place the FPGA between the network processor ASIC and the SFP/QSFP cages, with transceivers handling the SERDES lanes. Compared with dedicated ASSPs, the FPGA supports multiple protocols on the same hardware platform.
Recommandé
Test and Measurement Instrumentation
The EP4CGX75DF27I8N delivers the DSP horsepower and high-speed serial bandwidth required for protocol analyzers, logic analyzers, and bit-error-rate testers. 18x18 hardware multipliers accelerate FFT and PRBS generation/checking in real time. The 3.125 Gbps transceivers support testing of PCIe, GbE, SATA, and custom serial protocols up to 3 Gbps. Industrial temperature grading enables portable and field-instrument deployment. Place the FPGA as the central timing and signal-processing element, with transceivers connected to the DUT probe interface and parallel I/Os driving the front-panel display. Compared with DSP-only solutions, the FPGA allows real-time triggering and statistics with deterministic latency.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EP4CGX75DF27I8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EP4CGX75DF27I7N | EP4CGX75DF27C8N | EP4CGX75DF27C7N | EP4CGX75CF23I8N | EP4CGX110DF27I7N |
|---|---|---|---|---|---|---|
| Package | 672-FBGA (F27) | 672-FBGA (F27) - same | 672-FBGA (F27) - same | 672-FBGA (F27) - same | 672-FBGA (F23) - different ball map | 672-FBGA (F27) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 73,920 | 73,920 | 73,920 | 73,920 | 73,920 | 109,560 |
| Transceiver Channels | 8 | 8 | 8 | 8 | 8 | 8 |
| Speed Grade | 8 | 7 | 8 | 7 | 8 | 7 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Process Technology | 60 nm | 60 nm | 60 nm | 60 nm | 60 nm | 60 nm |
| Transceiver Data Rate (max) | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
Principaux différenciateurs
- Fastest speed grade in F27 footprint (vs EP4CGX75DF27I7N)
- Industrial temperature range for harsh environments (vs EP4CGX75DF27C8N)
- Highest LE density within F27 footprint (vs EP4CGX110DF27I7N (smaller variant))
Notes de conception
The 672-ball F27 FBGA package requires a high-density PCB stack-up with microvias and controlled-impedance routing for SERDES lanes. Use Intel/Altera's Cyclone IV GX pin connection guidelines: each transceiver channel needs precise 100-ohm differential routing and DC-blocking capacitors on the TX/RX pairs. Decoupling: place 100nF capacitors within 100 mils of every power pin and 10uF bulk capacitors near each power island. PCIe hard IP requires specific REFCLK routing and a 100 MHz reference clock source with sub-300 ppm accuracy.
Estimated: at typical industrial motor-control utilization of 50,000 LEs at 200 MHz toggling, the EP4CGX75DF27I8N dissipates approximately 2-3 W. The 672-FBGA package requires a thermal pad or thermal vias to an internal copper pour; with proper layout, theta_JA can reach 15-20 C/W, keeping Tj below 85°C at room ambient. Without thermal vias, junction temperature may rise above the industrial max, derating performance. Use a thermal camera or on-chip temperature diode for verification during bring-up.
Cyclone IV GX configuration requires careful attention to MSEL pin strapping for the correct configuration mode (AS, PS, JTAG). Wrong MSEL values cause configuration failure. The device also requires proper power sequencing: 1.2 V core must ramp before 2.5 V/3.3 V I/O banks, or the I/Os may back-power the core. Always use the Altera/Intel Quartus Prime Pin Planner to verify pin assignments, especially for transceiver channel placement (GXBN pins) which have dedicated locations and cannot be reassigned arbitrarily.
For 3.125 Gbps transceiver operation, follow Intel's Cyclone IV GX Transceiver User Guide for board design. Maintain 100-ohm differential impedance on TX/RX pairs with intra-pair skew below 1 ps and AC-coupling capacitors placed symmetrically. Use a continuous reference plane beneath the SERDES lanes; avoid routing over power-plane splits. For PCIe Gen1 operation, ensure REFCLK meets PCIe CEM specification (300 ppm accuracy, -8 dBm to -16 dBm amplitude). Use IBIS-AMI models for channel simulation during design sign-off.
Informations de conformité
Lead-free and RoHS compliance should be confirmed from the manufacturer product page; industrial-grade Intel/Altera FPGAs are typically RoHS compliant but exact compliance docs vary by OPN. Not AEC-Q100 qualified - this part is industrial-grade (-40C to +100C), not automotive-grade.