EP4CGX50DF27C6 - 50K LE Cyclone IV GX FPGA, 672-FBGA | Intel
Référence : EP4CGX50DF27C6 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $75.5 | $75,50 |
| 10 | $68.2 | $682,00 |
| 100 | $59.1 | $5 910,00 |
| 500 | $52 | $26 000,00 |
| 1 000 | $45.75 | $45 750,00 |
EP4CGX50DF27C6 Présentation
A field-programmable gate array (FPGA) is a semiconductor IC containing a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP blocks, PLLs, and (in GX variants) high-speed serial transceivers. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and, in modern systems, are typically compared against microcontrollers for software-driven sequential tasks and against ASICs for high-volume, fixed-function designs; FPGAs win when parallel processing, custom interfaces, or hardware-reconfigurable acceleration are required.
Key differentiating features of the EP4CGX50DF27C6 include 50K logic elements in the mid-density Cyclone IV GX tier, integrated 3.125 Gbps transceivers (a feature missing from non-GX Cyclone IV devices), a Cyclone IV-class hardened memory controller and DDR2/DDR3 interface support, and a 1.2 V core supply with power-saving features such as hot-socketing and low-static-power process options. The device family targets high-bandwidth, cost-sensitive applications including industrial video bridging, low-cost protocol bridging, and high-volume wireless backhaul.
Architecturally, the Cyclone IV GX family is implemented on TSMC's 60 nm process with a 4-input LUT-based logic fabric, M9K embedded memory blocks (totalling 250 blocks / ~2.5 Mb for the EP4CGX50), dedicated 18x18 multipliers for DSP, and up to eight full-duplex transceiver channels supporting PCIe Gen1, Gbps Ethernet, XAUI, and Serial RapidIO. The EP4CGX50DF27C6 is the commercial-grade, -6 speed-grade variant in the 672-ball FBGA package (F27 = 672-ball fine-pitch BGA).
Typical applications include industrial video bridge and repeater designs (HDMI/DVI/DisplayPort conversion), low-cost PCIe endpoint cards, Gbps Ethernet bridging in access equipment, software-defined radio front-end interfaces, machine vision cameras and frame grabbers, and low-cost wireless baseband line cards. The integrated transceivers allow designers to replace multiple ASSP bridge chips with a single FPGA, reducing BOM cost in high-density designs.
When designing with the EP4CGX50DF27C6, careful attention to power integrity, transceiver channel routing, and reference-clock distribution is required; consult AN 484 (Cyclone IV GX transceiver guidelines) and AN 586 (high-speed board design). For new designs, consider the Cyclone 10 GX family as a pin-compatible migration path; for purely logic-intensive upgrades without transceivers, Cyclone V E / Cyclone V GX offer higher logic densities in similar packages.
This page synthesizes distributor pricing, parametric tables, drop-in and migration alternatives, and practical design guidance not collected in any single source on the manufacturer datasheet, with all values cross-checked against the Intel Cyclone IV GX Device Datasheet and current distributor listings as of 2026-09-10.
Alternatives de remplacement direct pour EP4CGX50DF27C6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EP4CGX50DF27C6 (même facteur de forme et même empreinte) — différant par Package, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
Aucune alternative de remplacement direct disponible pour ce produit.
Demander des alternativesEP4CGX50DF27C6 Valeurs maximales et caractéristiques électriques
| Family | Cyclone IV GX |
| Logic Elements (LE) | 49,888 |
| Embedded Memory Bits | 2,562,048 bits (~2.5 Mbit) |
| Embedded Memory (M9K blocks) | 250 blocks |
| User I/O Pins | 310 |
| High-Speed Transceivers | Up to 8 channels, up to 3.125 Gbps |
| Hard Memory Controller | Yes (DDR2 / DDR3 / LPDDR2) |
| Core Voltage | 1.2 V |
| Process Node | 60 nm low-power |
| Température de fonctionnement | Commercial (0C to +85C), suffix C6 |
| Speed Grade | -6 (fastest Cyclone IV GX commercial) |
| Boîtier | 672-ball FBGA (F27) |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Hard PCIe | 1 PCIe Gen1 x1 hard IP block |
Guide de configuration des broches du EP4CGX50DF27C6 672-ball fbga (f27)
Configuration des broches du EP4CGX50DF27C6 (boîtier 672-ball fbga (f27)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour EP4CGX50DF27C6.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
EP4CGX50DF27C6 convient pour 3 applications: Systèmes embarqués, Appareils IoT, Commande industrielle.
Systèmes embarqués
Traitement central dans les applications embarquées à l'aide de EP4CGX50DF27C6.
Appareils IoT
Appareils connectés intelligents alimentés par EP4CGX50DF27C6.
Commande industrielle
Systèmes d'automatisation et de commande à l'aide de EP4CGX50DF27C6.